November 2014 - Page 2 of 10 - Semiconductor Engineering

The Week In Review: Manufacturing
By Mark LaPedus - 21 Nov, 2014 - Comments: 0

A majority of Americans cannot endure more than two hours without checking their electronic devices, according to new data released in the Crucial.com Tech-Life Balance Survey. One in four Americans becomes stressed by going longer than 30 minutes without checking their email or phone due to a fear of missing out. Additionally, one in five would sooner go to dinner with an ex significant other ... » read more

The Week In Review: Design/IoT
By Ed Sperling - 21 Nov, 2014 - Comments: 0

IoT The first test drive to showcase intelligent traffic was held in Europe this week. NXP, Siemens, Honda, Cohda Wireless, TÜV Süd, and Automobile Clubs AvD and ANWB are all working within the Intelligent Transport Systems Corridor that runs between Austria, German and the Netherlands. IP Open-Silicon rolled out memory controller IP for the Hybrid Memory Cube 2.0 standard. The 3D stacke... » read more

Something Old, Something New
By Ed Sperling - 20 Nov, 2014 - Comments: 0

Sooner or later, everything comes back into vogue. There are only so many permutations of fashion, architecture and other designs, and eventually something has to be recycled, even if it's an antique. Technology is no different than fashion. In the late 1990s, when governments and banks were preparing for the Y2K problem, people with knowledge of assembly code were in extremely high demand b... » read more

The Internet Of Cores
By Brian Bailey - 20 Nov, 2014 - Comments: 0

Ever since the birth of the third-party [getkc id="43" comment="IP"] market, there has been a desire for plug-and-play compatibility between cores. Part of the value proposition of reuse is that a block has been used before, and has been verified and validated by having been implemented in silicon. By re-using the core, many of these tasks no longer land on the [getkc id="81" kc_name="SoC"] dev... » read more

Conflicting Needs For IoT Edge Designs
By Ed Sperling - 20 Nov, 2014 - Comments: 1

The mad rush has begun to hype the [getkc id="76" comment="Internet of Things"], but the path forward isn't quite as straightforward as the marketers would like it to be. ICs used at the edge of the IoT—the ones that gather information to be controlled by smart phones or tablets and transmitted to devices for processing and data analytics—need to be designed differently than the initial for... » read more

Making Models Interoperable
By Ann Mutschler - 20 Nov, 2014 - Comments: 0

As engineering teams raise the vision of their design to a higher level of abstraction, the use of behavioral modeling is growing. While not ubiquitous, the concepts are gelling, which at least is helping the industry discuss the technology more intelligently and determine where automation makes sense. One of the biggest concerns with behavioral modeling is what engineering teams want to do ... » read more

Measuring Verification Accuracy
By Ann Mutschler - 20 Nov, 2014 - Comments: 0

[getkc id="10" kc_name="Verification"] is the unbounded challenge that continues to confound engineering teams across the globe, who want to know when "enough" is "good enough" to proceed to tapeout. The answer is not straightforward, and it includes more variables than in the past, particularly around power. Harry Foster, chief verification scientist at [getentity id="22017" e_name="Mentor ... » read more

Hybrid Verification: The Only Way Forward
By Brian Bailey - 20 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

Hybrid Memory Cube – Ready For Prime Time
By Manohar Ayyagiri - 20 Nov, 2014 - Comments: 0

With the release this week of Hybrid Memory Cube (HMC) 2.0, designers can get their hands on mature, standards-based IP that can be used to significantly scale the performance of servers and data centers. HMC offers bandwidths up to 320 GB/s – 12X that of standard memory solutions like DDR4 – while consuming significantly less power. These benefits are too significant to ignore for ASIC, So... » read more

3,000 Reasons To Look Into Virtual Prototyping
By Tom De Schutter - 20 Nov, 2014 - Comments: 0

As announced on Nov. 5, Synopsys virtual prototyping book achieved a remarkable milestone of more than 3,000 copies in distribution to more than 1,000 companies. The success of the book highlights the interest in virtual prototyping as a key methodology to shift left software development. Upon the book’s publication, we received a lot of interest from China and Japan for translated versio... » read more

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