More EUV Mask Gaps


Extreme ultraviolet (EUV) lithography is at a critical juncture. After several delays and glitches, [gettech id="31045" comment="EUV"] is now targeted for 7nm and/or 5nm. But there are still a number of technologies that must come together before EUV is inserted into mass production. And if the pieces don’t fall into place, EUV could slip again. First, the EUV source must generate more ... » read more

The Week In Review: Design


M&A Lattice Semiconductor is set for a buyout by private equity fund Canyon Bridge at a price of $1.3 billion, or $8.30 per share. Lattice will operate as a standalone subsidiary and does not expect any changes in operations or management. The deal is expected to close in early 2017. Earlier this week, Lattice announced a low power, small form factor FPGA for 5G SERDES applications. The ... » read more

Securing The IoT


Last week’s massive distributed denial-of-service attack, directed at Dyn DNS—a small New Hampshire-based company that operates part of the Internet’s Domain Name System—brought many popular websites to a crawl. Among those affected were such giants as Airbnb, Reddit, Twitter, Amazon and Netflix. The Internet outages spread from the East Coast of the United States to the rest of the ... » read more

The Week In Review: Design


Tools Real Intent updated its Ascent Lint product, adding 50 new customer-driven rules, improved support of VHDL and System Verilog, and a new database-driven debugger with an integrated source browser and improved schematic visualization. IP ARM launched a new real-time processor with advanced safety features for autonomous vehicles and medical and industrial robots. The processor, Co... » read more

The Week In Review: Design


IP Sonics unveiled Energy Processing Unit (EPU) IP, based on the company's ICE-Grain power architecture, to better manage and control circuit idle time. The IP facilitates design of SoC power architecture and implementation and verification of the resulting power management subsystem. Synopsys debuted ARC SEM security processors with timing and power randomization features to protect agai... » read more

The Week In Review: Manufacturing


Market research Worldwide semiconductor capital spending is projected to decline 0.7% in 2016, to $64.3 billion, according to Gartner. This is up from the estimated 2% decline in Gartner's previous quarterly forecast. "Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This ... » read more

The Week In Review: Manufacturing


Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

The Week In Review: Design


Tools Synopsys unveiled its next-generation ATPG and diagnostics solution, TetraMAX II. According to the company, the tool is an order of magnitude faster than the previous generation, reducing runtime from days to hours, as well as generating 25% fewer patterns. The new tool is also certified for the ISO 26262 automotive functional safety standard. It has been deployed by STMicroelectronics... » read more

The Week In Review: Manufacturing


Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

How To Make 3D NAND


In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

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