The Week In Review: Design/IoT

M&A Tessera boosted its 2.5D and 3D-IC capabilities with the acquisition of Ziptronix. The $39 million cash purchase adds a low-temperature wafer bonding technology platform, which has been licensed to Sony for volume production of CMOS image sensors. Numbers Semico Research forecasts that the SoC market will approach $200 billion by 2019. According to its analysis, average die are... » read more

Options And Hurdles Come Into Focus For 3D Stacking

By Mark LaPedus The initial round of stacked 2.5D and 3D chips based on through-silicon vias (TSVs) has emerged in the market. There are other 2.5D/3D chips in the pipeline, but it’s taking longer than expected to bring these devices into production. There are a range of design, manufacturing, supply chain and cost challenges associated with 2.5D/3D designs. The enormous risk to bring ... » read more