category: Uncategorized

category: IoT, Security & Automotive

Vertical MoS2 transistors with sub-1-nm gate lengths
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract "Ultra-scaled transistors are of interest in the development of next-generation electronic devices. Although atomically thin molybdenum disulfide (MoS2) transistors have been reported, the fabrication of devices with gate lengths below 1 nm has been challenging. Here we demonstrate side-wall MoS2 transistors with an atomically thin channel and a physical gate length of sub-1 nm ... » read more

Advances in Logic Locking: Past, Present, and Prospects
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract: "Logic locking is a design concealment mechanism for protecting the IPs integrated into modern System-on-Chip (SoC) architectures from a wide range of hardware security threats at the IC manufacturing supply chain. Logic locking primarily helps the designer to protect the IPs against reverse engineering, IP piracy, overproduction, and unauthorized activation. For more than a decade,... » read more

Hardware Root of Trust: Everything You Need To Know
By Rambus - 05 Jan, 2022 - Comments: 0

As explained in our “Secure Silicon IP Webinar Series“, a root of trust is the security foundation for an SoC, other semiconductor device or electronic system. However, its meaning differs depending on who you ask. For example, the hardware root of trust contains the keys for cryptographic functions and is usually a part of the secure boot process providing the foundation for the software c... » read more

A Novel Multifunctional Single-Layer Adhesive Used For Both Temporary Bonding And Mechanical Debonding in Wafer-Level Packaging Applications
By Brewer Science - 15 Dec, 2021 - Comments: 0

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out integration, and 2.5D and 3D integration using through-silicon vias (TSVs). The materials used to achieve TB and DB are extremely critical and the industry's current best practice is the use of tw... » read more

VLSI Design Careers
By Sivakumar P R - 08 Nov, 2021 - Comments: 0

If you're planning your career in the semiconductor industry, make sure you consider processor design. Now the aspiring VLSI engineers like you can implement the open-source processor RISC-V while learning from the textbooks. But why should a VLSI engineer understand the processor design? Does everyone implement the processor as an RTL designer? In this article, I will address these question... » read more

Dual Surface Architectonics for Directed Self‐Assembly of Ultrahigh‐Resolution Electronics
By Technical Paper Link - 11 Oct, 2021 - Comments: 0

Abstract: "The directed self‐assembly of electronic circuits using functional metallic inks has attracted intensive attention because of its high compatibility with extensive applications ranging from soft printed circuits to wearable devices. However, the typical resolution of conventional self‐assembly technologies is not sufficient for practical applications in the rapidly evolving addi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 09 Jul, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back The IoT designer Deed designed a screenless health monitor, worn on the wrist, that uses IoT (Internet of Things) building blocks from Infineon Technologies. The Get bracelet interprets hand gestures for making payments, picking up phone calls, turning up or down audio, while it also takes health data and biometrics. The system us... » read more

PF-DRAM: A Precharge-Free DRAM Structure
By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Authors: Nezam Rohbani † (IPM); Sina Darabii § (Sharif); Hamid Sarbazi-Azad † i §(Sharif / IPM): † School of Computer Science, Institute for Research in Fundamental Sciences (IPM), Tehran, Iran § Department of Computer Engineering, Sharif University of Technology, Tehran, Iran Abstract: "Although DRAM capacity and bandwidth have increased sharply by the advances in technology ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Jul, 2021 - Comments: 0

Security The U.S. government agencies put out a warning that Russian military has been using a Kubernetes cluster to attempt distributed and anonymized brute force access against hundreds of government and private sector targets worldwide. Department of Homeland Security (DHS)’s Cybersecurity and Infrastructure Security Agency (CISA), the Federal Bureau of Investigation (FBI), the National S... » read more

Graphene and two-dimensional materials for silicon technology
By Technical Paper Link - 02 Oct, 2020 - Comments: 1

Abstract: "The development of silicon semiconductor technology has produced breakthroughs in electronics—from the microprocessor in the late 1960s to early 1970s, to automation, computers and smartphones—by downscaling the physical size of devices and wires to the nanometre regime. Now, graphene and related two-dimensional (2D) materials offer prospects of unprecedented advances in device ... » read more

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