December 2015 - Semiconductor Engineering

What Goes Wrong With IP
By Ed Sperling - 31 Dec, 2015 - Comments: 0

Semiconductor Engineering sat down to talk about the future of IP with Rob Aitken, R&D fellow at [getentity id="22186" comment="ARM"]; Mike Gianfagna, vice president of marketing at [getentity id="22242" e_name="eSilicon"]; Judd Heape, vice president of product applications at Apical; and Bernard Murphy, an independent industry consultant. What follows are excerpts of that discussion, which... » read more

Behind The Intel-Altera Deal
By Ed Sperling - 31 Dec, 2015 - Comments: 3

Intel completed its $16.7 billion acquisition of Altera this week, wrapping up what is arguably the semiconductor industry's most important M&A transaction of 2015. Time and numbers will tell exactly how important. There are two big challenges to making this deal work. One involves a big shift in direction away from simply shrinking features to include new architectures and packaging approac... » read more

Upcoming Hurdles For The Semiconductor Industry
By Ann Mutschler - 30 Dec, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael Buehle... » read more

Blog Review: Dec. 30
By Jesse Allen - 30 Dec, 2015 - Comments: 0

It's been a quiet week on the blog front. If you're looking for a bit of downtime while you enjoy the New Year, we present thoughts on what's happened this year and what may be to come from last week's System-Level Design newsletter: Editor in Chief Ed Sperling finds acquisitions and the leading edge of design defined 2015, but other changes are ahead. Technology Editor Brian Bailey obser... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2015 - Comments: 0

Printing hair Using a low-cost, 3D printing technique, Carnegie Mellon University has found a way to produce hair-like strands and fibers. The printer produces plastic hair strand by strand. It takes about 20-25 minutes to generate hair on 10 square millimeters. A video can be seen here. [caption id="attachment_24544" align="alignleft" width="300"] 3D printed hair (Photo: Carnegie Mellon... » read more

System Bits: Dec. 29
By Ann Mutschler - 29 Dec, 2015 - Comments: 0

Optoelectronics built using existing manufacturing Using only processes found in existing microchip fabrication facilities, researchers at MIT, the University of California at Berkeley, and the University of Colorado have produced a working optoelectronic microprocessor that computes electronically but uses light to move information. The researchers reminded that optical communications prom... » read more

Power/Performance Bits: Dec. 29
By Jesse Allen - 29 Dec, 2015 - Comments: 0

Wearing your batteries In spite of the progress in wearable devices, one challenge remaining is providing less obtrusive and cumbersome power sources. To tackle the problem, researchers at Case Western Reserve University developed flexible wire-shaped microsupercapacitors that can be woven into a jacket, shirt or dress. "The area of clothing is fixed, so to generate the power density need... » read more

Defining Sufficient Coverage
By Brian Bailey - 28 Dec, 2015 - Comments: 0

Semiconductor engineering sat down to discuss the definition of sufficiency of coverage as a part of verification closure with Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Willard Tu, director of embedded segment marketing for [getentity id="22186" comment="ARM"]; Larry Vivolo was, at the time of this roundtable, senior director of product marketing for [get... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Dec, 2015 - Comments: 0

South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of So... » read more

The Week In Review: Design/IoT
By Ed Sperling - 24 Dec, 2015 - Comments: 0

Acquisitions Synopsys acquired Australia's Goanna Software, a security company focused on static code analysis tools for improving code quality. Synopsys said the acquisition is part of its strategy to improve software sign-off, but the acquisition also expands Synopsys' presence in Australia and the Asia/Pacific region. Terms of the deal were not made public. Synopsys has been steadily build... » read more

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