7nm Design Success Starts With Multi-Domain Multi-Physics Analysis


Companies can benefit from advancements in the latest semiconductor process technology by delivering smaller, faster and lower power products, especially for those servicing mobile, high performance computing and automotive ADAS applications. By using 7nm processes, design teams are able to add a lot more functionality onto a single chip and lower the power consumption by scaling operating volt... » read more

Multi-Patterning Issues At 7nm, 5nm


Continuing to rely on 193nm immersion lithography with multiple patterning is becoming much more difficult at 7nm and 5nm. With the help of various resolution enhancement techniques, optical lithography using a deep ultraviolet excimer laser has been the workhorse patterning technology in the fab since the early 1980s. It is so closely tied with the continuation of [getkc id="74" comment="Mo... » read more

The Week In Review: Manufacturing


Chipmakers Next month, GlobalFoundries will host a job fair in Portland, Ore., according to reports. The company hopes to hire former Intel workers. These are workers who lost their jobs as part of Intel's recent layoff. Anokiwave, a developer of chips for the mmWave market, has announced a foundry alliance with GlobalFoundries. GlobalFoundries will make so-called Silicon Core chips on a f... » read more

The Week In Review: Design


M&A Siemens plans to buy Mentor Graphics for $4.5 billion in cash. The move, if approved by regulators, would greatly expand Siemens’ capabilities in multi-physics design and embedded software for everything from semiconductors to automotive wiring harnesses. The transaction is expected to close in the second quarter of 2017. Tools Mentor Graphics uncorked a new product to measur... » read more

More EUV Mask Gaps


Extreme ultraviolet (EUV) lithography is at a critical juncture. After several delays and glitches, [gettech id="31045" comment="EUV"] is now targeted for 7nm and/or 5nm. But there are still a number of technologies that must come together before EUV is inserted into mass production. And if the pieces don’t fall into place, EUV could slip again. First, the EUV source must generate more ... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Why EUV Is So Difficult


For years, extreme ultraviolet (EUV) lithography has been a promising technology that was supposed to help enable advanced chip scaling. But after years of R&D, EUV is still not in production despite major backing from the industry, vast resources and billions of dollars in funding. More recently, though, [gettech id="31045" comment="EUV"] lithography appears to be inching closer to pos... » read more

GaN Power Semi Biz Heats Up


The market for devices based on gallium nitride (GaN) technology is heating up amid the push for faster and more power efficient systems. Today, [getkc id="217" kc_name="GaN"] is widely used in the production of LEDs. In addition, it is gaining steam in the radio-frequency (RF) market. And the GaN-based power semiconductor market finally appears ready to take off, after several false starts ... » read more

The Week In Review: Manufacturing


Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

How Many Nanometers?


What’s the difference between a 10nm and a 7nm chip? That should be a straightforward question. Math, after all, is the only pure science. But as it turns out, the answer is hardly science—even if it is all about numbers. Put in perspective, at 65nm, companies defined the process node by the half pitch of the first metal layer. At 40/45nm, with the cost and difficulty of developing n... » read more

← Older posts