The Week In Review: Manufacturing

Inside the iPhone 6S; China wants to buy foundry vendor; D2S-Advantest team up in mask metrology; eBeam releases mask survey.


Upgraded components in the new iPhone 6S Plus from Apple cost $16 more than the components in the earlier iPhone 6 Plus, according to IHS, which also provided a breakdown of the phone. Both Samsung and TSMC are making Apple’s A9 applications processor on a foundry basis, according to ExtremeTech, which cites Chipworks as its source.

There are reports that the Chinese government is interested in buying GlobalFoundries from Abu Dhabi, according to a report from the Times Union.

The eBeam Initiative released its annual members’ perceptions survey, a set of results that reveals some new and surprising data about EUV, multi-beam and photomask technology.

The CD-SEM needs some help in mask metrology. Looking to solve the problem, D2S has partnered with Advantest to integrate D2S’ Wafer Plane Analysis engine into Advantest’s E3640 line of CD-SEMs.

China-based Montage Technology Group announced that it proposed an offer to acquire 100% of the outstanding stock of Pericom Semiconductor in a transaction valued at approximately $430 million. This transaction would provide Pericom shareholders with a substantially superior valuation to the $17.00 per share offer announced by Diodes.

Mellanox will acquire EZchip’s outstanding ordinary shares for a cash purchase price of $25.5 per share, implying a transaction value of approximately $811 million.

Rudolph Technologies has purchased Stella Alliance, a semiconductor inspection technology intellectual property (IP) portfolio company.

Cabot Microelectronics, the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries, announced that it has entered into a definitive agreement to acquire NexPlanar, a company that specializes in CMP pads.

Fujifilm announced the signing of an agreement to acquire the U.S. solvent manufacturer Ultra Pure Solutions.