Week In Review: Manufacturing, Test
Foundry unit for sale?; ATE M&A; 200mm boom.
Week In Review: Design, Low Power
Digital twins for systems maintenance; Arm's Helium for v8.1-M; multicore SoC analytics; regression run dashboards in the cloud
Week in Review: IoT, Security, Auto
Google smartwatch; access control; Rivian investors.
Arms Race In Chip Performance
Processing speed is now a geopolitical issue, which could help solve one of the thorniest problems in computing.
The Promise Of GDDR6 And 7nm
Why this new memory is so critical for everything from AI to ADAS.
What’s in a Name?
Test Vision 2020 may need a new moniker.
NIWeek Test Talk
National Instruments executives discuss semiconductor testing.
The Best in Test
VLSI Research recognizes leading test vendors.
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
The Week in Review: IoT
IoT market growth; investments in IoT; Cambium products.
Generically Reusable IP No One Uses
If we just keep putting generically reusable on the box, all we’re doing is...
Arms Race In Chip Performance
Processing speed is now a geopolitical issue, which could help solve one of t...
The Promise Of GDDR6 And 7nm
Why this new memory is so critical for everything from AI to ADAS.
Getting Ready for 32 GT/s PCIe 5.0 Designs
The transition from older PCI Express (PCIe) technologies to the latest Revis...
Variation’s Long Tentacles
What used to be someone else's problem is now everyone's problem.
Fearless chip and fab tool forecasts
Several forecasters line up and provide the outlook for semis and equipment i...
Anticipating And Addressing 5G Testing Challenges
What's needed to measure device performance and reliability in next-gen wirel...
Using Data Analytics More Effectively
How to Extend Test Data Analytics Capabilities And Capacity
The Paradox Of Automotive Electronics
Automakers are right in demanding quality, but wrong in their approach.
Where Electronics Begins, And So Much More
Get ready for ES Design West.
Published on February 13th, 2019 by
Bob Smith
Meltdown And Spectre, One Year Later
New vulnerabilities have emerged around software techniques that damage hardw...
Design Infrastructure Alley at DAC 2019
The good and bad of moving data to the cloud.
Can AI, 5G Chips Be Verified?
Rapid technology changes, uncertain interactions create huge challenges.
Should AI Mimic Real Life?
What the human body can teach us about the importance of communications.
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Crossing The Chasm: Uniting SoC And Package Verification
EDA companies, OSATs, and foundries must collaborate to ensure wafer-level pa...
Will EUV Kill Multi-Patterning?
Even with EUV in play, i193 multi-patterning may still be the most cost effec...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Five steps to successful threat modeling
How to build a security plan and put it into action.
Reducing Time To Market For Security Solutions
Complex regulatory requirements and the time it takes to make security soluti...
Published on November 1st, 2018 by
Udi Maor
When The IoT Really Works
A look at the necessary ingredients to transform businesses.
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
Week in Review: IoT, Security, Auto
Google smartwatch; access control; Rivian investors.
Blockchain May Be Overkill for Most IIoT Security
Without an efficient blockchain template for IoT, other options are better.
Where Electronics Begins, And So Much More
Get ready for ES Design West.
Published on February 13th, 2019 by
Bob Smith
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
Arms Race In Chip Performance
Processing speed is now a geopolitical issue, which could help solve one of t...
The Promise Of GDDR6 And 7nm
Why this new memory is so critical for everything from AI to ADAS.
Gearing Up For 5G
This new communications standard could transform architectural decisions acro...
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
Week In Review: Manufacturing, Test
Foundry unit for sale?; ATE M&A; 200mm boom.
Manufacturing Bits: Feb. 11
Why things stick together; cryo-force spectroscopy.
Week In Review: Manufacturing, Test
Diamond IP theft; AI invades New York; SiC wafers.
Week In Review: Manufacturing, Test
Foundry unit for sale?; ATE M&A; 200mm boom.
Week In Review: Design, Low Power
Digital twins for systems maintenance; Arm's Helium for v8.1-M; multicore SoC...
