Business & Marketing Strategies

Emulation-Driven Implementation

Tech Talk: How to improve confidence that designs will work properly in less time.

The Week In Review: Manufacturing

Intel CEO resigns; Lam rejects mini-offer; mixed memories.

The Week In Review: Design

New tools: power analysis, physical verification, CDC, and more; interconnects for AI SoCs; CCIX 1.0.

The Week in Review: IoT

Marvell notes; acquisitions; cybersecurity bill.

Materials, Magnetism & Quantum Physics

The next big breakthroughs in performance will come from completely different approaches.

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

Enabling Ethernet Time-Sensitive Networking With Automotive-Certified IP

Behind the standard that enables predictable latency and guaranteed bandwidth...

Three Steps To Low Power Coverage Closure

Verifying the complex interactions between power elements at a high abstracti...

Can Machine Learning Chips Help Develop Better Tools With Machine Learning?

New AI chips require an extreme level of architectural complexity, making rou...

Blogs - MD (more)

Materials, Magnetism & Quantum Physics

The next big breakthroughs in performance will come from completely different...

What’s Next In R&D?

Imec CEO sees AI, auto, EUV and DNA storage.

Etch Techniques for Next-Generation Storage-Class Memory

New approaches for cloud computing and mobile applications.

Blogs - PTES (more)

New Transistor Types Vs. Packaging

No one is quite sure what comes next, and that's not a good thing.

The Best in Test

VLSI Research recognizes leading test vendors.

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers

What's necessary to enable continued scaling and 3D integration.

Blogs - Security (more)

It Takes A Village To Get A Design Done

How to keep time-to-market and cost pressures under control, particularly for...

Right-Sized Security

Different strategies for different companies and markets.

The Long Pause

Level 3 cars are on the horizon. Don't expect Level 4 or 5 anytime soon.

Blogs - SLD (more)

Welcome Verification 3.0

When considering the future of verification, don't forget the human factor.

The 3D Printing Revolution

This technology is beginning to break down the barriers between form and func...

Commoditizing Constraints

Can a vendor differentiate itself by the quality of its constraint solver? Th...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

The Week in Review: IoT

Marvell notes; acquisitions; cybersecurity bill.

It Takes A Village To Get A Design Done

How to keep time-to-market and cost pressures under control, particularly for...

The Week in Review: IoT

Auto lighting analysis; faster wireless for cars; last-level cache; Rockwell ...

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Defining Edge Memory Requirements

Edge compute covers a wide range of applications. Understanding bandwidth and...

Power/Performance Bits: June 19

Tandem solar reaches 25.2% efficiency; battery-free implants; magnetic insula...

IoT Wireless Battles Ahead

Tradeoffs include power, performance, security. Each standard has its own ben...

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

The Week In Review: Manufacturing

Intel CEO resigns; Lam rejects mini-offer; mixed memories.

Materials, Magnetism & Quantum Physics

The next big breakthroughs in performance will come from completely different...

What’s Next In R&D?

Imec CEO sees AI, auto, EUV and DNA storage.

News (more)

The Week In Review: Manufacturing

Intel CEO resigns; Lam rejects mini-offer; mixed memories.

The Week In Review: Design

New tools: power analysis, physical verification, CDC, and more; interconnect...

The Week in Review: IoT

Marvell notes; acquisitions; cybersecurity bill.

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

Advanced Packaging Confusion

Number of options and naming conventions are causing consternation throughout...

New Transistor Types Vs. Packaging

No one is quite sure what comes next, and that's not a good thing.

Sacrificial Laser Release Materials For RDL-First Fan-Out Packaging

A look at the challenges and future direction of heterogeneous integration in...

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: June 19

Cellulose nanopaper; superconducting MoPs; oxide films.

Power/Performance Bits: June 19

Tandem solar reaches 25.2% efficiency; battery-free implants; magnetic insula...

System Bits: June 19

Faster medical image analysis; soft machines; simulating water.

Round Tables (more)

CEO Outlook On Chip Industry

Part 3: The growing impact of security on design, and where the discontinuiti...

Machine Learning’s Limits

Experts at the Table, part 1: Why machine learning works in some cases and no...

CEO Outlook On Chip Industry

Part 2: Concerns grow about ethical choices and liability in AI-based safety-...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Big Trouble At 3nm

Costs of developing a complex chip could run as high as $1.5B, while power/pe...

Progress And Chaos On Road To Autonomy

Development of autonomous vehicle technology is happening everywhere, but not...

FPGAs Becoming More SoC-Like

Lines blur as processors are added into traditional FPGAs, and programmabilit...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Syntiant: Analog Deep Learning Chips

Intel Capital funds startup to put AI in low-power mobile devices.

Spark Microsystems: LP On-Chip Radios

Startup seeks to displace BLE with RF that is extremely low energy.

Xceler Systems: Graph Architecture

Startup building AI chip like a brain, a few synapses at a time.

System-Level Design (more)

Emulation-Driven Implementation

Tech Talk: How to improve confidence that designs will work properly in less ...

The Week In Review: Design

New tools: power analysis, physical verification, CDC, and more; interconnect...

Blog Review: June 20

FD-SOI vs. finFET; OpenACC; materials and scaling; metrology at 3nm.

Technical Papers (more)

Autonomous Vehicle Navigation in Rural Environments without Detailed Prior Maps (MIT)

Self-driving technology for back roads

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Quantum Computing Becoming Real

Technology has the potential to reshape processing everywhere, starting with ...

Dealing With Resistance In Chips

Contacts and interconnects becoming more problematic at each new node, but wi...

Defining Edge Memory Requirements

Edge compute covers a wide range of applications. Understanding bandwidth and...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

designHUB: Design Reuse Made Real

Why companies need to reassess legacy processes, tools and design management ...

Cure The Common Cold…

...And much more. A call for papers for Arm TechCon.

The Week in Review: IoT

Orangeworm; medical insecurity; SamSam ransomware.

Videos (more)

Emulation-Driven Implementation

Tech Talk: How to improve confidence that designs will work properly in less ...

Tech Talk: Connected Intelligence

A look at the slowdown in Moore's Law, and what comes next.

Tech Talk: Data-Driven Design

How more data is shifting memory architectures.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

CMOS-Embedded STT-MRAM Arrays In 2xnm Nodes For GP-MCU Applications

Why perpendicular STT-RAM is a promising candidate for eFlash in MCU and IoT ...

High-Volume Manufacturing Device Overlay Process Control

There is a need to find more comprehensive solutions to characterize and mini...

Investigation Of The Influence of Controller Types On Room Thermal Behavior – A Simulation Study

A look at five different controller models used to control the operative temp...


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