By Mark LaPedus
The initial round of stacked 2.5D and 3D chips based on through-silicon vias (TSVs) has emerged in the market.
There are other 2.5D/3D chips in the pipeline, but it’s taking longer than expected to bring these devices into production. There are a range of design, manufacturing, supply chain and cost challenges associated with 2.5D/3D designs.
The enormous risk to bring ... » read more