Week in Review: IoT, Security, Auto
Google smartwatch; access control; Rivian investors.
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
Anticipating And Addressing 5G Testing Challenges
What's needed to measure device performance and reliability in next-gen wirel...
Using Data Analytics More Effectively
How to Extend Test Data Analytics Capabilities And Capacity
The Paradox Of Automotive Electronics
Automakers are right in demanding quality, but wrong in their approach.
TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
10nm heads into full swing, with 7nm and 5nm on the horizon.
Green Computing: GPUs Strike Back
Speed matters, but so does efficiency.
Making Waves In Deep Learning
How deep learning applications will map onto a chip.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: Feb. 11
Why things stick together; cryo-force spectroscopy.
Power/Performance Bits: Feb. 11
Body heat harvesting; chemical logic; storing energy in rocks.
System Bits: Feb. 11
Machine vision; solar cells; twisting graphene.
Building Security Into RISC-V Systems
Experts at the Table, part 2: Emphasis shifting to firmware, system-level arc...
Planning For 5G And The Edge
Experts at the Table, part 2: Understanding 5G's benefits, limitations and de...
Process Variation And Aging
Experts at the Table, part 2: How the very fast progress of the semiconductor...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
In-Memory Computing Challenges Come Into Focus
Researchers digging into ways around the von Neumann bottleneck.
China’s Foundry Biz Takes Big Leap Forward
30 facilities planned, including 10/7nm processes, but trade war and economic...
Variation Issues Grow Wider And Deeper
New sources, safety-critical applications and tighter tolerances raise new qu...
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
Kumu Networks: Full Duplex on One Channel
Well-funded startup offers self-interference cancellation tech for single-fre...
A New Approach to Metrology
Startup has a new leading-edge technology in metrology based on differential ...
Training a Neural Network to Fall
A cautionary tale of an early attempt to put AI on an IoT system that detects...
Week In Review: Design, Low Power
Digital twins for systems maintenance; Arm's Helium for v8.1-M; multicore SoC...
Blog Review: Feb. 13
System data; automotive security; verification adoption trends; GPU-accelerat...
Week in Review: Design, Low Power
Power management awards; RISC-V programming; ANSYS cloud; storage slowdown.
Machine Learning Based Prediction: Health Behavior on BP
ML algorithm + individual data = personalized recommendations to reduce blood...
Silicon CMOS Architecture For A Spin-based Quantum Computer
UNSW researchers have shown how a quantum computer can be manufactured using ...
2017: A Good Year for ATE
Test equipment sales were up, and so were the share prices of ATE stocks.
That Was The Year That Was In Test
2017 featured a big proposed acquisition.
2017 ITC Wrap-up
News from Advantest, Optimal+, Astronics Test Systems.
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Gearing Up For 5G
This new communications standard could transform architectural decisions acro...
Adapting Mobile To A Post-Moore’s Law Era
New techniques, architectures and approaches are making up for a reduction in...
Why Analog Designs Fail
Analog circuitry stopped following Moore’s Law a long time ago, but that ha...
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
Manufacturing Bits: Dec. 18
Gallium oxide breakthroughs; super-junction SiC; groovy MOSFETs.
Cost Analysis of a Wet Etch TSV Reveal Process
How to scale through-silicon vias and improve industry adoption.
Published on December 10th, 2018 by
Veeco
Designing Networking Chips
How massive data traffic is affecting the verification cycle.
Benchmarks For The Edge
What works, what doesn’t and why.
Boosting Analog Reliability
Dealing with variability and physical effects in mixed signal designs.
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
Driving Change in the Age of Electric Vehicles
How engineering simulations will play a large role in EV's growth worldwide.
Published on February 13th, 2019 by
ANSYS
Digital Signal Processing for Frequency-Modulated Continuous Wave RADARs
An overview of RADAR technology used in ADAS and design tradeoffs.
Published on February 13th, 2019 by
Synopsys
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