Coloring in advanced lithography: What goes wrong and how to fix it.
Mentor Graphics’ David Abercrombie continues with his whiteboard talk about coloring with advanced lithography, including what goes wrong and how to fix it.
The economics and benefits of moving to the next process node are not so obvious anymore.
FinFET formation, mask challenges and back-end-of-line issues will make this node difficult and expensive.
Samsung’s foundry moves; Intel to close fab?; Lam results; hot IC markets.
As more things are connected, security holes are showing up in places no one considered.
Aluminum on sapphire qubits provide proof of concept for surface codes and digitized adiabatic evolution.
Four possible scenarios for patterning the next generation of chips.
Investments in finFET technology are hard to discard, but technical and financial challenges for getting there are huge.
Intel joins AMD, IBM on advanced packaging; performance is the key driver.
What top executives from around the semiconductor industry expect this year.
More rules, variation and data expected as IP and tools begin early qualification process.
Intel’s acquisition of Altera finalized; NFC frontend; Rambus renews Toshiba license; Andes inks deals with M2Communcation.
As DRAM scaling runs out of steam, vendors begin looking at alternative packaging and new memory types and architectures.
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