Business & Marketing Strategies

Manufacturing Bits: April 24

Super electron guns; liquid cell TEMs; material partnerships.

System Bits: April 24

Spinning superconductors; integrating optical; wearable smart tech.

Power/Performance Bits: April 24

Waste heat to power; diamond power conversion; sensing with TENGs.

IP Issues At 10/7nm

The growing challenges of cataloging IP and its various avatars within a company.

Auto Industry Driving Faster

A look at the technologies and resources required for assisted and autonomous vehicles.

blog (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

The Week in Review: IoT

IoT market growth; investments in IoT; Cambium products.

Generically Reusable IP No One Uses

If we just keep putting generically reusable on the box, all we’re doing is...

Blogs - LPHP (more)

IP Electromagnetic Crosstalk Requires Contextual Signoff

A look at the issues that crop up when re-using IP and how to avoid them.

Architecture, Materials And Software

Why developments in all three areas will change the power/performance equatio...

Aging Models: The Basis For Predicting Circuit Reliability

Identifying the mechanisms that trigger future chip reliability issues, plus ...

Blogs - MD (more)

Auto Industry Driving Faster

A look at the technologies and resources required for assisted and autonomous...

Mashup At 7nm

There are much broader implications to the SEMI/ESD Alliance merger than meet...

Too Many, Too Few Rare Earths

A group discovers new rare earth deposits.

Blogs - PTES (more)

The Race To Mass Customization

Why the next phase of advanced packaging is so important.

Xcerra’s Stock Buoyed by Busted Deal

Investors are enthusiastic for its shares.

The Problem With Spin-On Carbon Materials

How to solve the breakdown of polymers at high temperatures.

Blogs - Security (more)

IP Issues At 10/7nm

The growing challenges of cataloging IP and its various avatars within a comp...

Artificial, With Questionable Intelligence

Debate begins to stir up about choices machines make.

Committing To Automotive

Given the numerous safety, reliability and security requirements for the auto...

Blogs - SLD (more)

Looking For The Elephant In The Valley

Female role models doing exceptional things in tech have always existed. Hope...

Abstracting Abstracter Abstractions In Functional Verification

With the upcoming Portable Stimulus standard, we need to consider whether abs...

Smaller, Faster, Cheaper—But Different

These metrics are taking on new meaning as electronics begin playing a bigger...

Cascade Effects (more)

What Just Happened?

In the period of a year the semiconductor industry has transformed into somet...

Crunch Time

The network as we've known it for a couple of generations is changing before ...

The “Last Simple Node” And the Internet of Things

A huge amount of foundry space built in the last five years will be converted...

Edges Of Darkness (more)

Extra! Extra! Read All About It!

ASML is going into the pellicle business!

Visiting The Future At CLEO

Pointing light in different directions: mid-infrared microscopy, quantum cryp...

Advanced Lithography: Moore’s Law Moves On

If designers can stand all the rules that come with quadruple patterning, the...

Foundry Forum (more)

Samsung Foundry’s Business Strategy

A look at manufacturing changes and advanced technology updates.

Hand's On Design (more)

Does IoT Change Design?

Is the Internet of Things really something that will impact system design, or...

EDA Resurgence Through Open Flows

The EDA industry can experience a resurgence if truly open interfaces and ope...

The Perilous Path From Technology To Product

Just because a product can do more doesn’t mean it should—or that you’l...

ImPatterning (more)

3D Construction Ahead

Building sub-wavelength structures using photons, and using 3D printers to cr...

ReRAM Gains Even More Steam

Latest manufacturing techniques are being explored as commercial products beg...

Molecular Imprints becomes a virtual reality company

Remainder of company acquired by Magic Leap, a VC-funded startup led by Google.

Int News (more)

Siemens To Buy Mentor For $4.5B

Updated: Deal adds mechanical, thermal, electrical and embedded software capa...

Samsung To Buy Harman For $8B

Tier 1 acquisition boosts automotive portfolio.

Qualcomm + NXP = IoT Powerhouse

What the Qualcomm-NXP deal means for IoT.

IoT and Security (more)

IP Issues At 10/7nm

The growing challenges of cataloging IP and its various avatars within a comp...

Tech Tackles Health Care

Academia, startups and technology giants are addressing health care through c...

The Week in Review: IoT

Security focus; BeBop funding; Qualcomm-NXP.

Knowledge Central (more)

Major Growth For Knowledge Center

An update on the Knowledge Center, plus a few pop quizzes.

Industry Collaboration Starts

Check out all the new stuff...And this is just the beginning.

Welcome To The Knowledge Center

There are more than 1,600 information pages already in the system, and many m...

Litho Guru (more)

Semicon West Lithography Report

OK, so I didn't go to Semicon West. That doesn't mean I don't have opinions ...

SPIE Advanced Lithography 2013 – day 2

There were some great papers at AL on Tuesday.  Here are some of my favorite...

SPIE Advanced Lithography 2013 – day 4

The last day of the conference gave the tool updates. So how is EUV progress...

Low Power-High Performance (more)

Power/Performance Bits: April 24

Waste heat to power; diamond power conversion; sensing with TENGs.

