Prepare For Success With A Failure Mode And Effects Analysis And Control Plan


In order to proactively handle potential process or product errors before they occur in manufacturing or on a customer’s production line, many organizations implement a Failure Mode and Effects Analysis (FMEA) and Control Plan (CP). Used as a process tool by the US military as early as 1949, FMEAs and CPs have evolved and gained popularity in many industries ranging from automotive, to pharma... » read more

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers


Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for itself in the next generation of ultrathin wafer manufacturing. Semiconductor wafers are being forced to become thinner as the push to shrink feature sizes and introduce full-scale 3D integration ... » read more

Surface Modification: Solving Semiconductor Manufacturing Challenges


Process reliability and faster technology deployment are two of the most pressing manufacturing challenges currently facing the semiconductor industry. In a world of ever-evolving technology and innovation, engineers are working to transform materials that don’t possess all the desired functions through a method called “surface modification” – the act of modifying a material’s surface... » read more

The Problem With Spin-On Carbon Materials


In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes. A key challenge in selecting a suitable material is that some processes require a hig... » read more