Manufacturing Bits: June 18
Making microvias in packages; flexible fan-out.
Power/Performance Bits: June 18
Multi-value logic transistor; graphene band gap; finding faked images.
System Bits: June 18
U of T wins again; smooth drone landings; safer batteries.
AiMotive Is EDA For Self-Driving Cars
Staying alive in the automated vehicle biz.
Circuit Aging Becoming A Critical Consideration
As reliability demands soar in automotive and other safety-related markets, tools vendors are focusing on an area often ignored in the past.
What’s in a Name?
Test Vision 2020 may need a new moniker.
NIWeek Test Talk
National Instruments executives discuss semiconductor testing.
The Best in Test
VLSI Research recognizes leading test vendors.
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
Functional Safety: A Way Of Life
Functional safety starts with cultivating the right culture within a company.
Shhhhh… Deadlocks Anonymous In Session
Deadlocks are more prevalent than anyone wants to admit, so how do we deal wi...
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
The Week in Review: IoT
IoT market growth; investments in IoT; Cambium products.
Generically Reusable IP No One Uses
If we just keep putting generically reusable on the box, all we’re doing is...
Playing Into China’s Hands
A trade war couldn't occur at a worse time for the rest of the tech industry.
Building Your First Chip For Artificial Intelligence? Read This First
To make more effective and optimized AI SoCs, look beyond traditional design ...
HBM2e Offers Solid Path For AI Accelerators
AI processor performance is rapidly growing, making memory architecture choic...
The Arm-Huawei Disconnect
Setting the record straight on what's really going on behind the scenes.
Impact Of U.S.-China Trade War
Experts look at the impact of the semi and materials sectors.
Thinking Differently About IIoT Analytics
How to make machines more efficient and reliable.
Test Moving Forward And Backward
What used to be a discrete step in the flow is becoming less well-defined and...
Smart Plug-And-Play DFT For Arm Cores
A new RTL-based hierarchical DFT flow for subsystems with Arm cores promises ...
Algorithms And Security
AI is a moving target, and that’s unlikely to change.
Do Large Batches Always Improve Neural Network Throughput?
Understanding how large images interact with batch sizes to determine memory ...
DAC 2019: Day 3
As DAC winds down, work, play, and dreams will define the path ahead for the ...
DAC 2019: Day 2
A highly entertaining day at DAC that started and ended with music.
DAC 2019: Day 1
DAC is constantly transforming, but this year it is gambling on its future in...
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Virtual Packages Improve Signal Integrity
How to optimize chiplet architectures, including reducing in-package loss and...
SerDes For Chiplets
The key goals are low power and high bandwidth over extremely short distances.
How Much Data Can Be Pushed Through Copper Wires?
Pushing toward the Shannon signaling capacity using less energy consumption.
Crossing The Chasm: Uniting SoC And Package Verification
EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...
Will EUV Kill Multi-Patterning?
Even with EUV in play, i193 multi-patterning may still be the most cost effec...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Five steps to successful threat modeling
How to build a security plan and put it into action.
Reducing Time To Market For Security Solutions
Complex regulatory requirements and the time it takes to make security soluti...
Published on November 1st, 2018 by
Udi Maor
When The IoT Really Works
A look at the necessary ingredients to transform businesses.
Continuous Integration
Streamline software development workflow by implementing virtual platforms wi...
Making Software Development Equivalent For Models And Boards
Using the same software images for virtual and FPGA prototyping.
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
AiMotive Is EDA For Self-Driving Cars
Staying alive in the automated vehicle biz.
Week in Review: IoT, Security, Auto
Data breach & cybersecurity updates; mobility report; CrowdStrike IPO; M&...
BiST Grows Up In Automotive
Existing test concepts are being leveraged in new ways to meet stringent auto...
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
Power/Performance Bits: June 18
Multi-value logic transistor; graphene band gap; finding faked images.
Circuit Aging Becoming A Critical Consideration
As reliability demands soar in automotive and other safety-related markets, t...
Playing Into China’s Hands
A trade war couldn't occur at a worse time for the rest of the tech industry.
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
Manufacturing Bits: June 18
Making microvias in packages; flexible fan-out.
