Tech Talk: 14nm And Stacked Die

Why the 14nm node will be long lived, and how it will be used in 2.5D and 3D-IC packages.

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Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything.