Business & Marketing Strategies

Manufacturing Bits: June 18

Making microvias in packages; flexible fan-out.

Power/Performance Bits: June 18

Multi-value logic transistor; graphene band gap; finding faked images.

System Bits: June 18

U of T wins again; smooth drone landings; safer batteries.

AiMotive Is EDA For Self-Driving Cars

Staying alive in the automated vehicle biz.

Circuit Aging Becoming A Critical Consideration

As reliability demands soar in automotive and other safety-related markets, tools vendors are focusing on an area often ignored in the past.

All About Test (more)

What’s in a Name?

Test Vision 2020 may need a new moniker.

NIWeek Test Talk

National Instruments executives discuss semiconductor testing.

The Best in Test

VLSI Research recognizes leading test vendors.

Architect's Diary (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

Functional Safety: A Way Of Life

Functional safety starts with cultivating the right culture within a company.

Shhhhh… Deadlocks Anonymous In Session

Deadlocks are more prevalent than anyone wants to admit, so how do we deal wi...

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

Playing Into China’s Hands

A trade war couldn't occur at a worse time for the rest of the tech industry.

Building Your First Chip For Artificial Intelligence? Read This First

To make more effective and optimized AI SoCs, look beyond traditional design ...

HBM2e Offers Solid Path For AI Accelerators

AI processor performance is rapidly growing, making memory architecture choic...

Blogs - MD (more)

The Arm-Huawei Disconnect

Setting the record straight on what's really going on behind the scenes.

Impact Of U.S.-China Trade War

Experts look at the impact of the semi and materials sectors.

Challenges And Solutions For Silicon Wafer Bevel Defects During 3D NAND Flash Manufacturing

Improve yield by recognizing and preventing defects at the wafer's edge.

Blogs - PTES (more)

Thinking Differently About IIoT Analytics

How to make machines more efficient and reliable.

Test Moving Forward And Backward

What used to be a discrete step in the flow is becoming less well-defined and...

Smart Plug-And-Play DFT For Arm Cores

A new RTL-based hierarchical DFT flow for subsystems with Arm cores promises ...

Blogs - Security (more)

Algorithms And Security

AI is a moving target, and that’s unlikely to change.

Artificial Intelligence: Let Us Get The Math Right First!

Data path verification with formal for AI designs.

Do Large Batches Always Improve Neural Network Throughput?

Understanding how large images interact with batch sizes to determine memory ...

Blogs - SLD (more)

DAC 2019: Day 3

As DAC winds down, work, play, and dreams will define the path ahead for the ...

DAC 2019: Day 2

A highly entertaining day at DAC that started and ended with music.

DAC 2019: Day 1

DAC is constantly transforming, but this year it is gambling on its future in...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Chiplet Connection (more)

Virtual Packages Improve Signal Integrity

How to optimize chiplet architectures, including reducing in-package loss and...

SerDes For Chiplets

The key goals are low power and high bandwidth over extremely short distances.

How Much Data Can Be Pushed Through Copper Wires?

Pushing toward the Shannon signaling capacity using less energy consumption.

EDA For Manufacturability (more)

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...

Will EUV Kill Multi-Patterning?

Even with EUV in play, i193 multi-patterning may still be the most cost effec...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Embedded Insights (more)

Five steps to successful threat modeling

How to build a security plan and put it into action.

Reducing Time To Market For Security Solutions

Complex regulatory requirements and the time it takes to make security soluti...

When The IoT Really Works

A look at the necessary ingredients to transform businesses.

Embedded Software (more)

Using Streamline With Fast Models And Fixed Virtual Platforms

How to use the built-in performance analyzer in DS-5.

Continuous Integration

Streamline software development workflow by implementing virtual platforms wi...

Making Software Development Equivalent For Models And Boards

Using the same software images for virtual and FPGA prototyping.

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

AiMotive Is EDA For Self-Driving Cars

Staying alive in the automated vehicle biz.

Week in Review: IoT, Security, Auto

Data breach & cybersecurity updates; mobility report; CrowdStrike IPO; M&...

BiST Grows Up In Automotive

Existing test concepts are being leveraged in new ways to meet stringent auto...

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Power/Performance Bits: June 18

Multi-value logic transistor; graphene band gap; finding faked images.

Circuit Aging Becoming A Critical Consideration

As reliability demands soar in automotive and other safety-related markets, t...

Playing Into China’s Hands

A trade war couldn't occur at a worse time for the rest of the tech industry.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing Packaging and Materials (more)

Manufacturing Bits: June 18

Making microvias in packages; flexible fan-out.

Week In Review: Manufacturing, Test

Foundry rankings; fab tool rebound?; printed electronics.

Manufacturing Bits: June 10

Predicting warpage in IC packages; machine learning fan-out.

News (more)

Week In Review: Manufacturing, Test

Foundry rankings; fab tool rebound?; printed electronics.

