Emulation-Driven Implementation
Tech Talk: How to improve confidence that designs will work properly in less time.
The Week In Review: Manufacturing
Intel CEO resigns; Lam rejects mini-offer; mixed memories.
The Week In Review: Design
New tools: power analysis, physical verification, CDC, and more; interconnects for AI SoCs; CCIX 1.0.
The Week in Review: IoT
Marvell notes; acquisitions; cybersecurity bill.
Materials, Magnetism & Quantum Physics
The next big breakthroughs in performance will come from completely different approaches.
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
The Week in Review: IoT
IoT market growth; investments in IoT; Cambium products.
Generically Reusable IP No One Uses
If we just keep putting generically reusable on the box, all we’re doing is...
Enabling Ethernet Time-Sensitive Networking With Automotive-Certified IP
Behind the standard that enables predictable latency and guaranteed bandwidth...
Three Steps To Low Power Coverage Closure
Verifying the complex interactions between power elements at a high abstracti...
Can Machine Learning Chips Help Develop Better Tools With Machine Learning?
New AI chips require an extreme level of architectural complexity, making rou...
Materials, Magnetism & Quantum Physics
The next big breakthroughs in performance will come from completely different...
What’s Next In R&D?
Imec CEO sees AI, auto, EUV and DNA storage.
Etch Techniques for Next-Generation Storage-Class Memory
New approaches for cloud computing and mobile applications.
New Transistor Types Vs. Packaging
No one is quite sure what comes next, and that's not a good thing.
The Best in Test
VLSI Research recognizes leading test vendors.
Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers
What's necessary to enable continued scaling and 3D integration.
Published on June 11th, 2018 by
Kim Yess
It Takes A Village To Get A Design Done
How to keep time-to-market and cost pressures under control, particularly for...
Right-Sized Security
Different strategies for different companies and markets.
The Long Pause
Level 3 cars are on the horizon. Don't expect Level 4 or 5 anytime soon.
Welcome Verification 3.0
When considering the future of verification, don't forget the human factor.
The 3D Printing Revolution
This technology is beginning to break down the barriers between form and func...
Commoditizing Constraints
Can a vendor differentiate itself by the quality of its constraint solver? Th...
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
The Week in Review: IoT
Marvell notes; acquisitions; cybersecurity bill.
It Takes A Village To Get A Design Done
How to keep time-to-market and cost pressures under control, particularly for...
The Week in Review: IoT
Auto lighting analysis; faster wireless for cars; last-level cache; Rockwell ...
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
Defining Edge Memory Requirements
Edge compute covers a wide range of applications. Understanding bandwidth and...
Power/Performance Bits: June 19
Tandem solar reaches 25.2% efficiency; battery-free implants; magnetic insula...
IoT Wireless Battles Ahead
Tradeoffs include power, performance, security. Each standard has its own ben...
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
The Week In Review: Manufacturing
Intel CEO resigns; Lam rejects mini-offer; mixed memories.
Materials, Magnetism & Quantum Physics
The next big breakthroughs in performance will come from completely different...
What’s Next In R&D?
Imec CEO sees AI, auto, EUV and DNA storage.
The Week In Review: Manufacturing
Intel CEO resigns; Lam rejects mini-offer; mixed memories.
The Week In Review: Design
New tools: power analysis, physical verification, CDC, and more; interconnect...
The Week in Review: IoT
Marvell notes; acquisitions; cybersecurity bill.
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
Advanced Packaging Confusion
Number of options and naming conventions are causing consternation throughout...
New Transistor Types Vs. Packaging
No one is quite sure what comes next, and that's not a good thing.
Sacrificial Laser Release Materials For RDL-First Fan-Out Packaging
A look at the challenges and future direction of heterogeneous integration in...
TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
10nm heads into full swing, with 7nm and 5nm on the horizon.
Green Computing: GPUs Strike Back
Speed matters, but so does efficiency.
Making Waves In Deep Learning
How deep learning applications will map onto a chip.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: June 19
Cellulose nanopaper; superconducting MoPs; oxide films.
Power/Performance Bits: June 19
Tandem solar reaches 25.2% efficiency; battery-free implants; magnetic insula...
System Bits: June 19
Faster medical image analysis; soft machines; simulating water.
CEO Outlook On Chip Industry
Part 3: The growing impact of security on design, and where the discontinuiti...
Machine Learning’s Limits
Experts at the Table, part 1: Why machine learning works in some cases and no...
CEO Outlook On Chip Industry
Part 2: Concerns grow about ethical choices and liability in AI-based safety-...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
Big Trouble At 3nm
Costs of developing a complex chip could run as high as $1.5B, while power/pe...
Progress And Chaos On Road To Autonomy
Development of autonomous vehicle technology is happening everywhere, but not...
FPGAs Becoming More SoC-Like
Lines blur as processors are added into traditional FPGAs, and programmabilit...
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
Syntiant: Analog Deep Learning Chips
Intel Capital funds startup to put AI in low-power mobile devices.
Spark Microsystems: LP On-Chip Radios
Startup seeks to displace BLE with RF that is extremely low energy.
Xceler Systems: Graph Architecture
Startup building AI chip like a brain, a few synapses at a time.
Emulation-Driven Implementation
Tech Talk: How to improve confidence that designs will work properly in less ...
The Week In Review: Design
New tools: power analysis, physical verification, CDC, and more; interconnect...
Blog Review: June 20
FD-SOI vs. finFET; OpenACC; materials and scaling; metrology at 3nm.
Silicon CMOS Architecture For A Spin-based Quantum Computer
UNSW researchers have shown how a quantum computer can be manufactured using ...
Making high-capacity data caches more efficient
Cache-management scheme that they say improves the data rate of in-package DRAM
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Quantum Computing Becoming Real
Technology has the potential to reshape processing everywhere, starting with ...
Dealing With Resistance In Chips
Contacts and interconnects becoming more problematic at each new node, but wi...
Defining Edge Memory Requirements
Edge compute covers a wide range of applications. Understanding bandwidth and...
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
designHUB: Design Reuse Made Real
Why companies need to reassess legacy processes, tools and design management ...
Cure The Common Cold…
...And much more. A call for papers for Arm TechCon.
The Week in Review: IoT
Orangeworm; medical insecurity; SamSam ransomware.
Emulation-Driven Implementation
Tech Talk: How to improve confidence that designs will work properly in less ...
Tech Talk: Connected Intelligence
A look at the slowdown in Moore's Law, and what comes next.
Tech Talk: Data-Driven Design
How more data is shifting memory architectures.
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
CMOS-Embedded STT-MRAM Arrays In 2xnm Nodes For GP-MCU Applications
Why perpendicular STT-RAM is a promising candidate for eFlash in MCU and IoT ...
High-Volume Manufacturing Device Overlay Process Control
There is a need to find more comprehensive solutions to characterize and mini...
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