The Week In Review: Design


Tools Cadence unveiled a new equivalence checking tool which features a massively parallel architecture capable of scaling to 100s of CPUs and adaptive proof technology that analyzes each partition and determines the optimal formal algorithm. According to the company, the Conformal Smart Logic Equivalence Checker provides an average of 4X runtime improvement with the same resources over the pr... » read more

A Chip For All Seasons


FPGAs are showing up in more designs and in more markets, and as they get included in more systems they are becoming much more complex. A decade ago, the key markets for [gettech id="31071" t_name="FPGAs"] were industrial, medical, automotive and aerospace. Those markets remain strong, but FPGAs also are playing a role in artificial intelligence, data centers, the [getkc id="76" kc_name="... » read more

The Week In Review: Design


M&A Invecas will acquire Lattice Semiconductor's HDMI design team and Simplay Labs subsidiary, which oversees standards compliance and interoperability testing services. Invecas supplies foundation, analog, and interface IP optimized for GlobalFoundries processes. The deal is expected to close later this month. Last year, Lattice announced it would be acquired by Chinese private equity fir... » read more

CCIX Enables Machine Learning


It takes a lot of technology to enable something like machine learning, and not all of it is as glamorous as neural network architectures and algorithms. Several levels below that is the actual hardware on which these run, and that brings us into the even less sexy world of interfaces. One such interface, the Cache Coherent Interconnect for Accelerators (CCIX), pronounced C6, aims to make th... » read more

The Week In Review: Design


IP Synopsys unveiled High Bandwidth Memory 2 (HBM2) IP. The package includes PHY, controller and verification IP and supports data rates up to 2400Mb/s, 20% faster than the JEDEC standard specification. The controller supports pseudo-channel operation in either lock step or memory interleaved mode, and the PHY offers four trained power management states and fast frequency switching. Cadence... » read more

Achieving Separation On Multiprocessor SoCs For Enhanced Safety And Security


As I read my colleague Andrew Caples’ article on The Blurring of Safety and Security for Embedded Devices, I immediately started to think of the Xilinx UltraScale+ MPSoC – as I have engaged with numerous customers about using this chip for both safety and security purposes, and the requirements for both areas are definitely starting to blur. I quickly realized a blog about the Xilinx... » read more

Blog Review: July 26


Mentor's Dan Driscoll digs into designing for safety and security on the Xilinx UltraScale+ MPSoC and the different mechanisms that support subsystem isolation. Cadence's Paul McLellan listens in on a talk by Bosch's Volkmar Denner on the future of communications and AI in connected autos. Synopsys' Robert Vamosi points to a recently-discovered vulnerability that could be present in thous... » read more

The Week In Review: Design


M&A Ansys acquired Computational Engineering International (CEI), the developer of a suite of products that helps analyze, visualize and communicate simulation data. Founded in 1994 as a spin-off from Cray Research, the company's program covers a wide range of data formats. Terms of the deal were not disclosed. IP Efabless launched an open source framework that allows community members... » read more

Shrink Or Package?


Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

The Week In Review: IoT


Market Research International Data Corp. updated its Worldwide Semiannual Internet of Things Spending Guide, forecasting global IoT spending will increase 16.7% this year to more than $800 billion. The market research firm says the market will grow to almost $1.4 trillion by 2021. Manufacturing, smart grid technologies, freight monitoring, production asset management, and smart building techno... » read more

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