Analysis of Thermal and Mechanical Behavior for Advanced Packaging (Sungkyunkwan Univ. et al)


A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was published by researchers at Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University. Abstract Excerpt “... » read more

Data-Centric ML Compiler For PIM (U. of Toronto, Barcelona Supercomputing Center, ETH Zurich, Max Planck)


A new technical paper titled "A Tensor Compiler for Processing-In-Memory Architectures" was published by researchers at University of Toronto, Barcelona Supercomputing Center, ETH Zurich, and the Max Planck Institute for Software Systems. Abstract "Processing-In-Memory (PIM) devices integrated with high-performance Host processors (e.g., GPUs) can accelerate memory-intensive kernels in Ma... » read more

Structural Integrity Assessment of IC Packaging Using Scanning Acoustic Microscopy (Arizona State Univ., Fraunhofer IMWS)


A new technical paper titled "Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review" was published by researchers at Arizona State University and Fraunhofer Institute for Microstructure of Materials and Systems IMWS. Abstract "Microelectronic packaging is crucial for protecting, powering, and interconnecting semi... » read more

Chip Industry Week in Review


Government funding/defunding NIST is terminating funding for the SMART USA Institute, a CHIPS Act research center focused on digital twins, prompting congressional concern that the decision disrupts active awards and weakens U.S. semiconductor R&D commitments. Korea Zinc was awarded $210M in CHIPS Act funding towards a new $6.6B Tennessee advanced smelter and minerals processing facility,... » read more

Multiple QPUs With Slow Interconnects Can Outperform Single QPU Monolithic Architecture (IonQ, Aalto Univ.)


A new technical paper titled "Advantage in distributed quantum computing with slow interconnects" was published by researchers at IonQ Inc. and Aalto University. Abstract "The main bottleneck for distributed quantum computing is the rate at which entanglement is produced between quantum processing units (QPUs). In this work, we prove that multiple QPUs connected through slow interconnects... » read more

Unlocking Next-Gen Thermal Management: Why Indium-Based Metal TIMs Are Game-Changers


As electronic devices become more powerful and compact, thermal management has become one of the most critical challenges in advanced electronic packaging. High-performance processors used in AI computing, data centers, and 5G/6G infrastructure generate significant heat, and failure to dissipate effectively can lead to reduced performance, reliability issues, and even catastrophic component fai... » read more

Faster Mask Synthesis With GPUs


Design teams face rising pressure to deliver larger chips with higher transistor densities on tighter schedules using advanced node processing. The computing demands of modern applications, especially those making heavy use of AI, are extending pressure beyond design to every step of the development flow, including manufacturing, where photolithography and mask synthesis must keep pace. This po... » read more

Minimizing Voltage Loss And Improving Yield In Advanced GAA Chips


The problem: As metal pitch scaling shrinks to support the next generation of logic devices, the IR (or voltage) drop from conventional frontside connections has become a major challenge [1,2]. As electricity travels through a chip’s metal wiring, some voltage gets lost because wires have resistance. If the voltage drops too much, the chip’s transistors can’t get enough power and ... » read more

Reliability Risks Shift To The Materials Stack


The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

What’s Next for 2.5D Packaging?


Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they're built and assembled. Interposers are becoming thicker and more complex, while bridges are being used to reduce the assembled cost. Both efforts are facing new challenges. Interposers are effectively platforms on which mu... » read more

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