The Hidden Cost Of Tariffs
Import/export duties are only part of the picture, and what you can't see can still hurt.
Memory Startups To Watch
3D memory, FeFETs and MRAM/ReRAM IP are in the works.
Optimizing 5G With AI At The Edge
5G is necessary to deal with the increasing amount of data being generated, but successful rollout of mmWave calls for new techniques.
Next-Gen Memory Ramping Up
At least 5 technologies are in the running, with 3D XPoint leading the pack.
Inspecting Unpatterned Wafers
Finding smaller defects earlier is becoming more difficult and expensive.
Looking For The Elephant In The Valley
Female role models doing exceptional things in tech have always existed. Hope...
The Week in Review: IoT
IoT market growth; investments in IoT; Cambium products.
Generically Reusable IP No One Uses
If we just keep putting generically reusable on the box, all we’re doing is...
More Performance At The Edge
Scaling is about to take on a whole different look, and it not just from shri...
Power Reduction In A Constrained World
Why it's critical to make power a key vector for design convergence.
High-Performance Memory At Low Cost Per Bit
Emerging applications drive the need for high memory capacity.
The Hidden Cost Of Tariffs
Import/export duties are only part of the picture, and what you can't see can...
Memory Startups To Watch
3D memory, FeFETs and MRAM/ReRAM IP are in the works.
Optimizing 5G With AI At The Edge
5G is necessary to deal with the increasing amount of data being generated, b...
Who’s Paying For Auto Chip Test?
Complexity, advanced nodes, harsh conditions and safety concerns will make te...
Some Human Musings On Machine Learning
What will it take to make machines process information in the same way we do?
The Next Generation Of Fingerprinting Technology
Identifying and tracking impurities before they make it onto the wafer.
Effectively Fighting Fake Medical Products
How to deal with an increasing number of counterfeit goods at very low cost.
IoT Meets ML
What happens when the IoT begins tapping into patterns?
Auto Chip Ecosystem Needs Common Language
A key ingredient for the autonomous driving ecosystem is mutual understanding...
Solving Systemic Complexity
The number of possible interactions is exploding. So why aren't tool companie...
A New Era For EDA
Is EDA in decline? Will its fortunes turn around with the end of Moore's Law?
Functional Safety: Art Or Science?
The market for safety-critical electronics is booming, but development practi...
What Just Happened?
In the period of a year the semiconductor industry has transformed into somet...
Crunch Time
The network as we've known it for a couple of generations is changing before ...
The “Last Simple Node” And the Internet of Things
A huge amount of foundry space built in the last five years will be converted...
Extra! Extra! Read All About It!
ASML is going into the pellicle business!
Visiting The Future At CLEO
Pointing light in different directions: mid-infrared microscopy, quantum cryp...
Advanced Lithography: Moore’s Law Moves On
If designers can stand all the rules that come with quadruple patterning, the...
Samsung Foundry’s Business Strategy
A look at manufacturing changes and advanced technology updates.
Does IoT Change Design?
Is the Internet of Things really something that will impact system design, or...
EDA Resurgence Through Open Flows
The EDA industry can experience a resurgence if truly open interfaces and ope...
The Perilous Path From Technology To Product
Just because a product can do more doesn’t mean it should—or that you’l...
3D Construction Ahead
Building sub-wavelength structures using photons, and using 3D printers to cr...
ReRAM Gains Even More Steam
Latest manufacturing techniques are being explored as commercial products beg...
Molecular Imprints becomes a virtual reality company
Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.
Siemens To Buy Mentor For $4.5B
Updated: Deal adds mechanical, thermal, electrical and embedded software capa...
Samsung To Buy Harman For $8B
Tier 1 acquisition boosts automotive portfolio.
Qualcomm + NXP = IoT Powerhouse
What the Qualcomm-NXP deal means for IoT.
Week in Review: IoT, Security, Auto
Security issues; Marvell debuts; startup funding.
Will 5G Deployment Lag in the U.S.?
Deloitte Consulting sees the States falling behind China and other countries.
$8.5B For Auto, IoT, Security Startups
First-half funding analysis shows continued robust investment in tech.
Major Growth For Knowledge Center
An update on the Knowledge Center, plus a few pop quizzes.
Industry Collaboration Starts
Check out all the new stuff...And this is just the beginning.
Welcome To The Knowledge Center
There are more than 1,600 information pages already in the system, and many m...
Semicon West Lithography Report
OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...
