Coloring in advanced lithography: What goes wrong and how to fix it.
Mentor Graphics’ David Abercrombie continues with his whiteboard talk about coloring with advanced lithography, including what goes wrong and how to fix it.
Advancing to the next process nodes will not produce the same performance improvements as in the past.
General-purpose metrics no longer apply as semiconductor industry makes a fundamental shift toward application-specific solutions.
Vendors pin hopes on 3D memory, raising specter of 2D NAND shortages; other memory types add to uncertainty.
Foundries progress with complex combination of high-aspect ratio etch, metal deposition and string stacking.
28nm and 22nm are becoming much more interesting process nodes.
The economics and benefits of moving to the next process node are not so obvious anymore.
Four possible scenarios for patterning the next generation of chips.
More rules, variation and data expected as IP and tools begin early qualification process.
As DRAM scaling runs out of steam, vendors begin looking at alternative packaging and new memory types and architectures.
Intel buys multi-beam firm; Intel supplier awards; RF SOI; image sensors.
FinFET formation, mask challenges and back-end-of-line issues will make this node difficult and expensive.
Part 1: Design teams are rethinking the right number and kinds of cores, how big they need to be, and how they’re organized.
Low Power-High Performance
Manufacturing, Design & Test
IoT, Security & Automotive