Manufacturing Bits: Aug. 24


Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Manufacturing Bits: Dec. 1


European R&D hub A new European hub for semiconductor R&D is open for business. The hub is part of an EU-funded program called ASCENT or Access to European Nanoelectronics Network. The program is aimed to give researchers access to chip and related technologies within three European R&D organizations--CEA-Leti, Imec and the Tyndall National Institute. As reported, ASCENT was originally f... » read more

Manufacturing Bits: June 16


Harmonic EUV The U.S. Department of Energy’s Lawrence Berkeley National Laboratory has devised an efficient extreme ultraviolet (EUV) source. The technology could one day be used for a new class of metrology tools, based on angle-resolved photoemission spectroscopy (ARPES). This technique makes use of a photoelectric effect for studying materials. To enable the source, Berkeley Labs devel... » read more

Manufacturing Bits: April 7


Liquid metal for Terminator robots The Chinese Academy of Sciences and Tsinghua University have devised a robot-like, self-fueled liquid metal mollusk. The liquid metal alloy within the system can move by itself and change form like the shape-shifting T-1000 robot in the movie Terminator 2: Judgment Day. The system consists of a liquid metal motor. The liquid metal is a mix of gallium, i... » read more

Manufacturing Bits: Feb. 11


Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more