tag: Yole Developpement

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 18 Nov, 2022 - Comments: 0

Chinese memory chip maker YMTC and dozens of other Chinese entities are "at risk" of being added to a trade blacklist as soon as Dec. 6, a U.S. Commerce Department official said in prepared remarks seen by Reuters. SMIC co-CEO Zhao Haijun said on an earnings call that recent export controls from the United States will have an "adverse impact" on the company's production. The U.K. has rule... » read more

Fan-Out Packaging Gets Competitive
By Karen Heyman and Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

How Quickly Can SiC Ramp?
By Adele Hars - 21 Jul, 2022 - Comments: 0

Device makers across the globe are ramping silicon carbide (SiC) manufacturing, with growth set to really take off starting in 2024. It’s been almost five years since Tesla and STMicroelectronics threw down the gauntlet with SiC in the Model 3. Now, no one doubts the market pull for electric vehicles, but consumers are still clamoring for better range and faster charging. SiC devices are a... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week in Review: Manufacturing, Test
By Linda Christensen - 13 May, 2022 - Comments: 0

Industry Numbers NAND flash memory is forecast to hit US $83 billion this year, an increase of 24%. DRAM is projected to hit $118 billion, up 25%, according to a recent Yole report. Both are historic records. DRAM and NAND revenues are expected to be a $260 billion market in 2027 (combined), with advanced technologies such as EUV lithography, hybrid bonding and 3D DRAM driving this. SEMI in... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 01 Apr, 2022 - Comments: 0

The U.S. Senate approved the 2022 America COMPETES act, which has big ramifications for the chip industry. The bill now heads to the House for further reconciliation. If approved, it would provide more than $50 billion in U.S. subsidies for semiconductor chip manufacturing. The SIAC (Semiconductor In America Coalition) urged Congress to act promptly to achieve a bipartisan compromise soon and o... » read more

Inspecting And Testing GaN Power Semis
By Patrick Waurzyniak - 11 Jan, 2022 - Comments: 1

As demand for new automotive battery electric vehicles (BEVs) heats up, automakers are looking for solutions to meet strict zero-defect goals in power semiconductors. Gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap power semiconductors offer automakers a range of new EV solutions, but questions remain on how to meet the stringent quality goals of the automotive industry. Among t... » read more

Expanding Advanced Packaging Production In The U.S.
By Mark LaPedus - 05 Jan, 2022 - Comments: 0

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the leaders in developing packages, especially new and advanced forms of the technology that promise to shake up the semiconductor landscape. And while the U.S. has several packaging vendors, North A... » read more

GaN Application Base Widens, Adoption Grows
By Patrick Waurzyniak - 16 Dec, 2021 - Comments: 0

Gallium nitride (GaN) is beginning to show up across a broad range of power semiconductor applications due to its wide bandgap, enabling fast-charging, very high speeds, and much smaller form factors than silicon-based chips. Unlike silicon carbide (SiC), another wide-bandgap technology, GaN is a lateral rather than a vertical device. GaN tops out at about 900 volts, which limits its use in ... » read more

China Accelerates Foundry, Power Semi Efforts
By Mark LaPedus - 22 Nov, 2021 - Comments: 4

China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

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