Supercomputers Are For Everyone


Our SerDes world tour continues. This past month, we demonstrated our 7nm 56G long-reach SerDes in Dallas and Israel. In Dallas, our demonstration included error-free operation in 56G PAM4 over a 30dB channel without forward error correction through an eye-popping five-meter cable. Many thanks to our partner Samtec for providing that cable, allowing backplane designers to now “reach beyond th... » read more

High-Speed Serial Comms: Getting There Is Half The Fun


Last month I wrote about our 56G SerDes announcement – silicon validated and running in Rome at a major show. We had a great time at that show and got a lot of compliments about the quality and flexibility of our SerDes. These kinds of unfiltered, unsolicited customer comments are really what makes it all worthwhile. It was a gratifying and exciting time. This month, we’re at it again. O... » read more

56G 7nm SerDes: Eyewitness Account


High-performance SerDes represents critical enabling technology for advanced ASICs. This star IP block finds application in many networking and switching designs as well as other high-performance applications. So, when a new high-performance SerDes block hits the streets, it’s real news. eSilicon has been enjoying the spotlight on such an event. We recently announced silicon validation of our... » read more

Technical Conferences: The Insurmountable Opportunity


As a technology marketeer, I’m always looking for high-leverage events to promote our brand and gain visibility for new products and services. Let’s face it, this is the main benefit for attending a technical conference or a trade show. While the dream might be 40+ leads that are well-qualified and closable in the quarter, the reality is more of a long-game kind of strategy. For years, t... » read more

FinFET ASICs: It Takes A Platform


Sophisticated, specialized ASIC technology is making an impact on the everyday world around us. Whether it’s a gadget you can have a conversation with, a car that will take over driving from time to time, or internet speeds that seem impossibly fast, there is likely sophisticated custom silicon present as a critical enabling technology. Plenty has been written about advanced ASICs for network... » read more

Deep Learning And The Future


Following up from my last post on our deep learning event at the Computer History Museum – “ASICs Unlock Deep Learning Innovation,” I’d like to take a glimpse into the future. Like many such discussions, it’s often useful to take a look back first to try and make sense out of what is to come.  That’s essentlially what our keynote speaker, Ty Garibay, did at the event. Ty is the CTO... » read more

Deep Learning Market Forces


Last week, eSilicon participated in a deep learning event at the Computer History Museum – “ASICs Unlock Deep Learning Innovation.” Along with Samsung, Amkor Technology and Northwest Logic, we explored how our respective companies form an ecosystem to develop deep learning chips for the next generation of applications. We also had a keynote presentation on deep learning from Ty Garibay, C... » read more

Deconstructing Deep Learning


I discuss AI and deep learning a lot these days. The discussion usually comes back to “what is a deep learning chip?” These devices are basically hardware implementations of neural networks. While neural nets have been around for a while, what’s new is the performance advanced semiconductor technology brings to the party. Applications that function in real time are now possible. But wh... » read more

In Case You Missed It


We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

What’s Next?


We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic ... » read more

← Older posts