‘Speak No Evil’ And SoC Problems


In the first of this blog trilogy, 'Are you listening,' I looked at not waiting for hindsight to be wise after the event, instead make use of what’s available and act ahead of time. In the second, 'See no evil,' we bizarrely saw how Sir Francis Drake, Admiral Nelson and Clint Eastwood all had something in common with Mizaru, one of the 3 wise monkeys (Kikazaru and Iwazaru being the other two)... » read more

“See No Evil” Shouldn’t Apply To SoC Design


In the first part of this blog series, Talking Sense with Moortec…’Are you listening’, I looked at not waiting for hindsight to be wise after the event, instead make use of what’s available and act ahead of time. There’s a Japanese maxim, depicting three ‘wise’ monkeys… Kikazaru, Mizaru, and Iwazaru, better known as ‘hear no evil, see no evil and speak no evil’. If they we... » read more

Monitoring For In-Die Process Speed Detection


Chip designers working on advanced nodes typically include a fabric of sensors spread across the die for a number of very specific reasons. In this, the second of a three-part blog series, we explore some of the key applications and benefits of these types of sensing solutions. In this installment, the focus is In-Die Process Speed Detection and why understanding in-chip process speed detecti... » read more

Benefits Of In-Chip Thermal Sensing


The latest SoCs on advanced semiconductor nodes typically include a fabric of sensors spread across the die, and for good reason. But why and what are the benefits? This first blog of a three-part series explores some of the key applications for in-chip thermal sensing and why embedding in-chip monitoring IP is an essential step to maximize performance and reliability and minimize power, or a... » read more

Data Center Hyperscaling


As we move in to 2020 it’s clear that every sector of industry, including the semiconductor industry, will have a responsibility to address growing environmental concerns. We should be aware that as our sector underpins the growth in AI, 5G telecommunications, crypto-currency and high performance compute applications, it is predicted that by 2030 energy consumption attributable to data center... » read more

Avoiding Gloom With Better Knowledge


The rate of product development is facing very real challenges as the pace of silicon technology evolution begins to slow. Today, we are squeezing the most out of transistor physics, which is essentially derived from 60-year-old CMOS technology. To maintain the pace of Moore’s law, it is predicted that in 2030 we will need transistors to be a sixth of their current size. Reducing transistor s... » read more

The Future Of Embedded Monitoring, Part 1


Shall I compare thee to a…Rolls Royce jet engine? ‘There is a new era dawning whereby deeply embedded sensing within all technology will bring about great benefit for the reliability and performance of semiconductor-based products.’ These were my words during a presentation to an industry audience in China back in September 2015. During that same presentation, somewhat to the consterna... » read more

Verification Pilgrims Show A Historical Case For DFT


The Mayflower Steps, where the Pilgrims are believed to have embarked on their journey to America, are located in the beautiful Barbican area of Plymouth, a small town in the southwest of England. As the lone American working for Moortec, a British company based in Plymouth, I stood and stared at them this past September. Separated by a few yards of distance but 399 years of history I found my... » read more

Finding Hotspots In AI Chips


Things are getting far more complicated as we move down to 7nm & 5nm but the tolerances of some of the physical effects that we have been measuring in the past are much tighter than they were at the older nodes. How do we track all that? What we see is that as we descend through the advanced nodes, say from 16nm down to 12nm, 7nm and more recently 5nm, we see that gate density starts to ... » read more

How To Reduce Thermal Guard-Banding


Accuracy in temperature sensors can have a big impact in designs from 40nm down to 7nm and beyond, reducing the amount of guard-banding that is required, which in turn can lower the power and extend the life and reliability of components. But at these process geometries, not all sensors measure temperature equally. Thermal guard-banding is a very important consideration for design teams, and... » read more

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