Designing 5G Chips

The next-gen wireless technology is riddled with problems, but that hasn't sl...

Power/Performance Bits: April 17

Flexible LCDs; potassium for perovskites; lithium-sulfur batteries.

Making The IoT Smarter (more)

Getting Ready For The IoT

Preparing for the next seismic shift in the semiconductor industry.

Metrics For Measuring Performance And Power In IoT SoC Designs

Benchmarking can provide relevant data for real-world applications.

The Real Value In Customizing Instructions

How to enable an order of magnitude in power savings for IoT applications.

Manufacturing and Design (more)

Manufacturing Bits: April 24

Super electron guns; liquid cell TEMs; material partnerships.

Auto Industry Driving Faster

A look at the technologies and resources required for assisted and autonomous...

The Week In Review: Manufacturing

ZTE chip ban; Lam results; EUV shipments; 7nm ships.

News (more)

The Week In Review: Manufacturing

ZTE chip ban; Lam results; EUV shipments; 7nm ships.

The Week in Review: IoT

Security focus; BeBop funding; Qualcomm-NXP.

The Week In Review: Design

ESD Alliance joins SEMI; desktop prototyping; timing optimization; securing I...

On The Edge (more)

Apple Vs. FBI, Take Two

No system can ever be fully secured.

Oh, The Hypocrisy

Did Apple really claim it's protecting the privacy of iPhone customers?

IoE Things Are Spying On Us

Direct marketers are using hiddenware to figure out what we're thinking.

Open Talk (more)

ARM Buys Carbon

Deal allows ARM to create virtual prototypes for performance and power analys...

Customized On-Chip Process Monitors

Using ring oscillators to validate design signoff methodology and silicon pro...

Inside The Hybrid Memory Cube

A look at how to break through the memory bandwidth wall.

Packaging and Test (more)

The Race To Mass Customization

Why the next phase of advanced packaging is so important.

Choosing The Right Interconnect

Packaging options increasing as chipmakers vie for higher performance, lower ...

Xcerra’s Stock Buoyed by Busted Deal

Investors are enthusiastic for its shares.

Power Architect (more)

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue

10nm heads into full swing, with 7nm and 5nm on the horizon.

Green Computing: GPUs Strike Back

Speed matters, but so does efficiency.

Making Waves In Deep Learning

How deep learning applications will map onto a chip.

Power Down (more)

A Strategy For Designing For Power With FinFETs

Moving from 28nm to finFETs provides a 1.2X improvement in power and performa...

Doing More With RTL Power Analysis: Smart Synthesis Architecture

The migration to finFET processes requires a serious focus on dynamic power c...

Microarchitecture Design For Low Power

A look at first-in, first-out design tradeoffs.

Process Watch (more)

The Economics Of Moore’s Law

Ten years from now, CMOS will seem as old-fashioned as vacuum tubes.

The Internet Of Power Also Benefits From Moore’s Law

It's increasingly possible to stack technologies to produce smart systems.

Betting On Wright’s Law

Moore’s Law is primarily an economic law, but it can be expanded and applie...

Real Insights (more)

Getting A Handle On RTL X-Verification Challenges

Optimistic simulation behavior can hide bugs in your design that don't show u...

Design And Verification Survey Results

New Poll: Lint topped the list on verification technologies to adopt, followe...

Billion-Gate Signoff

A recommended sign off activity list mean fewer re-spins and a design that is...

Research (more)

Manufacturing Bits: April 24

Super electron guns; liquid cell TEMs; material partnerships.

System Bits: April 24

Spinning superconductors; integrating optical; wearable smart tech.

Power/Performance Bits: April 24

Waste heat to power; diamond power conversion; sensing with TENGs.

Round Tables (more)

More Lithography/Mask Challenges

Experts at the Table, part 2: Options include everything from multi-patternin...

New Market Drivers

Experts at the Table, part 2: How and why automotive designs are changing exi...

New Market Drivers

Experts at the Table, part 1: The industry is changing. Who is driving the ma...

Secure Connections (more)

Brave New World Of Mobility

The ITS World Congress in Bordeaux demonstrates the potential of future mobil...

How To Prevent Identity Theft

The number of choices for securing identities is on the rise, but so is the n...

The Promise Of NFC For Industry 4.0

The manufacturing sector has become increasingly digital, which means it can ...

Setting The Standard (more)

Get Ready For DVCon Europe

New conference will address complex system-level design, mixed signal verific...

2014 Accellera Standards Are Built on Powerful Shoulders

What to watch out for in standards this year and how those changes will affec...

Community, Collaboration And Standards

Where to find standards downloads for the electronics industry and what they'...

Special Reports (more)

New Patterning Options Emerging

Why self-aligned approaches are becoming so critical to scaling, and what pro...

Get Ready For Integrated Silicon Photonics

This more than Moore technology is still ramping up, and problems need to be ...

The Bumpy Road To 5G

How pervasive will this new wireless technology actually become, and what pro...

Standards And Beyond (more)

Important Changes Ahead

DesignCon panels will focus on system-level power modeling and silicon photon...

See The Internet Of Things…In 3D

The need to integrate a wide variety of functionality economically can't be a...

