Mark Bohr opens up on the company’s push into multi-chip solutions, and upcoming issues at 7nm and 5nm.

High price of moving to finFETs pushes foundries to offer a less expensive alternative.

Technology begins to twist in different directions and for different markets.

Part 2: Heterogeneity and architectures become focus as scaling benefits shrink; IP availability may be problematic.

Demand is up, capacity is flat. A look at what’s behind this imbalance.

Chip industry repositions as technology begins to take shape; no clear winners yet.

As the market for artificial intelligence heats up, so does confusion about how to build these systems.

Technology begins to twist in different directions and for different markets.

Part 2: Heterogeneity and architectures become focus as scaling benefits shrink; IP availability may be problematic.

Andes IPO; automotive physical IP; energy processing unit; PCIe with AXI bridge; certifications and IP for TSMC 7, 12nm.

Experts at the table, part 1: What the toolchain looks like today and the different mindsets within those flows.

Adding more dimensions creates more data, all of which needs to be processed using new architectural approaches.

These devices are gaining in popularity for more critical functions as chip and system designs become more heterogeneous.