September 2015


Resist Sensitivity, Source Power, And EUV Throughput


In a recent article, I quoted 15 mJ/cm2 as the target sensitivity for EUV photoresists, and discussed the throughput that could be achieved at various source power levels. However, as a commenter on that article pointed out, reaching the 15 mJ/cm² target while also meeting line roughness requirements is itself a challenging problem. Because of the high energy of EUV photons, a highly sensitive... » read more

Blog Review: Sept. 30


In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

zeroK NanoTech: FIB Circuit Edit


Focused ion beam (FIB) circuit editing is an enabling technology that has been around for some time. Using a standard FIB tool, a chipmaker can basically edit portions of a circuit before it goes into production. It allows chipmakers to debug chips, cut traces, add metal connections and perform other functions. One startup, zeroK NanoTech, is putting a new and innovative twist on FIB circui... » read more

Mask Metrology Challenges Grow


Photomasks are becoming more complex at each node. In fact, masks are moving from traditional shapes to non-orthogonal patterns and complex shapes, such as curvilinear mask patterns. To measure patterns and shapes on the mask, photomask makers use traditional critical-dimension scanning electron microscopes (CD-SEMs). In general, the CD-SEM, the workhorse metrology tool in the mask shop, use... » read more

Survey: Mask Complexity To Increase


The eBeam Initiative today released its annual members’ perceptions survey, a set of results that reveals some new and surprising data about EUV, multi-beam and photomask technology. As part of the results in the new survey, there is a growing level of optimism for the implementation of extreme ultraviolet (EUV) lithography in high-volume manufacturing, as compared to last year’s result... » read more

System Bits: Sept. 29


Light detector on a chip for portable sensors The invention by Vanderbilt University and Ohio University researchers of the first integrated circularly polarized light detector on a silicon chip could open the door for development of small, portable sensors to expand the use of polarized light in drug screening, surveillance, optical communications, quantum computing, and other applications. ... » read more

Manufacturing Bits: Sept. 29


Turning the nano-wrench The University of Vermont has developed a wrench that has linewidth geometries at 1.7nm. The so-called nano-wrench is an atomic-level tool, which could one day be used to create tiny structures and molecules. The nano-wrench has been devised using a technology called chirality-assisted synthesis (CAS). Chirality is derived from the Greek word for hand. If one holds u... » read more

Power/Performance Bits: Sept. 29


Optical rectenna Engineers at the Georgia Institute of Technology demonstrated the first optical rectenna, a device that combines the functions of an antenna and a rectifier diode to convert light directly into DC current. Based on multiwall carbon nanotubes and tiny rectifiers fabricated onto them, the optical rectennas could provide a new technology for photodetectors that would operate... » read more

EDA, IP Numbers Up


EDA and IP numbers increased another 8.5% in Q2, with all regions but Japan showing positive growth. Total revenue was $1.91 billion for the quarter, up from $1.76 billion in Q2 of 2014. The largest category, computer-aided engineering, was $657.2 million for the quarter, up 9.6% compared with the same period last year. IC physical design was $379.2 million, up 6% year over year, and IP was ... » read more

Is The 2.5D Supply Chain Ready?


A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

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