Coloring in advanced lithography: What goes wrong and how to fix it.
Mentor Graphics’ David Abercrombie continues with his whiteboard talk about coloring with advanced lithography, including what goes wrong and how to fix it.
As finFETs run out of steam after 7nm, what comes next? The debate is just beginning.
Top process execs shed light on 10nm and beyond, plans for longer time between nodes, and the future of EUV, finFETs and stacked die.
Market growth is expected to be strong, but development cycle is slow.
Using light to move data will save power and improve performance; laser built into process technology overcomes huge hurdle.
Metrics for performance are changing at 10nm and 7nm. Speed still matters, but one size doesn’t fit all.
Experts at the table, part 1: DDR5 spec being defined; new SRAM under development.
Advancing to the next process nodes will not produce the same performance improvements as in the past.
Industry leaders examine enablers, implications, and perspectives for a changing technology ecosystem.
Support grows for RISC-V open-source instruction set architecture.
GlobalFoundries’ top technologists open up on next-gen FD-SOI, the economics and challenges of 7nm, and what lies ahead.
General-purpose metrics no longer apply as semiconductor industry makes a fundamental shift toward application-specific solutions.
Construction is up, fueled by IoT and internal markets, but the outcome is far from clear.
Low Power-High Performance
Manufacturing, Design & Test
IoT, Security & Automotive