System Bits: Oct. 11


Carbon Is So 2015 Researchers at MIT have created a supercapacitor that relies on a material other than carbon. This new class of materials, called metal-organic frameworks (MOFs), are a porous and sponge-like, according to MIT, tthereby providing a much larger surface area than carbon. As with most things electrical, more surface area is essential for superconductors. The problem the re... » read more

Power/Performance Bits: May 24


Reducing MRAM chip area Researchers from Tohoku University developed a technology to stack magnetic tunnel junctions (MTJ) directly on the via without causing deterioration to its electric/magnetic characteristics. The team focused on reducing the memory cell area of spin-transfer torque magnetic random access memory (STT-MRAM) in order to lower manufacturing costs, making them more compe... » read more

Atomic Layer Etch Finally Emerges


The migration towards finFETs and other devices at the 20nm node and beyond will require a new array of chip-manufacturing technologies. Multiple patterning, hybrid metrology and newfangled interconnect schemes are just a few of the technologies required for future scaling. In addition, the industry also will require new techniques that can process structures at the atomic level. For example... » read more