Research Bits: Feb. 6


Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Chip Industry Technical Paper Roundup: Feb. 6


New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

Research Bits: Jan. 30


Etching tellurite glass Physicists from EPFL and Tokyo Tech propose a way to create photoconductive circuits, where the circuit is directly patterned onto a tellurite glass surface with femtosecond laser light. The exposure formed nanoscale tellurium and tellurium oxide crystals, both semiconducting materials. “Tellurium being semiconducting, based on this finding we wondered if it would ... » read more

Research Bits: Jan. 23


Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Chip Industry Technical Paper Roundup: Jan. 23


New technical papers added to Semiconductor Engineering’s library this week. [table id=189 /] More ReadingTechnical Paper Library home » read more

Research Bits: Jan. 16


3D stacking of 2D materials Researchers from Penn State University demonstrated monolithic 3D integration with 2D transistors made from 2D semiconductors called transition metal dichalcogenides. The 2D materials have unique electronic and optical properties, including sensitivity to light, making them ideal for use as sensors. “One challenge is the process temperature ceiling of 450 degre... » read more

Chip Industry Technical Paper Roundup: Jan. 16


New technical papers added to Semiconductor Engineering’s library this week. [table id=188 /] More ReadingTechnical Paper Library home » read more

Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Research Bits: Jan. 8


High mobility graphene Researchers at the Georgia Institute of Technology and Tianjin University created a functional semiconductor made from graphene that is compatible with conventional microelectronics processing methods. "We now have an extremely robust graphene semiconductor with 10 times the mobility of silicon, and which also has unique properties not available in silicon," said Walt... » read more

Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

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