Leo Pang, executive vice president at D2S, talks about the problems of patterning at 40nm and below and how to deal with them more effectively using existing equipment.
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The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
China restricts U.S. processors; Samsung's CXL, DRAM module and roadmap; ASML's $2.7B retention bonus; U.S., Mexico partner up; Keysight's $1.5B offer to Spirent; Lam's new pulsed laser deposition; new OSAT center.
Virtual representations will improve performance and productivity across the entire design through manufacturing flow, but deployments will vary in effectiveness and timelines.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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