Manufacturing Bits: April 24
Super electron guns; liquid cell TEMs; material partnerships.
System Bits: April 24
Spinning superconductors; integrating optical; wearable smart tech.
Power/Performance Bits: April 24
Waste heat to power; diamond power conversion; sensing with TENGs.
IP Issues At 10/7nm
The growing challenges of cataloging IP and its various avatars within a company.
Auto Industry Driving Faster
A look at the technologies and resources required for assisted and autonomous vehicles.
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
The Week in Review: IoT
IoT market growth; investments in IoT; Cambium products.
Generically Reusable IP No One Uses
If we just keep putting generically reusable on the box, all we’re doing is...
IP Electromagnetic Crosstalk Requires Contextual Signoff
A look at the issues that crop up when re-using IP and how to avoid them.
Architecture, Materials And Software
Why developments in all three areas will change the power/performance equatio...
Aging Models: The Basis For Predicting Circuit Reliability
Identifying the mechanisms that trigger future chip reliability issues, plus ...
Auto Industry Driving Faster
A look at the technologies and resources required for assisted and autonomous...
Mashup At 7nm
There are much broader implications to the SEMI/ESD Alliance merger than meet...
Too Many, Too Few Rare Earths
A group discovers new rare earth deposits.
The Race To Mass Customization
Why the next phase of advanced packaging is so important.
Xcerra’s Stock Buoyed by Busted Deal
Investors are enthusiastic for its shares.
The Problem With Spin-On Carbon Materials
How to solve the breakdown of polymers at high temperatures.
IP Issues At 10/7nm
The growing challenges of cataloging IP and its various avatars within a comp...
Artificial, With Questionable Intelligence
Debate begins to stir up about choices machines make.
Committing To Automotive
Given the numerous safety, reliability and security requirements for the auto...
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
Abstracting Abstracter Abstractions In Functional Verification
With the upcoming Portable Stimulus standard, we need to consider whether abs...
Smaller, Faster, Cheaper—But Different
These metrics are taking on new meaning as electronics begin playing a bigger...
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
IP Issues At 10/7nm
The growing challenges of cataloging IP and its various avatars within a comp...
Tech Tackles Health Care
Academia, startups and technology giants are addressing health care through c...
The Week in Review: IoT
Security focus; BeBop funding; Qualcomm-NXP.
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
Power/Performance Bits: April 24
Waste heat to power; diamond power conversion; sensing with TENGs.
Designing 5G Chips
The next-gen wireless technology is riddled with problems, but that hasn't sl...
Power/Performance Bits: April 17
Flexible LCDs; potassium for perovskites; lithium-sulfur batteries.
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
Manufacturing Bits: April 24
Super electron guns; liquid cell TEMs; material partnerships.
Auto Industry Driving Faster
A look at the technologies and resources required for assisted and autonomous...
The Week In Review: Manufacturing
ZTE chip ban; Lam results; EUV shipments; 7nm ships.
The Week In Review: Manufacturing
ZTE chip ban; Lam results; EUV shipments; 7nm ships.
The Week in Review: IoT
Security focus; BeBop funding; Qualcomm-NXP.
The Week In Review: Design
ESD Alliance joins SEMI; desktop prototyping; timing optimization; securing I...
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
The Race To Mass Customization
Why the next phase of advanced packaging is so important.
Choosing The Right Interconnect
Packaging options increasing as chipmakers vie for higher performance, lower ...
Xcerra’s Stock Buoyed by Busted Deal
Investors are enthusiastic for its shares.
TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
10nm heads into full swing, with 7nm and 5nm on the horizon.
Green Computing: GPUs Strike Back
Speed matters, but so does efficiency.
Making Waves In Deep Learning
How deep learning applications will map onto a chip.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: April 24
Super electron guns; liquid cell TEMs; material partnerships.
System Bits: April 24
Spinning superconductors; integrating optical; wearable smart tech.
Power/Performance Bits: April 24
Waste heat to power; diamond power conversion; sensing with TENGs.
More Lithography/Mask Challenges
Experts at the Table, part 2: Options include everything from multi-patternin...
New Market Drivers
Experts at the Table, part 2: How and why automotive designs are changing exi...
New Market Drivers
Experts at the Table, part 1: The industry is changing. Who is driving the ma...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
New Patterning Options Emerging
Why self-aligned approaches are becoming so critical to scaling, and what pro...
Get Ready For Integrated Silicon Photonics
This more than Moore technology is still ramping up, and problems need to be ...
The Bumpy Road To 5G
How pervasive will this new wireless technology actually become, and what pro...
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
Spark Microsystems: LP On-Chip Radios
Startup seeks to displace BLE with RF that is extremely low energy.
Xceler Systems: Graph Architecture
Startup building AI chip like a brain, a few synapses at a time.
Ayar Labs: Faster I/O
Processer I/O made of fiber, not copper, could help reconfigure data centers.
System Bits: April 24
Spinning superconductors; integrating optical; wearable smart tech.
The Week In Review: Design
ESD Alliance joins SEMI; desktop prototyping; timing optimization; securing I...
Blog Review: Apr. 18
Emerging technologies; embedded tips; data breaches everywhere; new memory.
Silicon CMOS Architecture For A Spin-based Quantum Computer
UNSW researchers have shown how a quantum computer can be manufactured using ...
Making high-capacity data caches more efficient
Cache-management scheme that they say improves the data rate of in-package DRAM
How Neural Networks Think (MIT)
General-purpose technique sheds light on inner workings of neural nets traine...
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Tech Tackles Health Care
Academia, startups and technology giants are addressing health care through c...
Design Rule Complexity Rising
Total number of rules is exploding, but that's only part of the problem.
Searching For EUV Defects
What issues remain, and how they could affect manufacturing at 7/5nm.
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
The Race To Accelerate
What's behind the buzz surrounding eFPGAs, and why now?
Week In Review: Design
Acquisitions; Intel security vulnerability; AI chip for health care.
Tech Talk: Analog Simplified
Why it's so critical to speed up analog design across a broad swath of market...
Tech Talk: Electrical Overstress
How to plan for electrical overstress and aging at advanced nodes and in safe...
Tech Talk: 7/5/3nm Signoff
How to make sure that advanced node designs will work as planned.
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
Modeling Semiconductor Process Variation
How to model cross wafer die-to-die variations using virtual fabrication.
Published on April 19th, 2018 by
Coventor
The CryptoManager Root Of Trust
Implementing security by design.
Published on April 16th, 2018 by
Rambus
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