Business & Marketing Strategies

Week In Review: Manufacturing, Test

6nm vs 5nm processes; Intel exits 5G chip biz; deep learning.

Week in Review: IoT, Security, Auto

Drone inspections; war exclusion; Apple’s LiDAR; IPOs.

Week In Review: Design, Low Power

Intel buys Omnitek; Qualcomm, Apple drop litigation; 112G Long Reach SerDes; EDA & IP down in Q4.

The Precision Knob

From design through manufacturing, accuracy is becoming a differentiator.

More Rare Earth Rumblings

Events in China and elsewhere are impacting the market for rare earths.

All About Test (more)

What’s in a Name?

Test Vision 2020 may need a new moniker.

NIWeek Test Talk

National Instruments executives discuss semiconductor testing.

The Best in Test

VLSI Research recognizes leading test vendors.

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

More Memory And Processor Tradeoffs

Why power, performance and area are becoming increasingly difficult to balance.

The Weather Report: 2018 Study On IC/ASIC Verification Trends

Increased design size is only one dimension of the growing complexity challenge.

GDDR6 And HBM2: Signal Integrity Challenges For AI

Why memory choices for AI systems depend on the application.

Blogs - MD (more)

The Precision Knob

From design through manufacturing, accuracy is becoming a differentiator.

More Rare Earth Rumblings

Events in China and elsewhere are impacting the market for rare earths.

New Plastics Can Speed Flexible Printed Electronics Development

New polymer substrates offer printed electronics exciting capabilities.

Blogs - PTES (more)

Preparing For War On The Edge

The tech world is planning for an onslaught of data, but it's far from clear ...

How To Manage DFT For AI Chips

AI-specific processors call for design-for-test techniques that boost time-to...

How Do I Know? A Machine Told Me So

Emerging machine learning techniques are pushing the boundaries of what compu...

Blogs - Security (more)

Multi-Layer Processing Boosts Inference Throughput/Watt

How to boost performance in AI chips.

The 7nm Pileup

Why are so many companies rushing to do 7nm designs?

Mine Cryptocurrencies Sooner, Part 2

What lessons have newer cryptocurrencies learned from Bitcoin that make them ...

Blogs - SLD (more)

Auto Reliability At The System Level

Why different starting points and definitions could have a big impact on auto...

The Value Of A Model

How much would you pay for a model? Recently, the answer to that has been $$$.

Fibonacci And Honey Bees Have Something In Common: A Sweet Spot For Formal

Can assertions enable engineers to design IP that is correct by construction?

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Chiplet Connection (more)

Virtual Packages Improve Signal Integrity

How to optimize chiplet architectures, including reducing in-package loss and...

SerDes For Chiplets

The key goals are low power and high bandwidth over extremely short distances.

How Much Data Can Be Pushed Through Copper Wires?

Pushing toward the Shannon signaling capacity using less energy consumption.

EDA For Manufacturability (more)

Crossing The Chasm: Uniting SoC And Package Verification

EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...

Will EUV Kill Multi-Patterning?

Even with EUV in play, i193 multi-patterning may still be the most cost effec...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Embedded Insights (more)

Five steps to successful threat modeling

How to build a security plan and put it into action.

Reducing Time To Market For Security Solutions

Complex regulatory requirements and the time it takes to make security soluti...

When The IoT Really Works

A look at the necessary ingredients to transform businesses.

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

Week in Review: IoT, Security, Auto

Drone inspections; war exclusion; Apple’s LiDAR; IPOs.

Multi-Layer Processing Boosts Inference Throughput/Watt

How to boost performance in AI chips.

Week in Review: IoT, Security, Auto

Smarter buildings; 5G security; Tesla news.

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Designing For The Edge

Growth in data is fueling many more options, but so far it's not clear which ...

Power/Performance Bits: April 16

Faster CNN training; efficient flash for data centers; static negative capaci...

The Weather Report: 2018 Study On IC/ASIC Verification Trends

Increased design size is only one dimension of the growing complexity challenge.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing Packaging and Materials (more)

Week In Review: Manufacturing, Test

6nm vs 5nm processes; Intel exits 5G chip biz; deep learning.

The Precision Knob

From design through manufacturing, accuracy is becoming a differentiator.

More Rare Earth Rumblings

Events in China and elsewhere are impacting the market for rare earths.

