The Week In Review: Design


M&A Ansys acquired Computational Engineering International (CEI), the developer of a suite of products that helps analyze, visualize and communicate simulation data. Founded in 1994 as a spin-off from Cray Research, the company's program covers a wide range of data formats. Terms of the deal were not disclosed. IP Efabless launched an open source framework that allows community members... » read more

Shrink Or Package?


Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

The Week In Review: IoT


Market Research International Data Corp. updated its Worldwide Semiannual Internet of Things Spending Guide, forecasting global IoT spending will increase 16.7% this year to more than $800 billion. The market research firm says the market will grow to almost $1.4 trillion by 2021. Manufacturing, smart grid technologies, freight monitoring, production asset management, and smart building techno... » read more

Security Issues Up With Heterogeneity


The race toward heterogeneous designs is raising new security concerns across the semiconductor supply chain. There is more IP to track, more potential for unexpected interactions, and many more ways to steal data or IP. Security is a difficult problem no matter what kind of chip is involved, and it has been getting worse as more devices, machines and systems are connected to the Internet. B... » read more

It’s Show Time


It’s been a busy season. The weather has warmed here in the desert and as the trees and greenery enliven in spring, The whole industry is bursting with activity. From DVCon to the International Symposium on FPGAs in the United States to Embedded World and CTIC in Europe, there have been a number of important developments in verification, embedded systems, and DO-254. The DVCon U.S. Confere... » read more

Whatever Happened To HLS?


A few years ago, [getkc id="105" comment="high-level synthesis"] (HLS) was probably the most talked about emerging technology that was to be the heart of a new [getkc id="48" kc_name="Electronic System Level"] (ESL) flow. Today, we hear much less about the progress being made in this area. Semiconductor Engineering sat down to discuss this with Bryan Bowyer, director of engineering for high-lev... » read more

Speeding Up Neural Networks


Neural networking is gaining traction as the best way of collecting and moving critical data from the physical world and processing it in the digital world. Now the question is how to speed up this whole process. But it isn't a straightforward engineering challenge. Neural networking itself is in a state of almost constant flux and development, which makes it something of a moving target. Th... » read more

Software Driven Test Of FPGA Prototype


Most everyone would agree how important FPGA prototyping is to test and validate an IP, sub-system, or a complete SoC design. Before the design is taped-out it can be validated at speeds near real operating conditions with physical peripherals and devices connected to it instead of simulation models. At the same time, these designs are not purely hardware, but these days incorporate a significa... » read more

Electric Vehicles Set The Pace


Electric vehicles are leading the charge for innovation in automotive electronics. Companies that invested and embraced the challenge of EVs are besting their less-nimble, less-open-minded engineering cohorts. Semiconductors and embedded computers have been controlling the dashboard, mirrors, seats, heating and cooling for years. But with EVs, engineering teams are starting to tackle tas... » read more

Supporting CPUs Plus FPGAs


While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

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