Business & Marketing Strategies

Body Biasing For Analog Design

Practical experiences In 22nm FD-SOI.

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies

In-chip monitoring subsystem solutions down to 7nm.

Co-modeling: A Powerful Capability For Hardware Emulation

A new approach for verification and validation.

Enabling Synchronized Hardware Software Debug With Verdi

An instruction-accurate embedded processor debug solution.

Fan-Outs vs. TSVs

Market for advanced packaging begins to diverge based on performance and price.

blog (more)

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

Getting Power Management Right

There are many technical avenues to managing the power in heterogenous SoCs t...

Quantum Madness

Multiple companies focus on qubits as next computing wave, but problems remai...

An Incremental Approach To Reusing Automated Tests From IPs To SoCs

Getting started with portable stimulus at the block, subsystem, and system le...

Blogs - MD (more)

The Next 5 Years Of Semiconductor Technology

How far can existing technology be extended?

Semiconductor Wafer Demand: Growing Pains

Unit growth more than 13%, but selling prices are down and wafers are in shor...

Automotive Foundries

As traditional market boundaries fall, Tier 1s will square off against commer...

Blogs - PTES (more)

Advanced Packaging Is Suddenly Very Cool

In spite of the initial reasons for this technology, it is now viewed as the ...

That Was The Year That Was In Test

2017 featured a big proposed acquisition.

At The Intersection Of Electronics And Automobiles

Self-driving cars have the potential to increase productivity and change soci...

Blogs - Security (more)

The IoT Is Alive And Well

Rumors of its lackluster growth appear to be company- or segment-specific.

Automotive Opps Drive Change For Systems Companies

Is an automotive IP provider now more of a systems company?

How To Sleep Easier If You Test Auto ICs For A Living

Final testing can be up to 30% of an automotive IC's total cost. Can you redu...

Blogs - SLD (more)

Good Solutions Create Problems

The advent of cheap, fast manufacturing and instant sales channels is overwhe...

UVM Can Kill You. More News At 11

Titles get complex when writing about UVM.

More Volatility Ahead

The gyrations in semiconductor stocks are just the beginning.

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

Tech Talk: 802.11ax Multi-User

How the new standard improves wireless bandwidth in the home and office and w...

The Week in Review: IoT

Riot Micro’s chip; startup funding; IDC’s IoT forecast.

The IoT Is Alive And Well

Rumors of its lackluster growth appear to be company- or segment-specific.

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Body Biasing For Analog Design

Practical experiences In 22nm FD-SOI.

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies

In-chip monitoring subsystem solutions down to 7nm.

Co-modeling: A Powerful Capability For Hardware Emulation

A new approach for verification and validation.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

Manufacturing Bits: Dec. 12

3D diodes; CMOS photon detector; SOI radiation sensor.

The Week In Review: Manufacturing

Fab tool trade theft; TSMC vendor awards; 10nm/7nm; nano ICs.

Manufacturing Bits: Dec. 5

Intel vs. GF; fusion power; neutrinos; dark matter.

News (more)

Blog Review: Dec. 13

Pattern matching; short USB cables; DoD sourcing; cybersecurity in Congress; ...

The Week In Review: Manufacturing

Fab tool trade theft; TSMC vendor awards; 10nm/7nm; nano ICs.

The Week in Review: IoT

Riot Micro’s chip; startup funding; IDC’s IoT forecast.

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

Fan-Outs vs. TSVs

Market for advanced packaging begins to diverge based on performance and pric...

Advanced Packaging Is Suddenly Very Cool

In spite of the initial reasons for this technology, it is now viewed as the ...

Reliability Of Embedded Wafer-Level BGA For Automotive Radar Applications

A look at the recent advances in board-level reliability performance of eWLB.

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Dec. 12

3D diodes; CMOS photon detector; SOI radiation sensor.

System Bits: Dec. 12

Packageless processors; improving AI accuracy; superconductivity rules.

Power/Performance Bits: Dec. 12

Sunny days slow 5G; MoS2 for security; semi-transparent solar.

Round Tables (more)

Could Liquid IP Lead To Better Chips?

Experts at the Table, part 2: What is the business model associated with liqu...

Which Verification Engine?

Experts at the Table, part 2: The real value of multiple verification engines...

Could Liquid IP Lead To Better Chips?

Experts at the Table, part 1: High-level synthesis has been shown to produce ...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Shortages Hit Packaging Biz

Unexpected spike in IC demand is spilling over into the packaging supply chain.

China’s Ambitious Automotive Plans

After years of playing catch-up to multinationals, the country is targeting a...

What’s Next For Atomic Layer Etch?

Technology begins shipping, but which approaches work best, and where, is sti...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Aeponyx: Optical Chips For Telecom

New company seeks to cut cost of optical switch by 10X, improve performance b...

Performance-IP: Less Memory Latency

Embedded IP improves performance by identifying and isolating random requests.

Fractilia: Pattern Roughness Metrology

Litho expert Chris Mack has started a new company that addresses line-edge ro...

System-Level Design (more)

Blog Review: Dec. 13

Pattern matching; short USB cables; DoD sourcing; cybersecurity in Congress; ...

Could Liquid IP Lead To Better Chips?

Experts at the Table, part 2: What is the business model associated with liqu...

System Bits: Dec. 12

Packageless processors; improving AI accuracy; superconductivity rules.

Technical Papers (more)

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

How Neural Networks Think (MIT)

General-purpose technique sheds light on inner workings of neural nets traine...

New AI algorithm monitors sleep with radio waves (MIT & Mass General)

Learning Sleep Stages from Radio Signals

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Fan-Outs vs. TSVs

Market for advanced packaging begins to diverge based on performance and pric...

Could Liquid IP Lead To Better Chips?

Experts at the Table, part 2: What is the business model associated with liqu...

Changes Ahead For Test

Testing microprocessors, microcontrollers, application processors, and other ...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

Week In Review: Design

Acquisitions; Intel security vulnerability; AI chip for health care.

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

How Neural Networks Think (MIT)

General-purpose technique sheds light on inner workings of neural nets traine...

Videos (more)

Tech Talk: 802.11ax Multi-User

How the new standard improves wireless bandwidth in the home and office and w...

Tech Talk: MCU Acceleration

How to boost the performance and efficiency of microcontrollers using eFPGAs.

Tech Talk: Verification

How verification will change as chips are used in machine learning, medical, ...

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Body Biasing For Analog Design

Practical experiences In 22nm FD-SOI.

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies

In-chip monitoring subsystem solutions down to 7nm.

Co-modeling: A Powerful Capability For Hardware Emulation

A new approach for verification and validation.


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