Stacked Die Changes


Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

System Bits: Sept. 6


How might AI affect urban life in 2030? In an ongoing project hosted by Stanford University to inform societal deliberation and provide guidance on the ethical development of smart software, sensors and machines, a panel of academic and industrial thinkers has looked ahead to 2030 to forecast how advances in artificial intelligence (AI) might affect life in a typical North American city. Th... » read more

Power/Performance Bits: Aug. 30


Scalable data center chip Princeton University researchers designed a new scalable chip specifically for data centers and massive computing systems. The team believes the chip, called Piton, can substantially increase processing speed while slashing energy needs. The chip architecture is scalable; designs can be built that go from a dozen cores to several thousand. Also, the architecture ... » read more

System Bits: Feb. 10


Mapping temperature Given that overheating is a major problem for chips today a team of UCLA and USC scientists have made a breakthrough that they believe should enable engineers to design microprocessors that minimize that problem with a thermal imaging technique that can see how the temperature changes from point to point inside the smallest electronic circuits. The technique is called pl... » read more

Power/Performance Bits: Nov. 18


A lighter, cheaper radio wave device Researchers at The University of Texas at Austin reported that they have achieved a milestone in modern wireless and cellular telecommunications through the creation of a radically smaller, more efficient radio wave circulator that could be used in cellphones and other wireless devices. The researchers said the circulator has the potential to double the ... » read more

Disruptive R&D


Leading university researchers presented their most promising technologies — describing developments ranging from sustainable metal cluster technology (that’s already spawned three notable startups) to resonance-based detection for more accurate MEMS devices — at the new Breakthrough Research Technologies session and the Silicon Innovation Forum at SEMICON West 2014. OSU metal cluster... » read more

Power/Performance Bits: July 8


In an advance that could one day enable the miniaturization of laser systems, researchers at the University of Texas at Austin and the Technical University of Munich have developed a new nonlinear metasurface, or meta mirror. The researchers call their invention a “nonlinear mirror,” which they believe could help advance nonlinear laser systems that are used for chemical sensing, explosi... » read more

Power/Performance Bits: April 1


Heat-conducting polymer Polymer materials are usually thermal insulators but according to a team researchers including the Georgia Institute of Technology, University of Texas at Austin, and the Raytheon Company, by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, they’ve developed a thermal interface material able to conduct heat 20 times better t... » read more