Research Bits: October 3


Growing indium selenide at scale Researchers from the University of Pennsylvania, Brookhaven National Laboratory, and the Air Force Research Laboratory grew the 2D semiconductor indium selenide (InSe) on a full-size, industrial-scale wafer. It can also be deposited at temperatures low enough to integrate with a silicon chip. The team noted that producing large enough films of InSe has prove... » read more

Chip Industry’s Technical Paper Roundup: August 22


New technical papers added to Semiconductor Engineering’s library this week. [table id=129 /]   More Reading Technical Paper Library home » read more

High-Performance P-Type FET Arrays With Single-Crystal 2D Semiconductors And Fermi-Level-Tuned vdW Contact Electrodes


A technical paper titled “Fabrication of p-type 2D single-crystalline transistor arrays with Fermi-level-tuned van der Waals semimetal electrodes” was published by researchers at Ulsan National Institute of Science and Technology (UNIST), University of Pennsylvania, Institute for Basic Science (IBS), Sogang University, and Changwon National University. Abstract: "High-performance p-type t... » read more

Technical Paper Round-Up: March 29


Improving batteries, ultra low-power photonic edge computing, SLAM, Tellurium for 2D semiconductors, and reservoir computing top the past week's technical papers. The focus on energy is critical as the edge buildout continues and more devices are connected to a battery, while research into new architectures and materials that will continue scaling and improve performance per watt continue at th... » read more

Flat-surface-assisted and self-regulated oxidation resistance of Cu(111)


Abstract "Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications. This has prompted numerous studies exploring copper oxidation and possible passivation strategies. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu2O growth occurs on flat surfaces as a ... » read more

Power/Performance Bits: April 14


Undoped polymer ink Researchers at Linköping University, Chalmers University of Technology, University of Washington, University of Cologne, Chiba University, and Yunnan University developed an organic ink for printable electronics that doesn't need to be doped for good conductivity. "We normally dope our organic polymers to improve their conductivity and the device performance. The proces... » read more

Power/Performance Bits: June 18


Multi-value logic transistor Researchers at the University of Texas at Dallas, Hanyang University, Gwangju Institute of Science and Technology, Yonsei University, Kookmin University, and Ulsan National Institute of Science and Technology developed and fabricated a transistor capable of storing intermediate values between 0 and 1. Such a multi-value logic transistor would allow more operations ... » read more

Power/Performance Bits: Nov. 6


Camera for object recognition Researchers from the University of Illinois at Urbana-Champaign developed a new camera that could improve object detection in vehicles. Inspired by the visual system of mantis shrimp, the camera detects the polarization of light and has a dynamic range about 10,000 times higher than today's commercial cameras. "In a recent crash involving a self-driving car, th... » read more

Power/Performance Bits: Oct. 2


Photonic sensor Researchers at Washington University in St. Louis devised a way to record environmental data using a wireless photonic sensor resonator with a whispering-gallery-mode (WGM) architecture capable of resonating at light frequencies and also at vibrational or mechanical frequencies. Optical sensors are not affected by electromagnetic interference, a major benefit in noisy or har... » read more

Power/Performance Bits: Sept. 25


Heat transfer in 2D materials Engineers at the University of Illinois developed a way to reduce overheating in nanoelectronics that incorporate 2D components by adding another layer to the structure. "In the field of nanoelectronics, the poor heat dissipation of 2D materials has been a bottleneck to fully realizing their potential in enabling the manufacture of ever-smaller electronics whil... » read more

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