ProPlus CTO Bruce McGaughy explains why FastSPICE (fast Simulation Program with Integrated Circuit Emphasis) is running out of steam in the finFET generation and what needs to happen next.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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