The Growing Materials Challenge


By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

System Bits: April 17


Smartphone microscopes transformed into lab-grade devices with deep learning UCLA Samueli School of Engineering researchers have demonstrated that deep learning techniques can discern and enhance microscopic details in photos taken by smartphones in order to improve the resolution and color details of smartphone images so much that they approach the quality of images from laboratory-grade mic... » read more

Manufacturing Bits: April 3


World's brightest accelerator Japan’s High Energy Accelerator Research Organization (KEK) is readying what is considered the world’s most luminous or brightest particle accelerator. The system, dubbed the SuperKEKB, combines an electron-positron collider with a new and advanced detector. The storage ring system is designed to explore and measure rare decays of elementary particles, such... » read more

System Bits: Dec. 12


Increasing performance scaling with packageless processors Demand for increasing performance is far outpacing the capability of traditional methods for performance scaling. Disruptive solutions are needed to advance beyond incremental improvements. Traditionally, processors reside inside packages to enable PCB-based integration. However, a team of researchers from the Department of Electrical ... » read more

Get Ready For In-Mold Electronics


Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

Manufacturing Bits: Aug. 15


Self-collapse lithography The University of California at Los Angeles (UCLA) has developed a technology called self-collapse lithography. The technology, reported in the journal Nano Letters, resembles the combination of nanoimprint, selective removal and a chemical lift-off process. More specifically, though, the technology provides insights into patterning using a chemical lift-off lith... » read more

System Bits: Aug. 1


Quantum Computing Takes A Step Forward UCLA physicists have developed a technique for measuring and controlling the energy differences of electron valley states in silicon quantum dots, which they view as a key component of quantum computing. Joshua Schoenfield, a UCLA graduate student and one of the paper's authors, explained that "an individual qubit can exist in a complex wave-like m... » read more

Power/Performance Bits: May 23


Biosupercapacitor Researchers from UCLA and the University of Connecticut designed a biological supercapacitor, a new biofriendly energy storage system which operates using ions from fluids in the human body. The device is harmless to the body's biological systems, say the researchers, and could lead to longer-lasting cardiac pacemakers and other implantable medical devices. The supercapa... » read more

System Bits: Dec. 6


Teaching computers to read A multidisciplinary team of UCLA researchers has built a computational model that reflects how humans think and communicate, by designing an algorithm that examined nearly two million posts from popular parenting websites, thereby teaching computers to understand structured narratives within the flow of posts on the internet. Managing large-scale data in this way ... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

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