SPIE Advanced Lithography 2013 – day 2
There were some great papers at AL on Tuesday. Here are some of my favorite...
SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progress...
Power/Performance Bits: Aug. 14
All-optical logic; 3D printed battery electrodes; on-chip optical filter.
AI Architectures Must Change
Using the Von Neumann architecture for artificial intelligence applications i...
More Performance At The Edge
Scaling is about to take on a whole different look, and it not just from shri...
Getting Ready For The IoT
Preparing for the next seismic shift in the semiconductor industry.
Metrics For Measuring Performance And Power In IoT SoC Designs
Benchmarking can provide relevant data for real-world applications.
The Real Value In Customizing Instructions
How to enable an order of magnitude in power savings for IoT applications.
The Hidden Cost Of Tariffs
Import/export duties are only part of the picture, and what you can't see can...
Memory Startups To Watch
3D memory, FeFETs and MRAM/ReRAM IP are in the works.
Optimizing 5G With AI At The Edge
5G is necessary to deal with the increasing amount of data being generated, b...
Blog Review: Aug. 15
China's semi growth; when formal gets stuck; 5G & AI; electroplating.
Week In Review: Manufacturing, Test
Trade wars; MRAM deal; China enters finFET biz.
Week in Review: IoT, Security, Auto
Security issues; Marvell debuts; startup funding.
Apple Vs. FBI, Take Two
No system can ever be fully secured.
Oh, The Hypocrisy
Did Apple really claim it's protecting the privacy of iPhone customers?
IoE Things Are Spying On Us
Direct marketers are using hiddenware to figure out what we're thinking.
ARM Buys Carbon
Deal allows ARM to create virtual prototypes for performance and power analys...
Customized On-Chip Process Monitors
Using ring oscillators to validate design signoff methodology and silicon pro...
Inside The Hybrid Memory Cube
A look at how to break through the memory bandwidth wall.
Old Vs. New Packages
Two packaging technologies are making microchips smaller and more durable.
Who’s Paying For Auto Chip Test?
Complexity, advanced nodes, harsh conditions and safety concerns will make te...
The Chiplet Race Begins
DARPA and a number of major vendors are backing this modular approach, but hu...
TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
10nm heads into full swing, with 7nm and 5nm on the horizon.
Green Computing: GPUs Strike Back
Speed matters, but so does efficiency.
Making Waves In Deep Learning
How deep learning applications will map onto a chip.
A Strategy For Designing For Power With FinFETs
Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...
Doing More With RTL Power Analysis: Smart Synthesis Architecture
The migration to finFET processes requires a serious focus on dynamic power c...
Microarchitecture Design For Low Power
A look at first-in, first-out design tradeoffs.
The Economics Of Moore’s Law
Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.
Published on February 18th, 2016 by
Imec
The Internet Of Power Also Benefits From Moore’s Law
It's increasingly possible to stack technologies to produce smart systems.
Published on January 21st, 2016 by
Imec
Betting On Wright’s Law
Moore’s Law is primarily an economic law, but it can be expanded and applie...
Published on December 17th, 2015 by
Imec
Getting A Handle On RTL X-Verification Challenges
Optimistic simulation behavior can hide bugs in your design that don't show u...
Design And Verification Survey Results
New Poll: Lint topped the list on verification technologies to adopt, followe...
Billion-Gate Signoff
A recommended sign off activity list mean fewer re-spins and a design that is...
Manufacturing Bits: Aug. 14
Strange metals; mild-temp superconductors; super grids.
System Bits: Aug. 14
AI for less toxic cancer treatment; superconductors with a twist; nanoribbons.
Power/Performance Bits: Aug. 14
All-optical logic; 3D printed battery electrodes; on-chip optical filter.
Where FD-SOI Works Best
Experts at the Table, part 2: Why FD-SOI is being used alongside finFETs and ...
Do Parallel Tools Make Sense?
Experts at the Table, part 2: What can be done instead? And why are companies...
Process Variation Not A Solved Issue
Experts at the Table: Biggest issues with process variation today, and its im...
Brave New World Of Mobility
The ITS World Congress in Bordeaux demonstrates the potential of future mobil...
How To Prevent Identity Theft
The number of choices for securing identities is on the rise, but so is the n...
The Promise Of NFC For Industry 4.0
The manufacturing sector has become increasingly digital, which means it can ...
Get Ready For DVCon Europe
New conference will address complex system-level design, mixed signal verific...
