Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Research Bits: Jan. 23

By Jesse Allen - 23 Jan, 2024 - Comments: 0

Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Chip Industry’s Technical Paper Roundup: Dec 11

By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

Small-Footprint Engineered Scattering Elements For Polarization Monitoring Of Photonic ICs

By Technical Paper Link - 05 Dec, 2023 - Comments: 0

A technical paper titled “Engineered scattering elements used as optical test points in photonic integrated circuits” was published by researchers at University of Rochester. Abstract: "Efficient packaging of fabricated photonic integrated circuits (PICs) has been a daunting task given the breadth of applications and skill required for scalable manufacturing. One particular challenge has ... » read more

Research Bits: Aug. 30

By Jesse Allen - 30 Aug, 2022 - Comments: 0

Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more

Technical Paper Round-Up: March 22

By Linda Christensen - 22 Mar, 2022 - Comments: 0

New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

Enhanced on-chip phase measurement by inverse weak value amplification

By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract: "Optical interferometry plays an essential role in precision metrology such as in gravitational wave detection, gyroscopes, and environmental sensing. Weak value amplification enables reaching the shot-noise-limit of sensitivity, which is difficult for most optical sensors, by amplifying the interferometric signal without amplifying certain technical noises. We implement a generali... » read more

Research Bits: March 15

By Jesse Allen - 15 Mar, 2022 - Comments: 0

Interferometer on chip Researchers at the University of Rochester developed an optical interferometer on a 2mm by 2mm integrated photonic chip that is capable of amplifying interferometric signals without a corresponding increase in extraneous noise. Interferometers merge two or more sources of light to create interference patterns that provide information able what they illuminate. “If y... » read more

TimeCache: Using Time to Eliminate Cache Side Channels when Sharing Software

By Technical Paper Link - 14 Jun, 2021 - Comments: 0

"Abstract—Timing side channels have been used to extract cryptographic keys and sensitive documents even from trusted enclaves. Specifically, cache side channels created by reuse of shared code or data in the memory hierarchy have been exploited by several known attacks, e.g., evict+reload for recovering an RSA key and Spectre variants for leaking speculatively loaded data. In this paper, we ... » read more

Manufacturing Bits: Feb. 8

By Mark LaPedus - 08 Feb, 2021 - Comments: 0

Metalens for AR/VR The Harvard John A. Paulson School of Engineering and Applied Sciences has developed a new lens technology for use in next-generation virtual and augmented reality systems. Researchers have developed a so-called metalens technology. The two-millimeter achromatic metalens is capable of focusing the RGB (red, green, blue) colors at once without any aberrations. Today, s... » read more

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