Business & Marketing Strategies

The Hidden Cost Of Tariffs

Import/export duties are only part of the picture, and what you can't see can still hurt.

Memory Startups To Watch

3D memory, FeFETs and MRAM/ReRAM IP are in the works.

Optimizing 5G With AI At The Edge

5G is necessary to deal with the increasing amount of data being generated, but successful rollout of mmWave calls for new techniques.

Next-Gen Memory Ramping Up

At least 5 technologies are in the running, with 3D XPoint leading the pack.

Inspecting Unpatterned Wafers

Finding smaller defects earlier is becoming more difficult and expensive.

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

More Performance At The Edge

Scaling is about to take on a whole different look, and it not just from shri...

Power Reduction In A Constrained World

Why it's critical to make power a key vector for design convergence.

High-Performance Memory At Low Cost Per Bit

Emerging applications drive the need for high memory capacity.

Blogs - MD (more)

The Hidden Cost Of Tariffs

Import/export duties are only part of the picture, and what you can't see can...

Memory Startups To Watch

3D memory, FeFETs and MRAM/ReRAM IP are in the works.

Optimizing 5G With AI At The Edge

5G is necessary to deal with the increasing amount of data being generated, b...

Blogs - PTES (more)

Who’s Paying For Auto Chip Test?

Complexity, advanced nodes, harsh conditions and safety concerns will make te...

Some Human Musings On Machine Learning

What will it take to make machines process information in the same way we do?

The Next Generation Of Fingerprinting Technology

Identifying and tracking impurities before they make it onto the wafer.

Blogs - Security (more)

Effectively Fighting Fake Medical Products

How to deal with an increasing number of counterfeit goods at very low cost.

IoT Meets ML

What happens when the IoT begins tapping into patterns?

Auto Chip Ecosystem Needs Common Language

A key ingredient for the autonomous driving ecosystem is mutual understanding...

Blogs - SLD (more)

Solving Systemic Complexity

The number of possible interactions is exploding. So why aren't tool companie...

A New Era For EDA

Is EDA in decline? Will its fortunes turn around with the end of Moore's Law?

Functional Safety: Art Or Science?

The market for safety-critical electronics is booming, but development practi...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

Week in Review: IoT, Security, Auto

Security issues; Marvell debuts; startup funding.

Will 5G Deployment Lag in the U.S.?

Deloitte Consulting sees the States falling behind China and other countries.

$8.5B For Auto, IoT, Security Startups

First-half funding analysis shows continued robust investment in tech.

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Power/Performance Bits: Aug. 14

All-optical logic; 3D printed battery electrodes; on-chip optical filter.

AI Architectures Must Change

Using the Von Neumann architecture for artificial intelligence applications i...

More Performance At The Edge

Scaling is about to take on a whole different look, and it not just from shri...

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

The Hidden Cost Of Tariffs

Import/export duties are only part of the picture, and what you can't see can...

Memory Startups To Watch

3D memory, FeFETs and MRAM/ReRAM IP are in the works.

Optimizing 5G With AI At The Edge

5G is necessary to deal with the increasing amount of data being generated, b...

News (more)

Blog Review: Aug. 15

China's semi growth; when formal gets stuck; 5G & AI; electroplating.

Week In Review: Manufacturing, Test

Trade wars; MRAM deal; China enters finFET biz.

Week in Review: IoT, Security, Auto

Security issues; Marvell debuts; startup funding.

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

Old Vs. New Packages

Two packaging technologies are making microchips smaller and more durable.

Who’s Paying For Auto Chip Test?

Complexity, advanced nodes, harsh conditions and safety concerns will make te...

The Chiplet Race Begins

DARPA and a number of major vendors are backing this modular approach, but hu...

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: Aug. 14

Strange metals; mild-temp superconductors; super grids.

System Bits: Aug. 14

AI for less toxic cancer treatment; superconductors with a twist; nanoribbons.

Power/Performance Bits: Aug. 14

All-optical logic; 3D printed battery electrodes; on-chip optical filter.

Round Tables (more)

Where FD-SOI Works Best

Experts at the Table, part 2: Why FD-SOI is being used alongside finFETs and ...

Do Parallel Tools Make Sense?

Experts at the Table, part 2: What can be done instead? And why are companies...

Process Variation Not A Solved Issue

Experts at the Table: Biggest issues with process variation today, and its im...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

Auto Chip Test Getting Harder

Each new level of assistance and autonomy adds new requirements and problems,...

Safety, Security And PPA Tradeoffs

The number of critical design metrics is expanding, but the industry still gr...

Security Holes In Machine Learning And AI

A primary goal of machine learning is to use machines to train other machines...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Syntiant: Analog Deep Learning Chips

Intel Capital funds startup to put AI in low-power mobile devices.

Spark Microsystems: LP On-Chip Radios

Startup seeks to displace BLE with RF that is extremely low energy.

Xceler Systems: Graph Architecture

Startup building AI chip like a brain, a few synapses at a time.

System-Level Design (more)

Blog Review: Aug. 15

China's semi growth; when formal gets stuck; 5G & AI; electroplating.

System Bits: Aug. 14

AI for less toxic cancer treatment; superconductors with a twist; nanoribbons.

Do Parallel Tools Make Sense?

Experts at the Table, part 2: What can be done instead? And why are companies...

Technical Papers (more)

Autonomous Vehicle Navigation in Rural Environments without Detailed Prior Maps (MIT)

Self-driving technology for back roads

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Next-Gen Memory Ramping Up

At least 5 technologies are in the running, with 3D XPoint leading the pack.

Inspecting Unpatterned Wafers

Finding smaller defects earlier is becoming more difficult and expensive.

Big Shifts In Tech Conferences

New technologies and trends have created an explosion of shows; some attempt ...

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

designHUB: Design Reuse Made Real

Why companies need to reassess legacy processes, tools and design management ...

Cure The Common Cold…

...And much more. A call for papers for Arm TechCon.

The Week in Review: IoT

Orangeworm; medical insecurity; SamSam ransomware.

Videos (more)

AI, ML Chip Choices

Which type of chips are best and why.

Changing The Design Flow

The rationale for fusing together various pieces of a digital design.

Printed Electronics Materials

Why printed electronics are finding their way into edge devices, and why mate...

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Spectral Tunability For Accuracy, Robustness And Resilience

How to improve the accuracy and robustness of overlay metrology for 1xnm desi...

Adapt Or Fall Behind: Surviving And Thriving In The Competitive Jungle Of Plant Operations Scheduling And IIoT

Using technology to reducing variability and improving categorization in a di...

Scalable, Cloud-Ready IC Validator Solution For Advanced DRC Nodes

How to speed up the design and verification of a high-performance AI chip.


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