Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Foundries See Growth, New Issues In 2019
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

The silicon foundry business is poised for growth in 2019, although the industry faces several challenges across a number of market segments next year. Generally, foundry vendors saw steady growth in 2018, but many are ending the year on a sour note. Weak demand for Apple’s new iPhone XR and a downturn in the cryptocurrency market have impacted several IC suppliers and foundries, causing t... » read more

5 Observations From Intel’s Event
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

Not long ago, Intel hosted its “Architecture Day,” where top executives from the chip giant revealed the company’s latest products and next-generation technologies. The company also discussed its strategy. To be sure, it’s a critical time for Intel. In June, Brian Krzanich was forced out as chief executive and the company is still looking for a permanent CEO. Plus, Intel has delayed it... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Dec, 2018 - Comments: 2

Intel Mark Bohr, a senior fellow and director of process architecture and integration at Intel, is retiring, according to the company. Bohr, who will retire at the end of February 2019, held various technology positions during his 41-year career at Intel. Here is a quick bio on Bohr. Others have also recently retired from Intel’s manufacturing unit amid a massive reorganization in the depart... » read more

Manufacturing Bits: Dec. 11
By Mark LaPedus - 11 Dec, 2018 - Comments: 0

FinFET vs. FD-SOI pH sensors At the recent 2018 IEEE International Electron Devices Meeting (IEDM), TSMC and National Tsing Hua University presented a paper on an ion detector or pH sensor based on a 16nm finFET technology. Researchers have developed an advanced version of an ion-sensitive field-effect transistor (ISFET). Originally developed in the 1970s, ISFETs are pH sensors that are use... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Dec, 2018 - Comments: 0

Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective immediately. Archer, who served as Lam’s president and chief operating officer, has been named to the board. One analyst provided a comment on the situation at Lam. “In our view, Mr. Archer is very... » read more

Manufacturing Bits: Dec. 4
By Mark LaPedus - 04 Dec, 2018 - Comments: 0

Probing Mars Equipped with a CCD camera, a temperature probe and a seismic instrument, NASA's robotic system or lander recently landed on Mars. On Nov. 26, the robotic system--dubbed the Interior Exploration using Seismic Investigations, Geodesy and Heat Transport (InSight)--landed on Mars after nearly a seven-month, 300-million-mile (485-million-kilometer) journey from Earth. The lander t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Nov, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Manufacturing Bits: Nov. 27
By Mark LaPedus - 27 Nov, 2018 - Comments: 0

New kilogram definition After years of debate and scientific work, a group of delegates from 60 countries have voted to redefine four key unit measurements—the kilogram, electric current (ampere), temperature (kelvin), and the amount of substance (mole). The vote took place at the recent 26th General Conference of Weights and Measures. Hosted by the International Bureau of Weights and Mea... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Nov, 2018 - Comments: 0

R&D Imec and CEA-Leti have signed a memorandum of understanding under which the two R&D organizations will form a strategic partnership in the domains of artificial intelligence and quantum computing. Europe hopes to accelerate its effort in both AI and quantum computing. Market research TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues f... » read more

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