2014 Accellera Standards Are Built on Powerful Shoulders
What to watch out for in standards this year and how those changes will affec...
Community, Collaboration And Standards
Where to find standards downloads for the electronics industry and what they'...
Auto Chip Test Getting Harder
Each new level of assistance and autonomy adds new requirements and problems,...
Safety, Security And PPA Tradeoffs
The number of critical design metrics is expanding, but the industry still gr...
Security Holes In Machine Learning And AI
A primary goal of machine learning is to use machines to train other machines...
Important Changes Ahead
DesignCon panels will focus on system-level power modeling and silicon photon...
See The Internet Of Things…In 3D
The need to integrate a wide variety of functionality economically can't be a...
Multi-Die Packaging Gains Steam
Commercial progress to be unveiled at Global Interposer Technology workshop.
Published on October 6th, 2014 by
Si2
Syntiant: Analog Deep Learning Chips
Intel Capital funds startup to put AI in low-power mobile devices.
Spark Microsystems: LP On-Chip Radios
Startup seeks to displace BLE with RF that is extremely low energy.
Xceler Systems: Graph Architecture
Startup building AI chip like a brain, a few synapses at a time.
Blog Review: Aug. 15
China's semi growth; when formal gets stuck; 5G & AI; electroplating.
System Bits: Aug. 14
AI for less toxic cancer treatment; superconductors with a twist; nanoribbons.
Do Parallel Tools Make Sense?
Experts at the Table, part 2: What can be done instead? And why are companies...
Silicon CMOS Architecture For A Spin-based Quantum Computer
UNSW researchers have shown how a quantum computer can be manufactured using ...
Making high-capacity data caches more efficient
Cache-management scheme that they say improves the data rate of in-package DRAM
SoC Connectivity Verification Nightmare
Static checks supplement simulation-based verification.
Physical Lint: Physical Quality Metrics For Your RTL
Improving the quality of RTL leads to more predictable design convergence and...
Taming Lint With Formal
Linting tools take advantage of fast and shallow analysis to provide quick fe...
Commercializing Technology
Once you develop the product, you have to be prepared to sell it.
A Tough Balancing Act
Should you focus on technology or customers?
Moving From Engineering To Management Or Staying On The Technical Track
The stigma of sticking to your technology roots is gone. So what's your next ...
Three Common SoC Power Management Myths
Approaching power management from the architectural design level.
NoC Versus PIN: Size Matters
Complexity and flexibility are the real drivers of fabric choice, not the num...
CSR In Semis
Giving back to the industry is a good thing—and something everyone should b...
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Stacking The Deck
Enabling 2.5D and 3D architecture and the supply chain.
Next-Gen Memory Ramping Up
At least 5 technologies are in the running, with 3D XPoint leading the pack.
Inspecting Unpatterned Wafers
Finding smaller defects earlier is becoming more difficult and expensive.
Big Shifts In Tech Conferences
New technologies and trends have created an explosion of shows; some attempt ...
It’s All In the Sequence
Whether dealing with SoCs or a disaster in space, determining the correct set...
Making Way For Register Specification Software
While more registers means more functionality and configurability, more is no...
The Ultimate Shift Left
Important observations from Einstein and New England's ice traders.
designHUB: Design Reuse Made Real
Why companies need to reassess legacy processes, tools and design management ...
Cure The Common Cold…
...And much more. A call for papers for Arm TechCon.
The Week in Review: IoT
Orangeworm; medical insecurity; SamSam ransomware.
AI, ML Chip Choices
Which type of chips are best and why.
Changing The Design Flow
The rationale for fusing together various pieces of a digital design.
Printed Electronics Materials
Why printed electronics are finding their way into edge devices, and why mate...
A Semiconductor Approach To Desalination
A new growth market for a very good cause.
Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262
For the automotive market, chips need to last a lot longer than they do in a ...
Power Shifts In Digital Chip Space
The front runner is Intel, and it’s uncertain if or when anyone will catch up.
Improved Efficiency
What’s ahead in power management techniques and why changes are needed.
Near-Threshold Computing
Operating near the level when transistors switch on an off can save lots of p...
Spectral Tunability For Accuracy, Robustness And Resilience
How to improve the accuracy and robustness of overlay metrology for 1xnm desi...
Scalable, Cloud-Ready IC Validator Solution For Advanced DRC Nodes
How to speed up the design and verification of a high-performance AI chip.
Published on August 8th, 2018 by
Synopsys
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