Week in Review: IoT, Security, Auto

Data breach & cybersecurity updates; mobility report; CrowdStrike IPO; M&...

Week In Review: Design, Low Power

Intel buys Barefoot Networks; automating PCB DFM analysis; simulating autonom...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: June 18

Making microvias in packages; flexible fan-out.

Power/Performance Bits: June 18

Multi-value logic transistor; graphene band gap; finding faked images.

System Bits: June 18

U of T wins again; smooth drone landings; safer batteries.

Round Tables (more)

HBM2 Vs. GDDR6: Tradeoffs In DRAM

Experts at the Table, part 1: Choices vary depending upon application, cost a...

Disregard Safety And Security At Your Own Peril

Experts at the Table, part 1: How do automotive notions of safety and securit...

Evolution Of Verification Engineers

Experts at the Table, part 3: The role of a verification engineer will change...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Why Chips Are Getting Noisier

Even at older nodes with mostly digital circuitry, noise is a growing problem.

Data Confusion At The Edge

Disparities in processors and data types will have an unpredictable impact on...

3D NAND Race Faces Huge Tech And Cost Challenges

Shakeout looms as vendors struggle to find ways to add more layers and increa...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

AiMotive Is EDA For Self-Driving Cars

Staying alive in the automated vehicle biz.

Mega-Funding Rounds Continue

Startups revel in investments of billions of dollars.

April’19 Startup Funding: Corporate Gushers

Money pours into startups with more big investments on the way.

System-Level Design (more)

Week In Review: Design, Low Power

Intel buys Barefoot Networks; automating PCB DFM analysis; simulating autonom...

Blog Review: June 12

Cities unprepared for ransomware; femtosecond photography; persistent memory.

Week In Review: Design, Low Power

Infineon buys Cypress; massively parallel circuit simulation; HDL synthesizer...

Technical Papers (more)

Machine Learning Based Prediction: Health Behavior on BP

ML algorithm + individual data = personalized recommendations to reduce blood...

Autonomous Vehicle Navigation in Rural Environments without Detailed Prior Maps (MIT)

Self-driving technology for back roads

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

Test Measurement and Analytics (more)

Thinking Differently About IIoT Analytics

How to make machines more efficient and reliable.

Test Moving Forward And Backward

What used to be a discrete step in the flow is becoming less well-defined and...

Tessent Hierarchical ATPG Reference Flow for Arm Cortex-A75

How to speed up the implementation of a hierarchical test solution.

The Connected Perspective (more)

2017: A Good Year for ATE

Test equipment sales were up, and so were the share prices of ATE stocks.

That Was The Year That Was In Test

2017 featured a big proposed acquisition.

2017 ITC Wrap-up

News from Advantest, Optimal+, Astronics Test Systems.

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Circuit Aging Becoming A Critical Consideration

As reliability demands soar in automotive and other safety-related markets, t...

Waiting For Chiplet Interfaces

Plug-and-play approaches are gaining mindshare, even if some of the key piece...

HBM2 Vs. GDDR6: Tradeoffs In DRAM

Experts at the Table, part 1: Choices vary depending upon application, cost a...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

Crossover To Memory Expansion With Adesto EcoXiP and NXP’s i.MX RT Crossover Processors

External memory for an embedded processor offers a scalable platform aligning...

Testing Post

Manufacturing Bits: Dec. 18

Gallium oxide breakthroughs; super-junction SiC; groovy MOSFETs.

Videos (more)

Memory Options And Tradeoffs

What kinds of memories work best where and why.

Using ML For Post-Silicon Validation

Why machine learning is so effective in improving chip designs.

5G Design Changes

How to get data from the core of the network to the edge.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Unveil The Mystery Of Code Coverage In Low-Power Designs: Achieving Power Aware Verification

Achieving power-aware verification

Revolution By Evolution: Getting To The Next Technology Breakthrough In Analog Simulation

Updated Spectre circuit simulator addresses the need for simulating the next ...

Choosing the Right Photonic Design Software

Here are the basic questions you should ask when selecting photonic design so...


See All Posts in »

Bus & Mark Channels


Knowledge Centers
Entities, people and technologies explored


  Trending Articles

MicroLEDs: The Next Revolution In Displays?

Technology offers improved brightness, colors, and lower power, but they’re expensive and difficult to manufacture.

3D NAND Race Faces Huge Tech And Cost Challenges

Shakeout looms as vendors struggle to find ways to add more layers and increase density.

SiC Demand Growing Faster Than Supply

High-voltage applications such as electric vehicles raise specter of shortage and higher prices.

How To Integrate An Embedded FPGA

Adding an eFPGA into an SoC is more complex than just adding an accelerator.

Machine Learning Drives High-Level Synthesis Boom

As endpoint architectures get more complicated, EDA tool becomes key tool for experimenting with different options.