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Ann Mutschler

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Ann Mutschler is executive editor at Semiconductor Engineering.

Author's Latest Posts

Architecting Chips For High-Performance Computing
By Ann Mutschler - 15 Apr, 2024 - Comments: 0

The world’s leading hyperscaler cloud data center companies — Amazon, Google, Meta, Microsoft, Oracle, and Akamai — are launching heterogeneous, multi-core architectures specifically for the cloud, and the impact is being felt in high-performance CPU development across the chip industry. It's unlikely that any these chips will ever be sold commercially. They are optimized for specific ... » read more

Using AI/ML To Minimize IR Drop
By Ann Mutschler - 11 Apr, 2024 - Comments: 0

IR drop is becoming a much bigger problem as technology nodes scale and more components are packed into advanced packages. This is partly a result of physics, but it's also the result of how the design flow is structured. In most cases, AI/ML can help. The underlying problem is that moving to advanced process nodes, and now 3D-ICs, is driving current densities higher, while the power envelop... » read more

V2X Security Is Multi-faceted, And Not All There
By Ann Mutschler - 27 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and potential security issues, with Shawn Carpenter, program director, 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

3D-IC Intensifies Demand For Multi-Physics Simulation
By Ann Mutschler - 20 Mar, 2024 - Comments: 0

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design flow, expand and alter job responsibilities, and bring together the analog and digital design worlds in unprecedented ways. 3D-ICs will be the highest-performance advanced packaging option, in s... » read more

Security Is Critical For Commercial Chiplets
By Ann Mutschler - 13 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the security issues and requirements in commercial chiplet ecosystem, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA prod... » read more

V2X Path To Deployment Still Murky
By Ann Mutschler - 07 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment, with Shawn Carpenter, program director for 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Chiplet IP Standards Are Just The Beginning
By Ann Mutschler - 06 Mar, 2024 - Comments: 2

Experts at the Table: Semiconductor Engineering sat down to talk about chiplet standards, interoperability, and the need for highly customized AI chiplets, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen S... » read more

Commercial Chiplet Ecosystem May Be A Decade Away
By Ann Mutschler - 29 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product mana... » read more

AI Tradeoffs At The Edge
By Ann Mutschler - 15 Feb, 2024 - Comments: 0

AI is impacting almost every application area imaginable, but increasingly it is moving from the data center to the edge, where larger amounts of data need to be processed much more quickly than in the past. This has set off a scramble for massive improvements in performance much closer to the source of data, but with a familiar set of caveats — it must use very little power, be affordable... » read more

Software-Defined Vehicles Ready To Roll
By Ann Mutschler - 05 Feb, 2024 - Comments: 0

Software-defined vehicles are driving a swell of activity across the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features. The SDV approach encompasses more than a single concept. It helps to think of it more as a modeling approach that connects EVs, driver assistance technology, and... » read more

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