category: Everything Low Power

category: IoT, Security & Automotive

Exploring The World Of Flash Memory: Serial, Dual, Quad, And Octal Interface
By Dharini Subashchandran - 08 Jun, 2023 - Comments: 0

By Dharini SubashChandran and Manoj Kachadiya In the world of digital data storage, flash memory has become an indispensable technology. Flash memory devices are non-volatile storage solutions that can retain data even without power. They are widely used in various applications, including smartphones, digital cameras, USB drives, and solid-state drives (SSDs). In this blog post, we will delv... » read more

High-Fidelity CFD Mesh Generation With Voronoi Diagram
By Veena Parthan - 11 May, 2023 - Comments: 0

We are attuned to the fact that the law of nature, or nature’s rule, drives various scientific phenomena. Humans often replicate naturally occurring phenomena to achieve a desirable outcome, similar to how scientists mimic photosynthesis to generate energy. Comparable is the case with Voronoi geometries. These geometries are widely seen in beehives, the structure of sponges, rock fragmentati... » read more

Printing Grids In 3D
By David Garlisch - 13 Apr, 2023 - Comments: 0

Those of you who attended the 2011 Pointwise User Group Meeting may remember that our company president, John Chawner, mentioned during his closing statements how nice it would be to have the ability to print your grids in 3D. That was more than just a dreamy, "what if" statement. It is a reality! Almost. A little history 3D-printed F-16 forward fuselage. I have always been fascinat... » read more

IEDM: Backside Power Delivery
By Paul McLellan - 09 Mar, 2023 - Comments: 0

One part of the short course that I attended at IEDM in December was about backside power delivery networks. It was presented by Gaspard Hiblot of imec and titled "Process Architectures Changes to Improve Power Delivery." The presentation is co-credited with Geert Hellings and Julien Ryckaert. I should preface this post with the fact that this presentation was 80 slides long and so I will only... » read more

Unified AI/ML Solution Helps Accelerate Verification Curve
By Anika Sunda - 09 Feb, 2023 - Comments: 0

With the surge in usage requirements and increasing customer demands, hardware design is quickly becoming more complex. The rapid change in market trends, with a greater focus on technologies such as electric vehicles, dictates the demand for efficient power management and high-performance processing. Verification throughput continues to be a bottleneck as SoC designs increase in size, and so d... » read more

Easing The CFD Engineer’s Life With Automated Meshing
By Veena Parthan - 12 Jan, 2023 - Comments: 0

Mesh generation is where the user’s expertise and ingenuity can influence the convergence and accuracy of a computational fluid dynamics (CFD) solution by selecting mesh type, topology, and cell quality. But with the rush to automate mesh generation, will the control be ripped out of the user’s hand, or will a valuable engineering skill be lost? The extent to which meshing can be automated... » read more

Advanced Auto-Routing For TSMC InFO Technologies
By Paul McLellan - 08 Dec, 2022 - Comments: 0

At the recent TSMC OIP Symposium, John Park presented 'Advanced Auto-Routing for TSMC InFO Technologies.' InFO stands for "integrated fanout" and is the lower performance, lower complexity technology for advanced packaging. For details of TSMC's whole packaging portfolio, see my post TSMC OIP: 3DFabric Alliance and 3Dblox. Here's the slide TSMC presented from that presentation on InFO. As you... » read more

EDPS: Transitioning From 5G To 6G
By Paul McLellan - 10 Nov, 2022 - Comments: 0

At the recent EDPS, the keynote on the second day was by Mallik Tatipamula. He is the CTO of Ericsson Silicon Valley and also has experience all over the telecom industry with stints at F5, Juniper Networks, Cisco, Motorola, Nortel, and the Indian Institute of Technology Madras. Mallik started with a potted history of mobile. You may already know all this, and I've covered my version ... » read more

Heterogeneous Integration Co-Design Won’t Be Easy
By Tom Beckley - 13 Oct, 2022 - Comments: 0

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless interaction between your analog and digital IC and package design teams. Heterogeneous integration is the use of advanced packaging technologies to combine smaller, discrete chiplets into one syste... » read more

Recipe To Catch Bugs Faster Using Machine Learning
By Anika Sunda - 19 Sep, 2022 - Comments: 0

We all agree that verification and debug take up a significant amount of time and are arguably the most challenging parts of chip development. Simulator performance has consistently topped the charts and is a critical component in the verification process. Still, the need of the hour is to stretch beyond simulator speed to achieve maximum verification throughput and efficiency. Artificial in... » read more

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