February 2011 - Page 2 of 4 - Semiconductor Engineering

Semiconductor M&A?
By Kurt Shuler - 24 Feb, 2011 - Comments: 0

Last week a friend of mine was giddy with joy as he exclaimed, “Semi M&A is back!” It seems Qualcomm’s acquisition of Atheros and Intel’s acquisition of Silicon Hive somehow changed the chemical makeup of his brain, transforming him from an eternal semiconductor market pessimist to a born-again optimist. Being someone who lives and dies by data, my initial response was, “Let’s s... » read more

Bridging The Gap
By Frank Ferro - 24 Feb, 2011 - Comments: 0

By Frank Ferro Today’s industry shows are feeling a lot like deja vu…tablets, tablets, smartphones, smartphones. The recent CES felt very similar to Mobile World Congress (MWC) with all the emphasis on smart phones and pad computing. When I first started attending MWC—it was called 3GSM in those days and held in France—semiconductor companies seemed somewhat misplaced because 3GSM w... » read more

Chip Failure? Don’t Worry About It!
By Ron Craig - 24 Feb, 2011 - Comments: 0

By Ron Craig Here in the United States it’s tax time again. Along with every other loyal taxpayer, I’ve been working on identifying every conceivable deduction I can think of to minimize my overall tax burden. I’m not an expert on tax law, but as far as I can tell I still can’t take advantage of the non-tax deductible dependents we like to call ‘the cats.’ Our own demanding hous... » read more

The Missing Link
By Jon McDonald - 23 Feb, 2011 - Comments: 0

By Jon McDonald When something comes up once it may be an anomaly, but when the same thing comes up multiple times in a short period of time there's a good chance it is a more general trend. At Mentor we have tools focused on Systems Engineering and UML/SysML, as well as SystemC ESL/TLM focused tools. We have invested effort in integrating the tool flows, but I had not seen significant driv... » read more

3D-IC Standards Key to TSV Adoption
By SEMI - 22 Feb, 2011 - Comments: 0

By James Amano, director, SEMI International Standards Three-Dimensional Stacked Integrated Circuits (3D-ICs) are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production for some time, but the next generation of 3D integration inco... » read more

Cloud Seeding
By Ed Sperling - 18 Feb, 2011 - Comments: 0

Selling EDA through a software-as-a-service model is hardly a new concept. It’s also not a particularly successful one. Despite some initial hype and sporadic attempts to revive it, the idea has fallen flat due to concerns about version control, security and an almost universal aversion to engineers having to send large files back and forth to a server. The approach is getting a new look, ... » read more

Experts At The Table: Concurrent Design
By Ed Sperling - 18 Feb, 2011 - Comments: 0

Low-Power Engineering sat down with Marco Brambilla, ASIC design manager at STMicroelectronics; Charlie Janac, president and CEO of Arteris; Mike Gianfagna, vice president of marketing at Atrenta, and Javier DeLaCruz, director of semiconductor packaging at eSilicon. What follows are excerpts of that discussion. LPE: Is there cross-training going on to allow for concurrent design? Brambilla... » read more

Experts At The Table: 3D Stacking
By Ed Sperling - 14 Feb, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing and Design sat down with Riko Radojcic, director of engineering at Qualcomm; Drew Wingard, CTO at Sonics; Michael White, senior product marketing manager for Calibre physical verification at Mentor Graphics; Jim Hogan, a Silicon Valley venture capitalist; Prasad Subramaniam, vice president of design technology at eSilicon; and Mike Gianfagna, vice pre... » read more

How do PV and IC silicon markets compare?
By Katherine Derbyshire - 14 Feb, 2011 - Comments: 0

The recent announcement of 2010 silicon wafer shipments got me wondering: silicon consumption for solar cells passed silicon consumption for integrated circuits a number of years ago, but how do they compare now? A quick call to the very helpful Richard Winegarner at Sage Concepts answered the question. In 2009, solar cells consumed 10 times as many square inches, but generated about the same t... » read more

3D Stacking: Reality Check
By Ed Sperling - 14 Feb, 2011 - Comments: 0

Semiconductor Manufacturing & Design examines the myth and reality of 3D stacking--and the hurdles that still need to be solved. In the hot seat: VC Jim Hogan; eSilicon's Prasad Subramanian; Sonics' Drew Wingard; Atrenta's Mike Gianfagna, and Mentor Graphics' Michael White. [youtube vid=fWQUGgwC-F4] » read more

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