Manufacturing Bits: Aug. 1


Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

System Bits: Nov. 1


There is a lurking malice in cloud hosting services A team of researchers from the Georgia Institute of Technology, Indiana University Bloomington, and the University of California Santa Barbara has found — as part of a study of 20 major cloud hosting services — that as many as 10 percent of the repositories hosted by them had been compromised, with several hundred of the ‘buckets’ act... » read more

Advanced Packaging Options, Issues


Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more