Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Susan Rambo UMC and Intel will collaborate on the development of a 12nm semiconductor process platform to address high-growth markets, such as mobile, communications infrastructure, and networking. Apple reportedly pushed back the launch date of its long-awaited electric vehicle and scaled back the self-driving features to L2 driver assistance, according ... » read more

Chip Industry’s Technical Paper Roundup: October 31


New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

Measurement-Induced Quantum Information Phases On Up To 70 Superconducting Qubits (Google/Stanford)


A technical paper titled “Measurement-induced entanglement and teleportation on a noisy quantum processor” was published by researchers at Google Quantum AI, Google Research, Stanford University, University of Texas at Austin, Cornell University, University of Massachusetts, University of Connecticut, Auburn University, University of Technology Sydney, University of California, and Columbia... » read more

Startup Funding: August 2023


August startup funding continued to follow the trends that put AI and autonomous driving at the top of funding. One of August's largest rounds went to a company designing AI processor IP that can scale from the edge to the cloud. Plus, three battery manufacturers brought in one billion dollars or more. This report covers 37 companies that collectively raised $4.2 billion in August 2023. [... » read more

Week In Review: Design, Low Power


Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Chip Industry’s Technical Paper Roundup: July 12


New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

DW-MTJ Devices For Noise-Resilient Networks For Neuromorphic Computing On The Edge


A technical paper titled "Stochastic domain wall-magnetic tunnel junction artificial neurons for noise-resilient spiking neural networks" was published by researchers at University of Texas at Austin. Abstract: "The spatiotemporal nature of neuronal behavior in spiking neural networks (SNNs) makes SNNs promising for edge applications that require high energy efficiency. To realize SNNs in har... » read more

Week In Review: Auto, Security, Pervasive Computing


Apple uncorked its spatial computer, the Vision Pro, and a new operating system, the visionOS. The “infinite screen real estate” basically untethers the screen from the box, allowing users to work in multiple windows with no space limits. While the device garnered mixed reviews, largely based upon its $3,500 price tag, the implications of mixed-reality computing are potentially significant ... » read more

How Chip Engineers Plan To Use AI


Experts at the Table: Semiconductor Engineering sat down to discuss how AI is being used today and how engineers expect to use it in the future, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; and David Pan, professor in the ... » read more

← Older posts