Special Reports

Navigating Increased Complexity In Advanced Packaging

By: Gregory Haley

Variability is a growing challenge; achieving higher yields requires even tighter control and precision.
Auto Chip Aging Accelerates In Hot Climates

By: Ed Sperling

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
NAND Flash Targets 1,000 Layers

By: Bryon Moyer

New techniques go beyond improved deposition and etching, but challenges stack up, too.

 more »

Top Stories

Semiconductor Engineering’s Special Reports 2024

A compendium of essential information for the chip industry.

Strain, Stress In Advanced Packages Drives New Design Approaches

Heterogenous integration is pushing chip and package designers to consider multi-physic...

Improving Verification Performance

Verification tools are getting faster and capacity is increasing, but they still can't ...

SLM Evolves Into Critical Aspect Of Chip Design And Operation

Silicon lifecycle management applications and techniques are gaining traction as chipma...

RISC-V Profiles Help Conformance

More than just the processor needs to be defined for standard operating systems. Profil...

Baby Steps Toward 3D DRAM

Stacking layers means a complete architecture rethink.

Challenges In Powering Electrification With GaN And SiC

No single material is ideal, but unique combinations are emerging.

Shortcutting Graduates’ Path To Productivity In Manufacturing And Test

Semiconductor companies are working with universities to custom-build engineering curri...

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happe...

Chiplet Interconnects Add Power And Signal Integrity Issues

More choices, interactions, and tiny dimensions create huge headaches.

Where Is The Software For Shift Left?

Shift left requires abstractions on which early analysis can be performed. For architec...

Why Chips Fail, And What To Do About It

Improving reliability in semiconductors is critical for automotive, data centers, and A...

more top stories »

Latest News

Chip Industry Week In Review

U.S. launches trade investigation into China; Cohu to buy Tignis; NXP’s new acquisition; flurry of government fundings; Alphawave Semi's speedy UCIe IP; advance...

Blog Review: Dec. 18

Shifts in design and manufacturing; CFD meshing; UALink; dynamic voltage drop analysis; IoT vision.

more news »



Opinion

Design And Verification Issues In 2024

What have you been reading over the past year? This often indi...

Goal-Driven AI

Any optimization problem must have a clear, unambiguous specif...

more opinions »



Research

Research Bits: Dec. 24

Growing multilayered chips; atomic-scale diamond processing; m...

Chip Industry Technical Paper Roundup: Dec. 23

Memory at extreme temps; CXL to optimize bandwidth; partitione...

Research Bits: Dec. 16

Flexible electronics: Soft liquid metal vias; stretchable TENG...

more research »



Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

more startups »

Videos

Distributed Voltage And Frequency Scaling Gaining Traction


Speeding Up Acoustic Wafer Inspection


The Evolution of HBM


Using Formal For RISC-V Security


Knowledge Centers / Entities, people and technologies explored