Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices


The paper provides an overview of the topology for bidirectional converters and discusses their different usage. Bidirectional energy flow applications are usually found in energy storage systems, battery systems, and can be categorized as grid-connected and DC-DC-connected. In grid-connected applications, two power conversion stages, which are power factor corrector (PFC) rectifier/inverter an... » read more

Formal Verification Of Synthesizable C++/SystemC Designs


Formally checking generated RTL can be difficult to analyze as errors cannot be correlated to the HLS source code. Questa HLV can help overcome this challenge with high-level verification. Siemens offers several apps to verify and clean C++ HLS code before running HLS and then check the equivalency between C++ and RTL. High-level synthesis (HLS) is a design flow in which design intent is des... » read more

Blog Review: Jan. 7


Cadence's Reela Samuel presents an overview of through-silicon vias, including structure, pitch, and electrical behavior, key layout rules such as keep-out zones and stress constraints, and how TSV parasitics influence bandwidth, latency, and system-level performance. Siemens' Andras Vass-Varnai identifies five thermal trends to watch and how they’ll reshape design and packaging workflows ... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)


A new technical paper titled "Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning" was published by researchers at University of Ottawa. Abstract "Advanced 2.5D flip-chip packages with silicon/glass interposers may pose tightly coupled thermo-mechanical trade-offs. This work presents a simulation-driven, ... » read more

Thermal Scanning-Probe Lithography in vdW Heterostructures (Technical University of Denmark)


A new technical paper titled "Gradient Electronic Landscapes in van der Waals Heterostructures" was published by researchers at Technical University of Denmark. Abstract Excerpt "Here, we use thermal scanning-probe lithography to produce smooth topographic landscapes in vdW heterostructures by patterning the thickness of the top hBN flake with nanometer precision." Find the technical p... » read more

A Review Of Acoustic Side-Channel Attacks: An AI View (Penn State Univ.)


A new technical paper titled "A Survey on Acoustic Side-Channel Attacks: An Artificial Intelligence Perspective" was published by researchers at Penn State University. Abstract "Acoustic Side-Channel Attacks (ASCAs) exploit the sound produced by keyboards and other devices to infer sensitive information without breaching software or network defenses. Recent advances in deep learning, large ... » read more

Research Bits: Jan. 6


Ultrathin ferroelectric capacitors Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory capacitor stack using scandium-substituted aluminum nitride ((Al,Sc)N) thin films with platinum electrodes. The total thickness is just 30nm: a 20nm ferroelectric layer sandwiched between 5nm platinum top and bottom electrodes. “Previous r... » read more

Chip Industry Technical Paper Roundup: Jan 6


New technical papers recently added to Semiconductor Engineering’s library: [table id=510 /] Find more semiconductor research papers here. » read more

Cryogenic Etch: A Key Enabler Of 3D NAND


Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications. Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance gains. With each new generation, NAND suppliers deliver 50% faster read/write speeds, 40% greater bit density, lower latency, ... » read more

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