News (more)

Week In Review: Manufacturing, Test

6nm vs 5nm processes; Intel exits 5G chip biz; deep learning.

Week in Review: IoT, Security, Auto

Drone inspections; war exclusion; Apple’s LiDAR; IPOs.

Week In Review: Design, Low Power

Intel buys Omnitek; Qualcomm, Apple drop litigation; 112G Long Reach SerDes; ...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: April 16

Water that won’t freeze; modeling water behavior.

System Bits: April 16

Borophene; trapping oxygen; sensitive measurements.

Power/Performance Bits: April 16

Faster CNN training; efficient flash for data centers; static negative capaci...

Round Tables (more)

Moore’s Law Now Requires Advanced Packaging

Experts at the Table, part 1: Shrinking features isn't enough anymore. The bi...

The Role Of EDA In AI

Experts at the Table, part 3: Which aspects of AI implementation should EDA c...

The Automation Of AI

Experts at the Table, part 1: Will the separation of hardware and software fo...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Single Vs. Multi-Patterning EUV

Why this choice isn't as obvious as it might look.

Shedding Pounds In Automotive Electronics

Weight is suddenly a major concern for carmakers, but slimming down has reper...

How To Build An Automotive Chip

Changing standards, stringent requirements and a mix of expertise make this a...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Rogue Valley Microdevices: MEMS Foundry

Oregon-based specialty fab takes different approach.

February’19 Startup Funding: Big Cash Keeps Rolling In

A month with a trio of billion-dollar rounds.

January’19 Startup Funding: $100M+ Rounds Abound

Billion-dollar funding rounds become more common.

System-Level Design (more)

Week In Review: Design, Low Power

Intel buys Omnitek; Qualcomm, Apple drop litigation; 112G Long Reach SerDes; ...

The Role Of EDA In AI

Experts at the Table, part 3: Which aspects of AI implementation should EDA c...

Blog Review: April 17

Embedded power management; Industry 4.0 and semi; security survey.

Technical Papers (more)

Machine Learning Based Prediction: Health Behavior on BP

ML algorithm + individual data = personalized recommendations to reduce blood...

Autonomous Vehicle Navigation in Rural Environments without Detailed Prior Maps (MIT)

Self-driving technology for back roads

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

Test Measurement and Analytics (more)

Preparing For War On The Edge

The tech world is planning for an onslaught of data, but it's far from clear ...

Racing To The Edge

The opportunity is daunting, but so are the challenges for making all the pie...

New Approaches To Security

Data analytics, traffic patterns and restrictive policies emerge as ways to e...

The Connected Perspective (more)

2017: A Good Year for ATE

Test equipment sales were up, and so were the share prices of ATE stocks.

That Was The Year That Was In Test

2017 featured a big proposed acquisition.

2017 ITC Wrap-up

News from Advantest, Optimal+, Astronics Test Systems.

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Lithography Options For Next-Gen Devices

EUV is the clear winner down to 5nm, but what comes after that may be a combi...

Inspecting IC Packages Using Die Sorters

Why this obscure tool is becoming crucial for finding cracking defects in opt...

Moore’s Law Now Requires Advanced Packaging

Experts at the Table, part 1: Shrinking features isn't enough anymore. The bi...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

Testing Post

Manufacturing Bits: Dec. 18

Gallium oxide breakthroughs; super-junction SiC; groovy MOSFETs.

Cost Analysis of a Wet Etch TSV Reveal Process

How to scale through-silicon vias and improve industry adoption.

Videos (more)

Multi-Physics At 5/3nm

Why process, voltage and temperature are so interrelated at future nodes, and...

GDDR6 – HBM2 Tradeoffs

What type of DRAM works best where.

Safety Critical Design In Automotive

Finding faults at the chip and system level.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

ALD Tungsten Solves Capacity Challenges in 3D NAND Device Manufacturing

ALD (atomic layer deposition) controls specific reactant molecules precisely ...

Self-aligned Fin Cut Last Patterning Scheme for Fin Arrays of 24nm Pitch and Beyond

Learn about a FinFET process flow with various fin cut approaches to create a...

Lithography Challenges For Leading Edge 3D Packaging Applications

Simpler single pass topside test can provide reasonable accuracy for monitori...


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