Now that EUV has hit another hiccup, it’s time to start polishing your multi patterning skills.
Mentor Graphics’ David Abercrombie shows how multi patterning is supposed to be done, and what sorts of problems can crop up along the way. Now that EUV has hit another hiccup, the semiconductor industry has little choice.
Updated. GlobalFoundries today announced the completion of its acquisition of IBM’s Microelectronics business, fortifying its path to advanced manufacturing process nodes.
New technologies after finFETs and how the industry is likely to get there if it can resolve some very tough issues.
Analysis: GlobalFoundries adds 22nm FD-SOI technology, extending benefits of planar design at least two more nodes with improved performance and lower power.
It costs nearly three times more to design a finFET-based chip than a 28nm planar chip, and it takes more than twice as long to get working silicon.
Rising costs and a consolidating industry are forcing companies to rethink where to place their dollars; Europe and Asia step up investments.
Negative bias temperature instability could force chipmakers to change course on materials.
Intel to delay 10nm?; who won Apple’s foundry biz?; Moore’s Law celebration; material world.
Applied Materials and TEL have agreed to terminate their merger deal.
Foundries split over 1D and 2D layout schemes, creating tough choices for chipmakers involving performance, area and other options.