Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

China’s Foundry Biz Takes Big Leap Forward
By Mark LaPedus - 28 Jan, 2019 - Comments: 1

China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Jan, 2019 - Comments: 0

Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

Fearless chip and fab tool forecasts
By Mark LaPedus - 24 Jan, 2019 - Comments: 1

2019 is expected to be a challenging, if not confusing, year for the semiconductor and fab equipment industries. For example, Apple recently issued a warning about lackluster smartphone demand, which impacted several IC vendors and foundries. Then, the memory market is plummeting. In addition, the 10nm/7nm transition has proven to be difficult for many. And let’s not forget the geopolitica... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

What’s Next For AI, Quantum Chips
By Mark LaPedus - 24 Jan, 2019 - Comments: 1

Semiconductor Engineering sat down to discuss the latest R&D trends with Luc Van den hove, president and chief executive of Imec; Emmanuel Sabonnadière, chief executive of Leti; and An Chen, executive director for the Nanoelectronics Research Initiative at the Semiconductor Research Corp. (SRC). Chen is on assignment from IBM. What follows are excerpts of those conversations, which took pl... » read more

Manufacturing Bits: Jan. 22
By Mark LaPedus - 22 Jan, 2019 - Comments: 1

Open-source CVD Boise State University has developed an inexpensive chemical vapor deposition (CVD) system to enable the growth of two-dimensional (2D) materials. Using open-source designs and off-the-shelf components, researchers have developed an automated CVD system for $30,000 in hardware costs, according to Boise State in the journal PLoS One. 2D materials could enable a new class ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jan, 2019 - Comments: 1

Fab tools and materials Applied Materials is expected to remain the world’s largest semiconductor equipment supplier in terms of projected sales for 2018, according to a preliminary forecast of the rankings from VLSI Research. Applied will have $14 billion in sales in 2018, according to the firm. Applied is the leader in terms of overall projected sales in 2018, followed in order by ASM... » read more

Machine Learning For IC Production
By Mark LaPedus - 16 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Manufacturing Bits: Jan. 14
By Mark LaPedus - 14 Jan, 2019 - Comments: 0

Tracking cell movement Using a technology called cyro-electron microscopy (cryo-EM), Sanford Burnham Prebys Medical Discovery Institute (SBP) and the University of North Carolina at Chapel Hill (UNC-Chapel Hill) have gained a better understanding of how cells move in living organisms. Cells, the basic building blocks of living things, need to move. Moving cells help enable embryonic develop... » read more

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