The Week In Review: Manufacturing
Winners, losers in Toshiba bid; GF RF; virtual fab; EUV inspection; VC funds; memory trends; chip drivers.
The Week In Review: Design
Imagination up for sale; Silvaco buys SoC Solutions; update to AMBA CHI; RISC-V processor trace.
The Week In Review: IoT
IIoT startups get cash; Joe Costello returns to DAC; new NXP MCUs.
Wednesday At DAC
What will be the next killer app for the IoT? Plus, establishing C++ as the signoff model, new architectural challenges and tackling verification c...
Connecting The Car
ArterisIP's CEO digs into what the connected vehicle will mean for technology, business, and society.
Age Of Acceleration
Focus shifts from the fastest processors to faster processes.
ESD Guns, Transients And Testing…Oh My!
Sometimes a shock to the system is a good thing.
From SerDes Chiplets To Die-To-Die Interfaces
As demand for higher bandwidth within a similar power envelope grows, so does...
Architecture First, Node Second
Even the biggest proponents of scaling have changed their tune.
Inside Chip R&D
Imec CEO discusses R&D challenges, EUV and chips.
Focus Shifts To System Quality
Why the move toward software-defined hardware is significant, but not enough.
Leasing and Rental in T&M
There are alternatives to buying test instruments.
Inside The Maker Faire
Technology focus becoming far more practical and much more interesting.
What Happened To Aftermarket Car Audio?
With automotive OEMs pulling ‘premium audio’ in house, the aftermarket ca...
Distributed Intelligence Gets Real
How to stay productive while driving—even with both hands on the wheel.
Live From Austin—The DAC Exhibition Floor
A quick overview of three days of activities and what to plan for.
Verification Cowboys
What does it take to be a successful EDA startup? Seven verification company ...
Foundry Wars, Take Two
What multiple process nodes and market uncertainties mean to the design world.
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
The Week In Review: IoT
IIoT startups get cash; Joe Costello returns to DAC; new NXP MCUs.
The Week In Review: IoT
IDC revises IoT forecast; Qualcomm-NXP merger clears a hurdle; Dahua selects ...
The LiDAR Gold Rush
LiDAR firms attract investments as corporate and venture investors vie for a ...
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
Power/Performance Bits: June 20
Batteries from scrap metal; battery-free pacemaker.
Tech Talk: 7nm Power
Dealing with thermal effects, electromigration and other issues at the most a...
Modeling On-Chip Variation At 10/7nm
Timing and variability have long been missing from automated transistor-level...
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
The Week In Review: Manufacturing
Winners, losers in Toshiba bid; GF RF; virtual fab; EUV inspection; VC funds;...
NAND Market Hits Speed Bump
Transition from planar to 3D NAND is harder and more time-consuming than expe...
Manufacturing Bits: June 20
Solar cell metrology; photovoltaic alloys.
The Week In Review: Manufacturing
Winners, losers in Toshiba bid; GF RF; virtual fab; EUV inspection; VC funds;...
The Week In Review: Design
Imagination up for sale; Silvaco buys SoC Solutions; update to AMBA CHI; RISC...
The Week In Review: IoT
IIoT startups get cash; Joe Costello returns to DAC; new NXP MCUs.
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
Shrink Or Package?
Advanced packaging shifts to mainstream with complete flows, better tools, ma...
Chip Test Shifts Left
Semiconductor testing moves earlier in the process as quality and reliability...
Focus Shifts To System Quality
Why the move toward software-defined hardware is significant, but not enough.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: June 20
Solar cell metrology; photovoltaic alloys.
System Bits: June 20
Bespoke processors; quantum dot transistors.
Power/Performance Bits: June 20
Batteries from scrap metal; battery-free pacemaker.
Verification Unification
Experts at the Table, part 2: Strategies for using Portable Stimulus to drive...
Verification And The IoT
Experts at the Table, part 2: What is good enough, and when do you know you'r...
Verification Unification
Experts at the Table, part 1: The verification task relies on both dynamic ex...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
NAND Market Hits Speed Bump
Transition from planar to 3D NAND is harder and more time-consuming than expe...
Neuromorphic Computing: Modeling The Brain
Competing models vie to show how the brain works, but none is perfect.
Safety Plus Security: A New Challenge
First in a series: There is a price to pay for adding safety and security int...
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
Performance-IP: Less Memory Latency
Embedded IP improves performance by identifying and isolating random requests.
Fractilia: Pattern Roughness Metrology
Litho expert Chris Mack has started a new company that addresses line-edge ro...
Sigasi: Cleaner VHDL And SystemVerilog
Company applies software techniques to hardware coding.
The Week In Review: Design
Imagination up for sale; Silvaco buys SoC Solutions; update to AMBA CHI; RISC...
Wednesday At DAC
What will be the next killer app for the IoT? Plus, establishing C++ as the s...
Connecting The Car
ArterisIP's CEO digs into what the connected vehicle will mean for technology...
Synthetic Sensors: Towards General-Purpose Sensing (Carnegie Mellon Univ)
CMU's plug-In "Synthetic Sensor" transforms any room into smart environment
Design For Noise (DfN)
Using direct measurement of noise for better noise-sensitive process control.
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Connecting The Car
ArterisIP's CEO digs into what the connected vehicle will mean for technology...
Verification Unification
Experts at the Table, part 2: Strategies for using Portable Stimulus to drive...
Shrink Or Package?
Advanced packaging shifts to mainstream with complete flows, better tools, ma...
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
New BEOL/MOL Breakthroughs?
Different materials, approaches for contacts and interconnects begin to surfa...
Synthetic Sensors: Towards General-Purpose Sensing (Carnegie Mellon Univ)
CMU's plug-In "Synthetic Sensor" transforms any room into smart environment
Wearable AI System Can Detect A Conversation Tone (MIT)
An artificially intelligent, wearable system that can predict if a conversati...
Tech Talk: 7nm Power
Dealing with thermal effects, electromigration and other issues at the most a...
Tech Talk: ISO 26262
What's new in the automotive standard and how to design cars that can fail sa...
Tech Talk: Neural Networks
How to design and implement convolution neural networks, and what to watch ou...
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
Primer On Packaging
A look at the strategies behind different packaging types and approaches.
In Search Of Life On The Exoplanets
A look at some of the unusual ways analog-to-digital converters are being used.
Saving Power In A UFS Implementation Leveraging MIPI M-PHY And UniPro
How to get the best performance and lowest power with universal flash storage.
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