Multi-Die Packaging Gains Steam

Commercial progress to be unveiled at Global Interposer Technology workshop.

Startup Corner (more)

Spark Microsystems: LP On-Chip Radios

Startup seeks to displace BLE with RF that is extremely low energy.

Xceler Systems: Graph Architecture

Startup building AI chip like a brain, a few synapses at a time.

Ayar Labs: Faster I/O

Processer I/O made of fiber, not copper, could help reconfigure data centers.

System-Level Design (more)

System Bits: April 24

Spinning superconductors; integrating optical; wearable smart tech.

The Week In Review: Design

ESD Alliance joins SEMI; desktop prototyping; timing optimization; securing I...

Blog Review: Apr. 18

Emerging technologies; embedded tips; data breaches everywhere; new memory.

Technical Papers (more)

Silicon CMOS Architecture For A Spin-based Quantum Computer

UNSW researchers have shown how a quantum computer can be manufactured using ...

Making high-capacity data caches more efficient

Cache-management scheme that they say improves the data rate of in-package DRAM

How Neural Networks Think (MIT)

General-purpose technique sheds light on inner workings of neural nets traine...

The Early Edition (more)

SoC Connectivity Verification Nightmare

Static checks supplement simulation-based verification.

Physical Lint: Physical Quality Metrics For Your RTL

Improving the quality of RTL leads to more predictable design convergence and...

Taming Lint With Formal

Linting tools take advantage of fast and shallow analysis to provide quick fe...

The Engineering Career Blog (more)

Commercializing Technology

Once you develop the product, you have to be prepared to sell it.

A Tough Balancing Act

Should you focus on technology or customers?

Moving From Engineering To Management Or Staying On The Technical Track

The stigma of sticking to your technology roots is gone. So what's your next ...

The Traffic Cop (more)

Three Common SoC Power Management Myths

Approaching power management from the architectural design level.

NoC Versus PIN: Size Matters

Complexity and flexibility are the real drivers of fabric choice, not the num...

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations

Make vs. buy isn't as simple a decision as it might appear.

The Way IC It (more)

CSR In Semis

Giving back to the industry is a good thing—and something everyone should b...

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Stacking The Deck

Enabling 2.5D and 3D architecture and the supply chain.

Top Stories (more)

Tech Tackles Health Care

Academia, startups and technology giants are addressing health care through c...

Design Rule Complexity Rising

Total number of rules is exploding, but that's only part of the problem.

Searching For EUV Defects

What issues remain, and how they could affect manufacturing at 7/5nm.

Transcendental Specs (more)

It’s All In the Sequence

Whether dealing with SoCs or a disaster in space, determining the correct set...

Making Way For Register Specification Software

While more registers means more functionality and configurability, more is no...

The Ultimate Shift Left

Important observations from Einstein and New England's ice traders.

Uncategorized (more)

The Race To Accelerate

What's behind the buzz surrounding eFPGAs, and why now?

Building In Functional Safety At The Lowest Hardware Levels Supports Autonomous Driving’s Future

Adoption trends in current ADAS design blaze a trail for resilient, high-perf...

Week In Review: Design

Acquisitions; Intel security vulnerability; AI chip for health care.

Videos (more)

Tech Talk: Analog Simplified

Why it's so critical to speed up analog design across a broad swath of market...

Tech Talk: Electrical Overstress

How to plan for electrical overstress and aging at advanced nodes and in safe...

Tech Talk: 7/5/3nm Signoff

How to make sure that advanced node designs will work as planned.

Views From The Fringe (more)

A Semiconductor Approach To Desalination

A new growth market for a very good cause.

Quality And Safety In Automotive Electronics: Venturing beyond ISO-26262

For the automotive market, chips need to last a lot longer than they do in a ...

VoltEdge (more)

Power Shifts In Digital Chip Space

The front runner is Intel, and it’s uncertain if or when anyone will catch up.

Improved Efficiency

What’s ahead in power management techniques and why changes are needed.

Near-Threshold Computing

Operating near the level when transistors switch on an off can save lots of p...

Whitepapers (more)

Criticality of Wafer Edge Inspection and Metrology Data to All-Surface Defectivity Root Cause and Yield Analysis

Edge yield issues are a growing problem, but a cluster inspection platform co...

Modeling Semiconductor Process Variation

How to model cross wafer die-to-die variations using virtual fabrication.

The CryptoManager Root Of Trust

Implementing security by design.


See All Posts in »

Bus & Mark Channels


Knowledge Centers
Entities, people and technologies explored


  Trending Articles

What Happened To Nanoimprint Litho?

Next-gen lithography technology resurfaces for a variety of tasks.

Get Ready For Integrated Silicon Photonics

This more than Moore technology is still ramping up, and problems need to be solved, but it could lead to some fundamental changes.

When AI Goes Awry

So far there are no tools and no clear methodology to eliminating bugs. That would require understanding what an AI bug actually is.

Embedded Die Packaging Emerges

Why this technology approach is suddenly getting attention, and what hurdles still remain.

New Shifts In Automotive Design

How electric vehicles, autonomous driving and car sharing are impacting chip design.