System Bits: Oct. 31


Software enables cars to auto-report diagnostics Thanks to researchers at MIT, it may soon be possible to hop into a ride-share car, glance at a smartphone app, and tell the driver that the car’s left front tire needs air, its air filter should be replaced next week, and its engine needs two new spark plugs. [caption id="attachment_409967" align="alignnone" width="300"] A new smartphone a... » read more

Manufacturing Bits: Aug. 1


Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

Manufacturing Bits: March 8


5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

Manufacturing Bits: Feb. 11


Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more