System Bits: Sept. 27

Memory management scheme accommodates commercial chips In an improvement to a memory management scheme presented last year in which MIT Computer Science and Artificial Intelligence Laboratory researchers unveiled what they said was a fundamentally new way of managing memory on computer chips — one that would use circuit space much more efficiently as chips continue to comprise more and more... » read more

System Bits: Aug. 23

Monitor side-channel signals for IoT device security Thanks to a Defense Advanced Research Projects Agency (DARPA) grant, Georgia Tech researchers are working to develop a new technique for wirelessly monitoring IoT devices for malicious software – without affecting the operation of the ubiquitous, and low-power equipment. The team said the technique will rely on receiving and analyzing s... » read more

System Bits: July 5

Computer vision for automated data collection Stanford University researchers have developed a computer vision system that automates the collection of data about the elements in buildings in order to streamline the remodeling or refurbishment of existing buildings, which can be fraught with delays and cost overruns due to hidden problems. Renovation projects live and die by the quality of i... » read more

System Bits: May 17

AI drives Toyota websites An innovation in artificial intelligence described in a 2001 paper by UCLA computer science professor Adnan Darwiche has found a somewhat unexpected application: helping car buyers of Toyota and Lexus customize their vehicles online. The websites let shoppers tailor their vehicle from among a range of models, colors and accessories. The software that powers the sit... » read more

Keeping The Whole Package Cool

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

System Bits: April 19

Debugging web apps MIT researchers reported that they’ve developed a system that can quickly comb through tens of thousands of lines of application code to find security flaws by exploiting some peculiarities of the Ruby on Rails web programming framework. The team said that in tests on 50 popular web applications written using Ruby on Rails, the system found 23 previously undiagnosed sec... » read more

System Bits: March 1

Current generation silicon wafer While the single-crystal silicon wafer changed the nature of communication 60 years ago, a group of Cornell researchers is now hoping its work with quantum dot solids can usher in a new era in electronics. In what could be the first step toward discovering and developing artificial materials with controllable electronic structure, the team has fashioned 2D s... » read more

System Bits: Jan. 26

Precisely controlling graphene molecules Researchers at UCLA’s California NanoSystems Institute have found that in the same way gardeners may use sheets of plastic with strategically placed holes to allow plants to grow but keep weeds from taking root, the same basic approach can be applied in terms of placing molecules in the specific patterns they need within tiny nanoelectronic devices, w... » read more

Why Use A Package?

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

Power/Performance Bits: Jan. 5

A foggy consortium Scientists at Princeton University, ARM, Cisco, Dell, Intel, and Microsoft formed a global effort to develop architectures and tools to further "fog computing" and networks, which aim to harness connected devices' own computing, sensing and storage power to form edge networks that meet most of the demand of user devices that are at the periphery of a more centralized netwo... » read more

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