Week In Review: Manufacturing, Test
Foundry rankings; fab tool rebound?; printed electronics.
Manufacturing Bits: June 10
Predicting warpage in IC packages; machine learning fan-out.
Week In Review: Manufacturing, Test
Foundry rankings; fab tool rebound?; printed electronics.
Week in Review: IoT, Security, Auto
Data breach & cybersecurity updates; mobility report; CrowdStrike IPO; M&...
Week In Review: Design, Low Power
Intel buys Barefoot Networks; automating PCB DFM analysis; simulating autonom...
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
10nm heads into full swing, with 7nm and 5nm on the horizon.
Green Computing: GPUs Strike Back
Speed matters, but so does efficiency.
Making Waves In Deep Learning
How deep learning applications will map onto a chip.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: June 18
Making microvias in packages; flexible fan-out.
Power/Performance Bits: June 18
Multi-value logic transistor; graphene band gap; finding faked images.
System Bits: June 18
U of T wins again; smooth drone landings; safer batteries.
HBM2 Vs. GDDR6: Tradeoffs In DRAM
Experts at the Table, part 1: Choices vary depending upon application, cost a...
Disregard Safety And Security At Your Own Peril
Experts at the Table, part 1: How do automotive notions of safety and securit...
Evolution Of Verification Engineers
Experts at the Table, part 3: The role of a verification engineer will change...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
Why Chips Are Getting Noisier
Even at older nodes with mostly digital circuitry, noise is a growing problem.
Data Confusion At The Edge
Disparities in processors and data types will have an unpredictable impact on...
3D NAND Race Faces Huge Tech And Cost Challenges
Shakeout looms as vendors struggle to find ways to add more layers and increa...
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
AiMotive Is EDA For Self-Driving Cars
Staying alive in the automated vehicle biz.
Mega-Funding Rounds Continue
Startups revel in investments of billions of dollars.
April’19 Startup Funding: Corporate Gushers
Money pours into startups with more big investments on the way.
Week In Review: Design, Low Power
Intel buys Barefoot Networks; automating PCB DFM analysis; simulating autonom...
Blog Review: June 12
Cities unprepared for ransomware; femtosecond photography; persistent memory.
Week In Review: Design, Low Power
Infineon buys Cypress; massively parallel circuit simulation; HDL synthesizer...
Machine Learning Based Prediction: Health Behavior on BP
ML algorithm + individual data = personalized recommendations to reduce blood...
Silicon CMOS Architecture For A Spin-based Quantum Computer
UNSW researchers have shown how a quantum computer can be manufactured using ...
Thinking Differently About IIoT Analytics
How to make machines more efficient and reliable.
Test Moving Forward And Backward
What used to be a discrete step in the flow is becoming less well-defined and...
Tessent Hierarchical ATPG Reference Flow for Arm Cortex-A75
How to speed up the implementation of a hierarchical test solution.
2017: A Good Year for ATE
Test equipment sales were up, and so were the share prices of ATE stocks.
That Was The Year That Was In Test
2017 featured a big proposed acquisition.
2017 ITC Wrap-up
News from Advantest, Optimal+, Astronics Test Systems.
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Circuit Aging Becoming A Critical Consideration
As reliability demands soar in automotive and other safety-related markets, t...
Waiting For Chiplet Interfaces
Plug-and-play approaches are gaining mindshare, even if some of the key piece...
HBM2 Vs. GDDR6: Tradeoffs In DRAM
Experts at the Table, part 1: Choices vary depending upon application, cost a...
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
Manufacturing Bits: Dec. 18
Gallium oxide breakthroughs; super-junction SiC; groovy MOSFETs.
Memory Options And Tradeoffs
What kinds of memories work best where and why.
Using ML For Post-Silicon Validation
Why machine learning is so effective in improving chip designs.
5G Design Changes
How to get data from the core of the network to the edge.
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
Revolution By Evolution: Getting To The Next Technology Breakthrough In Analog Simulation
Updated Spectre circuit simulator addresses the need for simulating the next ...
Published on June 12th, 2019 by
Cadence
Choosing the Right Photonic Design Software
Here are the basic questions you should ask when selecting photonic design so...
Published on June 12th, 2019 by
Synopsys
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