Stepping Back From Scaling


Architectures, packaging and software are becoming core areas for semiconductor research and development, setting the stage for a series of shifts that will impact a large swath of the semiconductor industry. While there is still demand from the largest chipmakers for increased density at the next process node, the underlying economics for foundries, equipment vendors and IP developers are f... » read more

SEMICON Taiwan’s Packaging Punch


SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

MEMS on SOI – Growing Fast and Faster


By Adele Hars In the latest ASN posting by Dr. Eric Mounier of Yole Developpement, “SOI for MEMS: A Promising Material”, he notes that SOI MEMS is growing at a CAGR (2011-2015) of 15.6%, compared to 8.1% for bulk silicon-based solutions. MEMS designers are doing amazing things on SOI – which would explain that impressive growth rate. [caption id="attachment_12" align="aligncenter... » read more

3D Integration: Extending Moore’s Law Into The Next Decade


By Cheryl Ajluni At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, according to Philippe Magarshack, the general manager of Central CAD & Design Solutions at STMicroelectronics, is 3D stacking for complex System-on-Chips (SoCs). The concept of 3... » read more