Manufacturing Bits: Jan. 13


Pop-up 3D printing Northwestern University and the University of Illinois at Urbana-Champaign have developed a new “pop-up” printing technique to make 3D structures down to 100nm. The technique has advantages over today’s 3D printing, which is creating a lot of buzz, if not hype, in the market. Researchers from Northwestern and Illinois devised a printing technique that mimics the act... » read more

Manufacturing Bits: Dec. 23


Higgs boson sensors At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, CERN described the tiny hybrid pixel detectors used at the Large Hadron Collider (LHC). Using CMOS technology, hybrid pixel detectors identify and tag individual sub-atomic particles at fast speeds. CERN, the European Organization for Nuclear Research, is a particle physics laboratory... » read more

Manufacturing Bits: Oct. 7


Europe’s TFET project A new European project has revealed more details about its plans to develop a next-generation chip technology called tunnel field-effect transistors (TFETs). EPFL is coordinating this new European research project, dubbed E2SWITCH. The project also includes IBM, Forschungszentrum Jülich, the University of Lund, ETHZ, Imec, CCS, SCIPROM and IUNET. The project has be... » read more

Manufacturing Bits: May 13


Telling a FIB The National Institute of Standards and Technology (NIST) has built the first low-energy focused ion beam (FIB) microscope that uses a lithium ion source. Still in the R&D stage, the FIB microscope from NIST could be used to examine adjacent materials that are chemically different and identify the elements that make them up. The FIB microscope uses an ion source based on p... » read more