The Week In Review: IoT


Analysis Cisco Systems and General Electric will be the main contenders in the industrial Internet of Things market, this analysis contends. Meanwhile, The New York Times analyzes GE’s big bet on the IoT and related software development to stay ahead of competing technology giants. Qualcomm holds the most Internet of Things patents, leading Intel, ZTE, Nokia, and LG Electronics, this anal... » read more

The Week In Review: Manufacturing


In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

The Week In Review: Manufacturing


Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

The Week In Review: Design/IoT


Tools Synopsys unveiled its comprehensive standard cell library characterization and QA solution, SiliconSmart ADV, highlighting a simple multi-core licensing scheme for easy adaptation to constantly changing characterization workload requirements. Cadence updated its Sigrity portfolio focusing on multi-gigabit interfaces, including automated support for IBIS-AMI model creation, channel m... » read more

The Week In Review: Design/IoT


Mergers & Acquisitions Zuken acquired one of its USA resellers, electrical applications provider Caetek. The company also developed software for harness manufacturers that integrated with Zuken's electrical wiring, control systems and fluid engineering toolset. The NXP-Freescale merger is, at last, official. The largest revenue source for the combined company will be automotive, proje... » read more

Top 15 Integrating Points In The Continuum Of Verification Engines


The integration game between the different verification engines, dynamic and static, is in full swing. Jim Hogan talked about the dynamic engines that he dubbed “COVE”, and I recently pointed out a very specific adoption of COVE in my review of some customer examples at DAC 2015 in “Use Model Versatility Is Key for Emulation Returns on Investment”. Here are my top 15 integrating poin... » read more

Smartphones Drive Component Sales


The impact of smartphones on electronic components and semiconductors is growing. As reported by the Nihon Keizai Newspaper in October, the total value of orders received in Q3 for six major electronic components set a record. Also, in Taiwan, the overseas orders in September increased to 38.4 billion dollars, which is a 2% increase compared with the same month of the previous year, as reported... » read more

Big Changes Rock Global Smartphone Market


BANGKOK — One of the many draws for Western travelers here in Thailand and throughout much of Asia, including China, is the availability of cheap consumer electronics. Unfortunately many of these electronic goods — little-known off-brands mimicking better-known counterparts, or white-label devices being passed off as name-brand products to unsuspecting consumers — typically are technologi... » read more

The Changing Role Of The OSAT


By Ann Steffora Mutschler As process geometries and packaging technologies have matured over time, the OSAT (outsourced semiconductor assembly and test) provider has played an evolving role in the semiconductor packaging ecosystem. With true 3D chip stacking on the horizon, their role may evolve once again as ecosystem players jostle for position in the 3D universe. There are two things tha... » read more