May 2011 - Page 2 of 4 - Semiconductor Engineering

Powering Forward Or Moon Walking?
By Frank Ferro - 26 May, 2011 - Comments: 0

By Frank Ferro How many of us would go back to watching television in black and white, or carry around a 10-pound laptop or cell phone that resembles the ones in original brick form? For most consumers, it would even be hard to turn back the clock on more recent innovations like Wi-Fi and digital cameras (finding a place to plug-in the lap, run wires through the house, carrying around film! Fi... » read more

ESL And FPGAs
By Jon McDonald - 26 May, 2011 - Comments: 0

By Jon McDonald I've been struggling to come up with a good way of answering a recent question: "Do ESL approaches provide benefits for FPGA design?" I have an initial gut answer that's somewhat unsatisfactory. Thinking through the subject I can see ways of looking at the question and getting both a “yes” and a “no,” but that's probably an indication my thinking is not yet clear enough... » read more

EDA…Or Something Else?
By Atrenta - 26 May, 2011 - Comments: 0

The Design Automation Conference is almost here. That major focal point for the EDA industry where we gather to explain the present, predict the future, have a bunch of serious meetings and maybe a little fun, too. Some companies will stage an incremental update of their strategy and others will outline a major new strategy. This year, Atrenta will be talking strategy, with some announcement... » read more

Executive Briefing: Wally Rhines
By Ed Sperling - 25 May, 2011 - Comments: 0

Mentor's Chairman and CEO sounds off about where the IC design challenges are, what needs to be done to fix them, and what new opportunities will unfold.   [youtube vid=UGkpCtRdZJ0]   » read more

Blog Review: May 25
By Ed Sperling - 25 May, 2011 - Comments: 0

By Ed Sperling Cadence’s Richard Goering follows Jim Hogan’s talk about the democratization of MEMS. This market is showing big gains lately, but to really release the emergency brake will require a different design approach. Mentor’s Robin Bornoff revs up the engine and turns on the neon underbody lighting in this look at the overclocking market, shifting effortlessly from cars to PC... » read more

RF Substrate Technologies for Mobile Communications
By Various Writers - 23 May, 2011 - Comments: 0

Two Soitec Group managers -- Eric Desbonnets and Stéphane Laurent -- describe how SOI wafers support RF technology development. » read more

FD-SOI: The Right Choice
By Various Writers - 20 May, 2011 - Comments: 0

By Adele Hars Although Intel will do FinFETs at 22nm, FD-SOI remains the better alternative for most all the industry for low power and mobile apps. In the weeks and months to come, we'll continue to hear the SOI camp driving home key advantages of planar FD-SOI. 1. FD-SOI technology is the most cost-effective solution. The wafers are available from multiple sources. With volume purchasi... » read more

Understanding Frog Behavior
By Ed Sperling - 20 May, 2011 - Comments: 0

Change is rarely something people can grasp, particularly in technology. Unless it involves a completely new way of doing things—witness the PC, the cell phone and the Internet, for example—most change involves evolutionary improvements. This is the proverbial frog in a pot of boiling water. Heat the frog up slowly and it will cook. Throw the frog into boiling water and it will leap to s... » read more

Experts At The Table: Power Budgeting
By Ed Sperling - 20 May, 2011 - Comments: 0

Low-Power Engineering sat down with Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Cary Chin, director of technical marketing for low-power solutions at Synopsys; Vic Kulkarni, general manager of the RTL business unit at Apache Design Solutions; Matt Klein, principal engineer for power and broadcast applications at Xilinx; and Paul van Besouw, presi... » read more

The Economics of Innovation …Daunting
By Joanne Itow - 13 May, 2011 - Comments: 0

By Joanne Itow The convergence of mobility, communication and computing has produced multifunctional end applications that are placing huge demands on semiconductor manufacturers. These new devices require low power, high performance, and a lot of advanced manufacturing capacity at a low cost. At the 2011 Semico Summit, Gregg Bartlett, Senior Vice President of Technology and Research a... » read more

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