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Special Reports

Top-Down Vs. Bottom-Up Chiplet Design

By: Ann Mutschler

Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

HBM Options Increase As AI Demand Soars

By: Laura Peters

But manufacturing reliable 3D DRAM stacks with good yield is complex and costly.

Shift Left Is The Tip Of The Iceberg

By: Brian Bailey

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

Aging, Complexity, And AI In Analog Design

Where digital and analog designs are overlapping, and why it's becoming more difficult ...

November 27th, 2024 By Ed Sperling

Slow Progress On Generative EDA

The dream may be to have generative AI write RTL, but text is only one of the necessary...

November 26th, 2024 By Brian Bailey

How AI Is Transforming System Design

LLMs and machine learning are automating expertise in an aging workforce.

November 26th, 2024 By Adam Kovac

FOPLP Gains Traction in Advanced Semiconductor Packaging

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node...

November 21st, 2024 By Gregory Haley

New Tradeoffs In Leading-Edge Chip Design

Monolithic integration builds from the top down and the bottom up.

November 21st, 2024 By Katherine Derbyshire

One Chip Vs. Many Chiplets

Challenges and options vary widely depending on markets, workloads, and economics.

November 20th, 2024 By Ed Sperling

Asia Government Funding Surges

Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia...

November 18th, 2024 By Liz Allan

Managing The Huge Power Demands Of AI Everywhere

More efficient hardware, better planning, and better utilization of available power can...

November 14th, 2024 By Ann Mutschler

New AI Data Types Emerge

Several PPA considerations mean no single type of data is ideal for all AI models.

November 14th, 2024 By Bryon Moyer

RISC-V’s Software Portability Challenge

A hardware-software contract is needed for software portability, but RISC-V is not yet ...

November 13th, 2024 By Brian Bailey

Advanced Packaging Drives Test And Metrology Innovations

Complex devices are pushing test and metrology tools to their limits, but solutions are...

November 12th, 2024 By Gregory Haley

Yield Management Embraces Expanding Role

From wafer maps to lifecycle management, yield strategies go wide and deep with big data.

November 12th, 2024 By Laura Peters

Latest News

Chip Industry Week In Review

IC industry on track to $1T by 2030; Xiaomi to use own mobile processors in 2025; Korea's FOPLP; CHIPS Act rush to fund; Samsung's new leaders; S Korea's chip sup...

November 29th, 2024 By The SE Staff

Chip Industry Week In Review

SK hynix's 321-high NAND; Cadence's system chiplet; Eliyan's interconnect chiplet; CEO turnovers; GF's funding finalized; SRC's digital twin win; Enfabrica fundin...

November 22nd, 2024 By The SE Staff

more news »

Opinion

Goal-Driven AI

Any optimization problem must have a clear, unambiguous specif...

November 26th, 2024 By Brian Bailey

GenAI + Semiconductors + Humanity

AI will change the semiconductor startup ecosystem in myriad w...

November 25th, 2024 By Barry Pangrle

more opinions »

more research »

Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

By Jesse Allen

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

By Jesse Allen

more startups »

Special Reports

Top Stories

Aging, Complexity, And AI In Analog Design

Slow Progress On Generative EDA

How AI Is Transforming System Design

FOPLP Gains Traction in Advanced Semiconductor Packaging

New Tradeoffs In Leading-Edge Chip Design

One Chip Vs. Many Chiplets

Asia Government Funding Surges

Managing The Huge Power Demands Of AI Everywhere

New AI Data Types Emerge

RISC-V’s Software Portability Challenge

Advanced Packaging Drives Test And Metrology Innovations

Yield Management Embraces Expanding Role

Latest News

Chip Industry Week In Review

Chip Industry Week In Review

Opinion

Goal-Driven AI

GenAI + Semiconductors + Humanity

Research

Chip Industry Technical Paper Roundup: Nov. 25

Research Bits: Nov. 25

Research Bits: Nov. 19

Startup Corner

Startup Funding: Q3 2024

Startup Funding: Q2 2024

Videos

Using Formal For RISC-V Security

Scaling Performance In AI Systems

Globally Asynchronous, Locally Synchronous Clocks

Working With Chiplets

Knowledge Centers / Entities, people and technologies explored

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