Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: Mar. 5

By Linda Christensen - 05 Mar, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=201 /] » read more

Performing Multiple, Simultaneous Depositions In A High-Throughput, Multiplexing ALD/MLD-Style Reactor

By Technical Paper Link - 22 Feb, 2024 - Comments: 0

A technical paper titled “High throughput multiplexing reactor design for rapid screening of atomic/molecular layer deposition processes” was published by researchers at University of Washington. Abstract: "An approach is demonstrated for performing multiple, simultaneous depositions in a high-throughput, multiplexing atomic layer deposition/molecular layer deposition (ALD/MLD)-style reac... » read more

Chip Industry Technical Paper Roundup: Feb. 19

By Liz Allan - 19 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=199 /] More ReadingTechnical Paper Library home » read more

Directly Writing and Rewriting Photonic Chips on Low-Loss Phase-Change Thin Films

By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “Freeform direct-write and rewritable photonic integrated circuits in phase-change thin films” was published by researchers at University of Washington, University of Maryland, and Tianjin University. Abstract: "Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technolo... » read more

Research Bits: Feb. 6

By Jesse Allen - 06 Feb, 2024 - Comments: 0

Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Chip Industry’s Technical Paper Roundup: Jan. 8

By Liz Allan - 08 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Superconducting Material With Exceptional Tunability

By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Strain-switchable field-induced superconductivity” was published by researchers at Massachusetts Institute of Technology (MIT), University of Washington, Argonne National Laboratory, Cornell University, Zhejiang University of Science and Technology, and George Mason University. Abstract: "Field-induced superconductivity is a rare phenomenon where an applied magne... » read more

Light-Matter Interaction In Van Der Waals Nanophotonic Devices

By Technical Paper Link - 31 Oct, 2023 - Comments: 0

A technical paper titled “Deeply subwavelength integrated excitonic van der Waals nanophotonics” was published by researchers at University of California Los Angeles, University of Washington Seattle, and Auburn University. Abstract: "The wave nature of light sets a fundamental diffraction limit that challenges confinement and control of light in nanoscale structures with dimensions signi... » read more

Research Bits: October 17

By Jesse Allen - 17 Oct, 2023 - Comments: 0

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

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