Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science


Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

The Next Generation Of Fingerprinting Technology


We used to think of fingerprinting as simply placing your finger on an ink pad and then rolling it on paper to obtain an identifiable mark that would distinguish you from everyone else on the planet. In today’s world, fingerprinting has evolved to take on another, broader definition. According to dictionary.com, fingerprinting can also mean “any unique or distinctive pattern that presents u... » read more

Prepare For Success With A Failure Mode And Effects Analysis And Control Plan


In order to proactively handle potential process or product errors before they occur in manufacturing or on a customer’s production line, many organizations implement a Failure Mode and Effects Analysis (FMEA) and Control Plan (CP). Used as a process tool by the US military as early as 1949, FMEAs and CPs have evolved and gained popularity in many industries ranging from automotive, to pharma... » read more

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers


Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for itself in the next generation of ultrathin wafer manufacturing. Semiconductor wafers are being forced to become thinner as the push to shrink feature sizes and introduce full-scale 3D integration ... » read more

Surface Modification: Solving Semiconductor Manufacturing Challenges


Process reliability and faster technology deployment are two of the most pressing manufacturing challenges currently facing the semiconductor industry. In a world of ever-evolving technology and innovation, engineers are working to transform materials that don’t possess all the desired functions through a method called “surface modification” – the act of modifying a material’s surface... » read more

The Problem With Spin-On Carbon Materials


In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes. A key challenge in selecting a suitable material is that some processes require a hig... » read more