category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Eyes On Zero Defects: Defect Detection And Characterization Metrology
By Darin Collins - 21 Jan, 2021 - Comments: 0

By Darin Collins and Jessica Albright Metrology is the science of measuring, characterizing, and analyzing materials. Within metrology, there are several technologies used to detect material defects on a very small scale – precision on the scale of parts per trillion or less is necessary in the pursuit of zero defects. We broadly define our characterization approach into three main categor... » read more

48V Applications Drive Power IC Package Options
By Bill Schweber - 21 Jan, 2021 - Comments: 1

The manufacturing process and die get most of the attention, but the packaging plays an important part in enabling and limiting performance, manufacturability, particularly when it comes to reliability of power devices. Given the wide range of underlying semiconductor power-device technologies — “basic” silicon, wide-bandgap silicon carbide (SiC) and gallium nitride (GaN), power levels... » read more

Mobility And 5G Drive Adoption Of New Materials For Power Devices
By Serena Brischetto - 21 Jan, 2021 - Comments: 0

Electric mobility, renewable energy, and other technology innovations like IoT, 5G, smart manufacturing, and robotics all require reliability, efficiency, and compact power systems, fueling the adoption of silicon carbide (SiC) and gallium nitride (GaN) to support lower voltages in significantly smaller devices. But chip designers must overcome the technological and economical challenges of int... » read more

Stronger, Better Bonding In Advanced Packaging
By Katherine Derbyshire - 21 Jan, 2021 - Comments: 1

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less practical. In thermocompression bonding, protruding copper bumps bond to pads on the underlying substrate. In hybrid bonding, copper pads are inlaid in a dielectric, reducing the risk of oxidation. ... » read more

A Triple-Deck CFET Structure With An Integrated SRAM Cell For The 2nm Technology Node And Beyond
By Coventor - 20 Jan, 2021 - Comments: 0

A novel triple-deck CFET structure is proposed for the first time as a candidate for area scaling. The proposed triple-deck CFET aggressively stacks a pass gate over an inverter to form a half SRAM bit cell. The integration flow and full metal connectivity have been carefully designed for functionality and array assembly. Most of the pitch used in the process is around 40nm, which is patternabl... » read more

Manufacturing Bits: Jan. 19
By Mark LaPedus - 19 Jan, 2021 - Comments: 0

X-ray imaging with AI The U.S. Department of Energy’s Argonne National Laboratory has demonstrated the use of artificial intelligence (AI) to accelerate the process of reconstructing images from coherent X-ray scattering data. Argonne’s technology, called PtychoNN, combines an X-ray imaging technique called ptychography with a neural network. This in turn enables researchers to decode X... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Jan, 2021 - Comments: 0

Chipmakers and OEMs Intel has appointed Pat Gelsinger as its new chief executive, effective Feb. 15. Gelsinger will also join Intel’s board upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15. Most recently, Gelsinger served as the CEO of VMware since 2012. He also spent 30 years at Intel, becoming the company’s first chief technology officer. The move fo... » read more

Solution-processable integrated CMOS circuits based on colloidal CuInSe2 quantum dots
By Technical Paper Link - 11 Jan, 2021 - Comments: 0

Researchers at Los Alamos National Laboratory and University of California Irvine used quantum dots to create transistors which can be assembled into functional logic circuits. “Potential applications of the new approach to electronic devices based on non-toxic quantum dots include printable circuits, flexible displays, lab-on-a-chip diagnostics, wearable devices, medical testing, smart im... » read more

Manufacturing Bits: Jan. 11
By Mark LaPedus - 11 Jan, 2021 - Comments: 0

3D printing with liquids Martin Luther University Halle-Wittenberg (MLU) has developed a way to combine both materials and liquids in 3D printing applications. Researchers from MLU have developed liquid‐filled capsules using 3D printing technology. This in turn enables new medical agents to be incorporated into pharmaceutical products. It also allows liquids to be integrated into material... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

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