New 3D DRAMs; AMD foundry deal; R&D tax credits.
South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of South Korea.
Samsung and GlobalFoundries will make AMD’s next-generation 14nm graphics chips on a foundry basis for the U.S. fabless chipmaker, according to a report from The Electronic Times.
Congress took a major step in supporting U.S. manufacturing and innovation by voting to make the federal Research and Development (R&D) tax credit permanent. Included in the same legislation is an extension of the solar energy Investment Tax Credit (ITC). The 30% ITC, which was set to be reduced to 10% at the end of 2016, has been critical to the wide-scale deployment of solar photovoltaic panels in the U.S.
SEMI announced that Jim Bowen has been selected as the 2016 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing at the SEMI Industry Strategy Symposium. The event takes place from Jan. 10-13, 2016 in Half Moon Bay, Calif.
Advanced Semiconductor Engineering (ASE) announced an unsolicited bid to acquire Siliconware Precision Industries Co. Ltd. (SPIL).
Micron Technology posted mixed results for the quarter, but the company provided a disappointing outlook. “Micron is overly exposed to a weak PC market and cannot combat the constant ASP degradation with lower manufacturing costs. Given that Micron is currently ramping new technologies in both DRAM (20nm) and NAND (3D), there is no leverage to offset a weak pricing environment despite positive sequential bit growth for both memory types,” said Mark Bachman, an analyst with ITG Investment Research, in a report.