Research Bits: April 16


Tunable thermal conductivity in memristors Researchers from the Center for Research in Biological Chemistry and Molecular Materials (CiQUS) and Forschungszentrum Juelich discovered that oxide-based memristive devices can demonstrate tunable thermal conductivity. Alongside the memristor's electrical resistive switching, a thermal resistive switching effect also occurs at the metal-oxide inte... » read more

Using Palladium To Address Contact Issues Of Buried Oxide Thin Film Transistors


A new technical paper titled "Approach to Low Contact Resistance Formation on Buried Interface in Oxide Thin-Film Transistors: Utilization of Palladium-Mediated Hydrogen Pathway" was published by researchers at Tokyo Institute of Technology and National Institute for Materials Science (NIMS). Abstract "Amorphous oxide semiconductors (AOSs) with low off-currents and processing temperatures... » read more

Chip Industry Technical Paper Roundup: Mar. 19


New technical papers recently added to Semiconductor Engineering’s library. [table id=206 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

Suppressing Power Side-Channel Attacks: A HW/SW Design For Resource-Constrained IoT Devices


A technical paper titled “Hardware/Software Cooperative Design Against Power Side-Channel Attacks on IoT Devices” was published by researchers at Tokyo Institute of Technology and the University of Electro-Communications. Abstract: "With the growth of Internet of Things (IoT) era, the protection of secret information on IoT devices is becoming increasingly important. For IoT devices, atta... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Research Bits: August 29


Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Chip Industry’s Technical Paper Roundup: June 20


New technical papers added to Semiconductor Engineering’s library this week. [table id=112 /] » read more

Metallic Behaviour of Semiconducting Colloidal Quantum Dots (RIKEN, Others)


A technical paper titled “Enabling metallic behaviour in two-dimensional superlattice of semiconductor colloidal quantum dots” was published by researchers at RIKEN Center for Emergent Matter Science (CEMS), Tokyo Institute of Technology, RIKEN SPring-8 Center, The University of Tokyo, and Tokyo University of Agriculture and Technology. Abstract "Semiconducting colloidal quantum dots ... » read more

Research Bits: Feb. 6


Pillars for chiplet integration Researchers from the Tokyo Institute of Technology proposed a new chiplet integration technology called Pillar-Suspended Bridge (PSB), which they say is a simpler method of chip-to-chip connection compared to silicon interposers and redistribution layers. In the PSB, only a pillar-shaped metal structure called a "MicroPillar" is interposed at the connection b... » read more

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