Week In Review: Manufacturing, Test
Intel fab reorg; EUV race; expensive 5G phones.
Week in Review: IoT, Security, Auto
Arm Neoverse; raising Arizona R&D; Samsung buys Zhilabs.
Week In Review: Design, Low Power
Arm's roadmap; AI architecture exploration; SoC development IDE.
EUV’s Uncertain Future
Litho tech has finally arrived after years of delays and billions of dollars in investments. Now the question is who still needs it.
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
The Week in Review: IoT
IoT market growth; investments in IoT; Cambium products.
Generically Reusable IP No One Uses
If we just keep putting generically reusable on the box, all we’re doing is...
Making AI Run Faster
Why inferencing is the next battleground.
ML Becomes Useful For Variation Coverage
Engineering teams are starting to make SoC design choices based on manufactur...
Re-using Common Simulation Set-Up Processes To Speed Regression
A new reuse methodology shortens drawn-out design verification cycles.
EUV’s Uncertain Future
Litho tech has finally arrived after years of delays and billions of dollars ...
Digging Deep Into High Aspect Ratio Process Control For Memory Technology
3D NAND has led to complex deposition and etch with angstrom-level precision ...
SerDes For Chiplets
The key goals are low power and high bandwidth over extremely short distances.
Why Test Costs Will Increase
New materials, applications and packaging are changing the economics of testi...
Collaboration And Advanced Substrates
Many companies have requirements that don't fit neatly into the CMOS roadmap.
Adding AI To The IoT
Putting complex algorithms into billions of things radically changes the land...
Reconfigurable eFPGA For Aerospace Applications
Flexibility is critical for satellites that may be orbiting for 20 years.
Automotive Safety Requirements Impact Ecosystem
Meeting OEM requirements for safety includes the human component, as well a n...
What Will Intel Do Next?
As demand for application-specific chips accelerates, general-purpose process...
The Perfect Risk
There is no such thing as a risk-free design, but how does a company balance ...
A Paradigm Shift With Vertical Nanowire FETs For 5nm And Beyond
What moving to the latest transistor types will mean for IC designers.
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
Week in Review: IoT, Security, Auto
Arm Neoverse; raising Arizona R&D; Samsung buys Zhilabs.
FAA Traffic Management Anticipates Flying Cars
The plans for a drone air-traffic control system may set the ground work for ...
Adding AI To The IoT
Putting complex algorithms into billions of things radically changes the land...
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
The Building Blocks Of Future Compute
How Arm sees its role in emerging segments of tomorrow’s compute challenges.
Power/Performance Bits: Oct. 16
On-chip modulator; building a resilient solar grid; boosting fiber-optic netw...
RISC-V: More Than a Core
Interest in the open-source ISA marks a significant shift among chipmakers, b...
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
Week In Review: Manufacturing, Test
Intel fab reorg; EUV race; expensive 5G phones.
EUV’s Uncertain Future
Litho tech has finally arrived after years of delays and billions of dollars ...
Week In Review: Manufacturing, Test
Intel fab reorg; EUV race; expensive 5G phones.
Week in Review: IoT, Security, Auto
Arm Neoverse; raising Arizona R&D; Samsung buys Zhilabs.
Week In Review: Design, Low Power
Arm's roadmap; AI architecture exploration; SoC development IDE.
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
SerDes For Chiplets
The key goals are low power and high bandwidth over extremely short distances.
Speedier, More Accurate Testing of Automotive Sensors Is Here
Combining stimulus test cells with automated handlers to create a multi-test ...
5G Test And Deployment
How test will change as next-gen wireless evolves toward higher frequencies.
TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
10nm heads into full swing, with 7nm and 5nm on the horizon.
Green Computing: GPUs Strike Back
Speed matters, but so does efficiency.
Making Waves In Deep Learning
How deep learning applications will map onto a chip.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: Oct. 16
World’s fastest camera; searching for bacteria.
System Bits: Oct. 16
Quantum verification; quantum hackproof security; quantum algorithms.
Power/Performance Bits: Oct. 16
On-chip modulator; building a resilient solar grid; boosting fiber-optic netw...
Machine Learning Invades IC Production
Experts at the Table, part 1: Will machine learning and AI improve chip manuf...
So Many Waivers Hiding Issues
Experts at the Table, part 2: Domain crossings can produce thousands of waive...
Domain Crossing Nightmares
Experts at the Table, part 1: How many domain crossings exist in a typical So...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
Power Delivery Affecting Performance At 7nm
Slowdown due to impact on timing, and dependencies between power, thermal and...
RISC-V Inches Toward The Center
Access to source code makes it attractive for custom applications, but gaps r...
People Vs. Self-Driving Cars
Why auto tech companies are so concerned about interactions with humans.
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
Startup Puts Quantum Security on USB, Dongles
Taking quantum-mechanical principles and dragging them kicking and screaming ...
Baum: Finding SoC Power Flaws
Identifying power design flaws early with time/power-use analysis.
Carbon Nanotube DRAM
Is carbon nanotube memory too good to be true?
Week In Review: Design, Low Power
Arm's roadmap; AI architecture exploration; SoC development IDE.
Blog Review: Oct. 17
Power in high-performance mobile; compression basics; memory market indicators.
System Bits: Oct. 16
Quantum verification; quantum hackproof security; quantum algorithms.
Machine Learning Based Prediction: Health Behavior on BP
ML algorithm + individual data = personalized recommendations to reduce blood...
Silicon CMOS Architecture For A Spin-based Quantum Computer
UNSW researchers have shown how a quantum computer can be manufactured using ...
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Wanted: Mask Equipment for Mature Nodes
Shortfall caused by demand spike for analog, MEMS and RF chips.
Can Graphene Be Mass Manufactured?
Numerous questions surface about whether 2D materials are the best choice for...
Machine Learning Invades IC Production
Experts at the Table, part 1: Will machine learning and AI improve chip manuf...
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
designHUB: Design Reuse Made Real
Why companies need to reassess legacy processes, tools and design management ...
Cure The Common Cold…
...And much more. A call for papers for Arm TechCon.
The Week in Review: IoT
Orangeworm; medical insecurity; SamSam ransomware.
Variation At 10/7nm
Why the middle of line is now a major problem.
What Is SOTIF?
How Safety of the Intended Functionality will affect autonomous vehicle design.
Using ASICs For AI Inferencing
How to speed up artificial intelligence in edge devices and data centers.
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
Speedier, More Accurate Testing of Automotive Sensors Is Here
Combining stimulus test cells with automated handlers to create a multi-test ...
Boosting Regression Throughput By Reusing Setup Phase Simulation
How to leverage the initial setup phase simulation for different tests.
Insight Into The Evolution Of Vehicle Electrification
2018 SAE Reader Survey
Published on October 10th, 2018 by
ANSYS
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