category: Blogs – MD

category: IoT, Security & Automotive

Center For Deep Learning In Electronics Manufacturing: Bringing Deep Learning To Production For Photomask Manufacturing
By Jan Willis - 16 Nov, 2023 - Comments: 0

The Center for Deep Learning in Electronics Manufacturing (CDLe) was formed as an alliance between D2S, Mycronic and NuFlare Technology in autumn 2018. Assignees from each alliance partner worked with deep learning (DL) experts under the leadership of Ajay Baranwal, director of CDLe. The CDLe’s mission was to 1) turn DL into a core competency inside each of the companies and 2) do DL projects... » read more

Analysis Of BEOL Metal Schemes By Process Modeling
By Daebin Yim - 16 Nov, 2023 - Comments: 0

The semiconductor industry has been diligently searching for alternative metal line materials to replace the conventional copper dual damascene scheme, because as interconnect dimensions shrink, the barrier accounts for an increasing fraction of the total line volume. The barrier layer's dimensions cannot be scaled down as quickly as the metal line width (figure 1). Popular barrier materials su... » read more

Maximizing Edge Intelligence Requires More Than Computing
By Toshikazu Nishida - 16 Nov, 2023 - Comments: 0

By Toshi Nishida, Avik W. Ghosh, Swaminathan Rajaraman, and Mircea Stan Commercial-off-the-shelf (COTS) components have enabled a commodity market for Wi-Fi-connected appliances, consumer products, infrastructure, manufacturing, vehicles, and wearables. However, the vast majority of connected systems today are deployed at the edge of the network, near the end user or end application, opening... » read more

Transforming Semiconductor Manufacturing: How AI And ML Boost Productivity And Beat The Skill Shortage
By David Park - 16 Nov, 2023 - Comments: 0

In the fast-paced world of semiconductor manufacturing, where innovation and efficiency are essential, there is a serious challenge – the persistent skilled labor shortage. As evident by billboards looking for workers along major highways, this shortage is not just a concern but a pressing reality. Semiconductor manufacturers in the United States face a multifaceted problem—tightened... » read more

The Impact Of Channel Hole Profiles On Advanced 3D NAND Structures
By Qingpeng Wang - 19 Oct, 2023 - Comments: 0

In a two-tier 3D NAND structure, the upper and lower channel hole profile can be different, and this combination of different profiles leads to different top-down visible areas. The visible area is the key metric to determine whether the bottom SONO layer can be punched through and ensure that the bit cells connect to the common source line. Performing channel hole profile splits on a silicon w... » read more

Why Curvy Design Now? Less Change Than You Think And Manufacturable Today
By Jan Willis - 19 Oct, 2023 - Comments: 0

A curvilinear (curvy) chip, if magically made possible, would be smaller, faster, and use less power. Magic is no longer needed on the manufacturing side, as companies like Micron Technology are making photomasks with curvy shapes using state-of-the-art multi-beam mask writers today. Yet the entire chip-design infrastructure is based on the Manhattan assumption of 90-degree turns, even though i... » read more

Looking Forward To The New Chip Cycle
By Bob Smith - 19 Oct, 2023 - Comments: 0

Charles Shi, Principal and Senior Analyst at Needham & Company, LLC., remains upbeat about the EDA, IP and services business, or what SEMI refers to as the electronic system design (ESD) ecosystem. I recently spoke with Shi about his talk “Looking Forward to the New Chip Cycle” during the opening of the 2023 Design Automation Conference, collocated in July with SEMICON West in San Fra... » read more

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate
By SeokHo Na - 21 Sep, 2023 - Comments: 0

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and experiencing rapid growth. As most of these applications require high performance, single-die Flip Chip packages... » read more

Why Curvy Design Now? Manufacturing Is Possible And Scaling Needs It
By Jan Willis - 21 Sep, 2023 - Comments: 1

Have you ever seen roots or tree branches take a 90-degree turn? Have you ever seen a river that takes a 90-degree turn? Nature doesn’t do 90-degree turns, or for that matter any sharp angle turns – not even 135 degrees. Yet the entire chip-design infrastructure is based on the Manhattan assumption of 90-degree turns. While it would take time to change, is there any doubt that a curvilinea... » read more

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success
By Jessica Albright - 21 Sep, 2023 - Comments: 0

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or in aviation need to be fail-proof. A device smaller than a centimeter with features just a few nanometers has no margin of error. This blog shares why it’s important to detect materia... » read more

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