Fast-Charging Technology: The Key To Speeding Electric Vehicle Adoption


As the EV market continues to grow and expand, the demand for fast chargers will continue to soar, and the space, efficiency, and system cost gains provided by SiC in various applications will become an increasingly important advantage. Click here to read more. » read more

Thin Film Characterization For Advanced Patterning


Authors: Zhimin Zhu; Xianggui Ye; Sean Simmons; Catherine Frank; Tim Limmer; James Lamb Brewer Science, Inc. (United States) A variable-angle spectroscopic ellipsometer (VASE) is an essential tool for measuring the thickness of a thin film, as well as its n and k optical parameters. However, for films thinner than 10 nm, precise measurement is very challenging. In this paper, the root cause... » read more

Machine Learning At The Edge


Moving machine learning to the edge has critical requirements on power and performance. Using off-the-shelf solutions is not practical. CPUs are too slow, GPUs/TPUs are expensive and consume too much power, and even generic machine learning accelerators can be overbuilt and are not optimal for power. In this paper, learn about creating new power/memory efficient hardware architectures to meet n... » read more

A Sneak Peek Into SVE And VLA Programming


Download this white paper to get an overview of SVE, get information on the new registers and the new instructions, and learn about the Vector Length Agnostic (VLA) programming technique, including some examples. The Scalable Vector Extension (SVE) is an extension of the ARMv8-A A64 instruction set, recently announced by ARM. Following the announcement at Hot Chips 28, a few articles describ... » read more

Manufacturing Speed And Agility Enabled By Turnkey HPC Solutions


Manufacturers face growing competition as new players enter the global market all the time. To stay ahead of rivals, they increasingly rely on digital modeling and simulation tools for product design, analysis and testing with the help of HPC and CAE. So how is HPC enabling innovation for manufacturers from small to large? This white paper covers: Using HPC to accelerate product develo... » read more

5G And AI Raise Security Risks For IoT Devices


This IDC Technology Spotlight, sponsored by Rambus, highlights the fifth generation of cellular network technology (5G) is scaling further in 2020, enabling a new wave of AI-powered end points. To remain competitive, manufacturers must implement enhanced security measures on edge and IoT devices designed for the increased performance in speed, latency, and connection density. Click here to r... » read more

System-Level Electro-Thermal Analysis of RDS(ON) for Power MOSFET


Authors: Rajen Murugan1, Nathan Ai2, and C.T. Kao2 1 Texas Instruments, Inc., Dallas, Texas, 75044, USA 2 Cadence Design Systems, Santa Clara, California, USA A coupled-electro-thermal RDS(ON) (drain to source ON resistance) co-analysis methodology for Power MOSFET is proposed. The methodology contains two functional modules: 1) physical field solvers and 2) equivalent circuit/network so... » read more

Testing Embedded MRAM IP For SoCs


The challenges of embedded memory test and repair are well known, including maximizing fault coverage to prevent test escapes and using spare elements to maximize manufacturing yield. With the surge in availability of promising non-volatile memory architectures to augment and potentially replace traditional volatile memories, a new set of SoC level memory test and repair challenges are emerging... » read more

AI Chip DFT Techniques For Aggressive Time-To-Market


AI chips have aggressive time-to-market goals. Designers can shave significant time off of DFT and silicon bring up using the techniques described in this paper. Leading AI semiconductor companies have already had success with Tessent DFT tools. To read more, click here. » read more

Improving Wafer-Level S-Parameters Measurement Accuracy And Stability With Probe-Tip Power Calibration Up To 110 GHz For 5G Applications


Author: Choon Beng Sia, FormFactor Inc., Singapore Demands for mission critical wireless services such as autonomous driving and telehealth require higher data transfer rates and lower latencies. Such applications are now driving the use of radio frequencies (RF) at 28, 38, 60 and 73 GHz for the emerging 5G mobile communication systems. Waferlevel RF measurements of devices or circuits for 5... » read more

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