June 2015


Power/Performance Bits: June 30


Tiny, solar-powered sensors Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells. Previous ultralow-power converters that used the same approach had efficiencies of only 40 or 50 percent. ... » read more

Manufacturing Bits: June 30


3D printed supercars Divergent Microfactories has rolled out a new approach to auto manufacturing based on 3D printing. The technology is based on what the company calls a Node. A Node is a metal alloy that is produced using 3D printers. The Nodes are combined with carbon fiber tubes, which, in turn, enable the development of a car chassis. [caption id="attachment_20782" align="alignleft... » read more

System Bits: June 30


Implantable drug-delivery chip An implantable, microchip-based device developed by MIT spinout Microchips Biotech may soon replace the injections and pills now needed to treat chronic diseases. The company partnered with Teva Pharmaceutical to commercialize its wirelessly controlled, implantable, microchip-based devices that store and release drugs inside the body over many years. [caption id... » read more

The Future Of Moore’s Law


Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

The Week In Review: Manufacturing


Semiconductor Manufacturing International Corp. (SMIC), Huawei, Imec and Qualcomm have announced the formation of the SMIC Advanced Technology Research & Development (Shanghai) Corp., an equity joint venture company. Located in China, the joint venture company will focus on R&D towards next-generation CMOS logic technology. The current focus will be on developing 14nm logic technology, ... » read more

The Week In Review: Design/IoT


IP Sonics released the latest version of the company's flagship NoC, which expands on their interleaved multi-channel technology and includes new layout optimization features for design flows based on modern physical synthesis and place & route tools. Synopsys extended its PCI Express 4.0 IP to support RAS features to help designers ensure data integrity and increase data protection i... » read more

Intel Plus Altera


Since the Intel-Altera deal reached the handshake phase earlier this month, there have been a lot of theories being forwarded and a lot of questions being raised. And there have been very few answers, in part because the deal isn't finalized yet and in part because this marriage will take time to play out in the market—maybe years. But along with the GlobalFoundries-IBM pairing, this is th... » read more

More Data, Different Approaches


Scaling, rising complexity, and integration are all contributing to an explosion in data, from initial design to physical layout to verification and into the manufacturing phase. Now the question is what to do with all of that data. For SoC designs, that data is critical for identifying real and potential problems. It also allows verification engineers working the back end of the design flow... » read more

EDA’s Clouded Future


There was a time, not that long ago, when chip design and EDA tools consumed some of the largest data centers with tens of thousands of machines and single datasets that consumed more than a hard disk could hold. The existing IT capabilities of the times were stretched to their limits. But while design sizes grew, other aspects of the flow did not develop as fast. “This has been driven by ... » read more

What Is A System Now?


Defining a system used to be relatively straightforward. But as systems move onto chips, and as those chips increasingly are connected with applications and security spanning multiple devices, the definition is changing. This increases the complexity of the design process itself, and it raises questions about how chips and software will be designed and defined in the age of the [getkc id="76... » read more

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