tag: University of Texas at Dallas

Technical Paper Roundup: November 21
By Liz Allan - 21 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

Hybrid Photoresist Capable Of High-Resolution, Positive-Tone EUVL Patterning
By Technical Paper Link - 16 Nov, 2023 - Comments: 0

A technical paper titled “Vapor-Phase Infiltrated Organic–Inorganic Positive-Tone Hybrid Photoresist for Extreme UV Lithography” was published by researchers at Stony Brook University, Brookhaven National Laboratory, and University of Texas at Dallas. Abstract: "Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microe... » read more

Research Bits: November 14
By Jesse Allen - 14 Nov, 2023 - Comments: 0

Solid-state thermal transistor for heat management Researchers from University of California Los Angeles created a stable and fully solid-state thermal transistor that uses an electric field to control a semiconductor device’s heat movement. It is compatible with integrated circuits in semiconductor manufacturing processes. The team’s design incorporates the field effect on charge dynamics... » read more

Chip Industry’s Technical Paper Roundup: October 24
By Liz Allan - 24 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level
By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “SCAR: Power Side-Channel Analysis at RTL-Level” was published by researchers at University of Texas at Dallas, Technology Innovation Institute and University of Illinois Chicago. Abstract: "Power side-channel attacks exploit the dynamic power consumption of cryptographic operations to leak sensitive information of encryption hardware. Therefore, it is necessary t... » read more

Chip Industry’s Technical Paper Roundup: May 16
By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Technical Paper Round-Up: June 8
By Linda Christensen - 08 Jun, 2022 - Comments: 0

  New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

UT Dallas: Electronic, Thermodynamic & Dielectric Properties of Two Novel vdW Materials
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "A First-Principles Study on the Electronic, Thermodynamic and Dielectric Properties of Monolayer Ca(OH)2 and Mg(OH)2," from University of Texas at Dallas. With funding support from National Science Foundation and U.S. Department of Defense,  Defense Threat Reduction Agency. Abstract "We perform first-principles calculations to explore the electronic, thermodynam... » read more

Investigation of the Resistivity and Emissivity of a Pellicle Membrane for EUV Lithography
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New technical paper from Hanyang University and University of Texas at Dallas. Abstract "A pellicle is a thin membrane structure that protects an extreme ultraviolet (EUV) mask from contamination during the exposure process. However, its limited transmittance induces unwanted heating owing to the absorption of EUV photons. The rupture of the EUV pellicle can be avoided by improving its ther... » read more

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